Patent application number | Description | Published |
20110127880 | REACTIVE NETWORKS TO REDUