| Patent application number | Description | Published |
| 20100262540 | ELECTRONIC SETTLEMENT SYSTEM, ELECTRONIC SETTLEMENT METHOD AND CASH PAYING METHOD USING LCD BARCODE DISPLAYED ON MOBILE TERMINAL - Disclosed are an electronic settlement system, an electronic settlement method, and a cash payment method using a barcode displayed on a mobile terminal, thereby simply performing member identification using the barcode including member information, electronic settlement services (such as credit card settlement, direct payment card settlement, advance payment card settlement, small amount settlement, and Giro system settlement) at various shops via a procedure verifying whether a user is an actual owner of the barcode, cash payment services via member information barcode and member identification procedures, advance payment card services by depositing a designated amount of money at a database of the bank and allowing the user to systematically use the advance card within the deposited money, and wireless banking services for transmitting and receiving various banking related data via wireless network between the bank and the members. | 10-14-2010 |
| 20100262543 | ELECTRONIC SETTLEMENT SYSTEM, ELECTRONIC SETTLEMENT METHOD AND CASH PAYING METHOD USING LCD BARCODE DISPLAYED ON MOBILE TERMINAL - Disclosed are an electronic settlement system, an electronic settlement method, and a cash payment method using a barcode displayed on a mobile terminal, thereby performing member identification using the barcode including member information, electronic settlement services (such as credit card settlement, direct payment card settlement, advance payment card settlement, small amount settlement, and Giro system settlement) at various shops via a procedure verifying whether a user is an actual owner of the barcode, cash payment services via member information barcode and member identification procedures, advance payment card services by depositing a designated amount of money at a database of the bank and allowing the user to systematically use the advance card within the deposited money, and wireless banking services for transmitting and receiving various banking related data via wireless network between the bank and the members. | 10-14-2010 |
| Patent application number | Description | Published |
| 20090060116 | FUEL ROD OF NUCLEAR FUEL ASSEMBLY HAVING VASE-LIKE COMPRESSION SPRING ADAPTED TO INCREASE INTERNAL VOLUME THEREOF - The present invention relates to a fuel rod of a nuclear fuel assembly having a vase-like compression spring adapted to increase the internal volume thereof wherein when the vase-like compression spring is inserted into a cladding tube, it has a relatively smaller volume occupied inside the fuel rod when compared with the existing coil type compression spring, such that the vase-like compression spring can ensure a sufficient space portion receiving the fission gases generated during the operation of the fuel rod, thereby increasing the burn-up performance of the fuel rod and the mechanical integrity thereof. | 03-05-2009 |
| 20090122947 | Joining Structure Between Top Nozzle and Guide Thimbles In Nuclear Fuel Assembly - Disclosed herein is a joining structure between a top nozzle and guide thimbles in a nuclear fuel assembly, which can prevent a rotation of inner insertion tube bodies when the top nozzle is separated from the nuclear fuel assembly and promote convenience in assembling and disassembling the top nozzle and the guide thimbles. | 05-14-2009 |
| 20100098208 | Anti-fretting Wear Spacer Grid With Canoe-Shaped Spring - The present invention relates to an anti-fretting wear spacer grid having a plurality of canoe-shaped springs formed thereon, wherein each of the canoe-shaped springs includes: a fuel rod-contacting part having a flat surface having a predetermined longitudinal length so as to have linear contact with the fuel rod; a curved face-connecting part formed on the upper and lower portions of the fuel rod-contacting part; a leg-connecting part formed on the end portion of the curved face-connecting part; and legs each being formed of a plate shape having a predetermined length and connecting the both sides of the leg-connecting part with one unit grid cell surface. | 04-22-2010 |
| 20100166134 | Top Nozzle Having On-Off Type Of Hold-Down Spring In Nuclear Fuel Assembly - The present invention relates to a top nozzle having on-off type of hold-down springs for a nuclear fuel assembly that has a two-stage elastic section such that a pushing force against the axial movement of the nuclear fuel assembly under normal conditions is optimized and at the same time a suppressing force against a drastic uplifting force of the nuclear fuel assembly under transient conditions is strengthened, and that lowers the elastic coefficients of the springs operating under normal conditions more than those of existing coil springs, thereby providing an optimal pushing force against the nuclear fuel assembly. | 07-01-2010 |
| Patent application number | Description | Published |
| 20090040123 | FREQUENCY RECONFIGURATION ARRAY ANTENNA AND ARRAY DISTANCE CONTROL METHOD - A frequency reconfiguration array antenna includes a first metal plate, and a first antenna element formed on the first metal plate and reconfiguring a frequency. An array antenna includes a second metal plate and a second antenna element formed on the second metal plate and reconfiguring a frequency. Further, the array antenna includes a connection plate being bent to connect the first metal plate and the second metal plate, and being bent to change the distance between the first metal plate and the second metal plate according to the frequency of the first and second antenna elements. | 02-12-2009 |
| 20090061921 | BASE STATION TRANSMITTING AND RECEIVING ANTENNA AND CONTROL METHOD THEREOF - The present invention relates to base station transmitting and receiving antennas and control methods thereof. For this purpose, the present invention provides a control method of a base station transmitting antenna. The control method includes collecting positional information and transmission level values of all terminals in a cell; analyzing statistics of cell traffic using the positional information and transmission level values, and generating antenna radiation patterns on the basis of the analyzed statistics result; optimizing the antenna radiation patterns by synthesizing beam patterns; and changing antenna beam patterns according to the optimized antenna radiation patterns. According to embodiments of the present invention, it is possible to increase a channel capacity in a cell, ensure the QoS in all terminals in the cell, and reduce installation and operation costs of a base station system. | 03-05-2009 |
| 20090066601 | CROSS DIPOLE, CROSS DIPOLE MODULE, ARRAY ANTENNA, AND MULTIPLE INPUT MULTIPLE OUTPUT ANTENNA - The present invention relates to a cross dipole including a plurality of dipole elements respectively corresponding to a plurality of frequency bands and reconfiguring the plurality of frequency bands. A cross dipole module includes a circuit for controlling a signal of the cross dipole according the cross dipole and an external control signal. An array antenna includes a plurality of cross dipole modules arranged in one dimension or two dimensions. A multiple input multiple output antenna includes a plurality of array antennas for independently operating and an indoor supporting system for respectively applying a control signal to the plurality of array antennas, and reconfigures a distance between the neighboring array antennas. | 03-12-2009 |
| 20090096707 | ANTENNA ELEMENT AND FREQUENCY RECONFIGURATION ARRAY ANTENNA USING THE ANTENNA ELEMENT - A frequency reconfiguration array antenna includes a metal plate and a plurality of antenna elements. The antenna element includes a plurality of radiators and at least one switch for connecting the radiators, and a gain of at least one frequency bandwidth from among the plurality of frequency bandwidths reconfigured by the antenna elements is higher than gains of other frequency bandwidths. | 04-16-2009 |
| 20090160701 | APPARATUS FOR IDENTIFYING TARGET SATELLITE IN SATELLITE COMMUNICATION ANTENNA AND METHOD THEREOF - Provided is an apparatus and method for identifying a target satellite in a satellite communication antenna. The apparatus includes: a power splitting unit for splitting a signal inputted through the satellite communication antenna to more than two signals; a tuner unit for receiving the split signals from the power splitting unit and passing only signal of a predetermined channel frequency band; an analog-to-digital converting unit for converting each of signal intensities passed in the tuner unit to a digital value; and a controlling and identifying unit for determining whether a satellite traced by the satellite communication antenna is a target satellite using each of the signal intensities of the predetermined channel frequency band inputted from the A/D converting means, and controlling an orientation direction of the satellite communication antenna. | 06-25-2009 |
| 20110028110 | RECONFIGURABLE HYBRID ANTENA DEVICE - The present invention relates to a reconfigurable hybrid antenna device. According to the present invention, the reconfigurable hybrid antenna device includes a reflective plate that reflects an incident signal and a reconfigurable power supply arrangement that includes one or more element antennas for supplying power to the reflective plate. The reconfigurable power supply arrangement has characteristics of electrical reconfiguration and physical reconfiguration of the element antennas, and reconfiguration of changing a range of radiation of signal powers radiated from the element antennas. With these characteristics of reconfiguration, it is possible to simultaneously or independently provide a plurality of mobile communication services physically using one antenna, such that it is possible to have an economical base station antenna and considerably reduce the number of temporary base stations, thereby reducing the maintenance cost of base stations. | 02-03-2011 |
| 20110148706 | ANTENNA WITH CONTROLLED SIDELOBE CHARACTERISTICS - An antenna with controlled sidelobe characteristics includes: a power coupler configured to receive a signal to be transmitted and generate and output a main channel signal and an auxiliary channel signal; a main channel power distributor configured to receive the outputted main channel signal and distribute power of the main channel signal; a main antenna configured to receive the power-distributed signal, the main antenna including a one-dimensional or two-dimensional array of a number of antenna elements; a vector signal controller configured to control amplitude and phase of the auxiliary channel signal; an auxiliary channel power distributor configured to receive the controlled amplitude and phase of the auxiliary channel signal and distribute power of the auxiliary channel signal; and an auxiliary antenna independently installed separate from the main antenna, the auxiliary antenna including an antenna element or an array of a number of antennas. | 06-23-2011 |
| 20110181490 | ARTIFICIAL MAGNETIC CONDUCTOR - An artificial magnetic conductor includes a conductor layer, a ground layer, and a via. The conductor layer is formed in a first direction and includes a plurality of grid cells. The ground layer is formed in a second direction that is opposite to the first direction and generates a lower frequency than that of an artificial magnetic conductor including a plurality of grid cells having the same size as that of the plurality of grid cells of the conductor layer and a conductor plate having a form that is not modified. The via is formed between the conductor layer and the ground layer to electrically connect the conductor layer and the ground layer. | 07-28-2011 |
| Patent application number | Description | Published |
| 20110201844 | CATALYST COMPOSITION FOR HYDROFORMYLATION AND METHOD FOR PRODUCING ALDEHYDE USING THE SAME - The present invention relates to a catalyst composition for hydroformylation and a method for preparing aldehydes using the same, wherein the catalyst composition for hydroformylation comprises: a triaryl phosphine ligand; a phosphine oxide or phosphine sulfide ligand having a specific chemical formula; and a transition metal catalyst. The catalyst composition provides high catalyst activity and stability and selectivity to normal aldehydes when used in the hydroformylation for preparing aldehydes from olefins. | 08-18-2011 |
| 20110282108 | APPARATUS FOR PRODUCING ALCOHOLS FROM OLEFINS - The present invention relates to an apparatus for producing alcohols from olefins, comprising: a hydroformylation reactor wherein aldehydes are produced from olefins; a catalyst/aldehydes separator; a hydrogenation reactor wherein the aldehydes are hydrogenated to produce alcohols; and a distillation column. The hydroformylation reactor is equipped with a distributor plate, which has a broad contact surface for providing sufficient reaction area for reactants such as olefins and synthesis gas, and allows the reaction mixture to circulate and mix sufficiently, which contribute to excellent efficiency in terms of production of aldehydes. In addition, the hydrogenation reactor suppresses sub-reactions to improve the production yield of alcohols. | 11-17-2011 |
| 20120059195 | CATALYST COMPOSITION FOR HYDROFORMYLATION REACTION AND HYDROFORMYLATION PROCESS USING THE SAME - The present invention relates to a catalyst composition for hydroformylation reaction and a hydroformylation process using the same. In the hydroformylation process using the catalyst composition according to the present invention, increased catalytic stability and high catalytic activity can be obtained, and the selectivity of iso-aldehyde produced can be desirably controlled. | 03-08-2012 |
| Patent application number | Description | Published |
| 20090261481 | WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME - Provided are a wafer level package in which a communication line can be readily formed between an internal device and the outside of the package, and a method of fabricating the wafer level package. The wafer level package includes a first substrate having a cavity in which a first internal device is disposed, an Input/Output (I/O) pad formed on the first substrate and electrically connected with the first internal device, a second substrate disposed over the first substrate and from which a part corresponding to the I/O pad is removed, and a solder bonding the first and second substrates. According to the wafer level package and the method of fabricating the same, upper and lower substrates are sawed to different cutting widths, or a hole is formed in the upper substrate, such that a communication line of an internal device can be readily formed without a via process which penetrates a substrate. Therefore, in comparison with a conventional wafer level package fabricated using the via process, it is possible to simplify a fabrication process and reduce production cost. | 10-22-2009 |
| 20100006625 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME - Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture. | 01-14-2010 |
| 20100320596 | METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME - Provided is a method for fabricating semiconductor package and a semiconductor package fabricated using the same. The method for fabricating semiconductor package dopes a mixture including the polymer material and the solder particle on the substrate in which the terminal is formed and applies heat, and thus the solder particle flows (or diffuses) toward the terminal in the heated polymer resin to adhere to the exposed surface of the terminal, i.e., the side surface and upper surface of the terminal, thereby forming the solder layer. The solder layer improves the adhesive strength between the terminal of the semiconductor chip and the terminal of the substrate in the subsequent flip chip bonding process. | 12-23-2010 |
| 20110018670 | ELECTRONIC DEVICE INCLUDING LTCC INDUCTOR - Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet. | 01-27-2011 |
| 20110050499 | SENSING DEVICE HAVING MULTI BEAM ANTENNA ARRAY - Provided is a sensing device having a multi beam antenna array. The sensing device includes an antenna array including a plurality of antennas, a plurality of low noise amplifiers respectively connected to the antennas to amplify radio frequency signals received from the respective antennas, a delay line box including a plurality of delay lines, each delay line delaying the signals amplified by the low noise amplifiers for a predetermined time, and a detector detecting the output signals of the delay ling box. | 03-03-2011 |
| 20110089577 | METHOD AND STRUCTURE FOR BONDING FLIP CHIP - Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes. | 04-21-2011 |
| 20110227228 | FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE - Provided is a filling composition. The filling composition includes: a first particle including Cu and/or Ag; a second particle electrically connecting the first particles; and a resin containing a high molecular compound, a hardener, and a reducer, in which the first and second particles are dispersed, wherein the hardener includes amine and/or anhydride, and the reducer includes carboxyl. | 09-22-2011 |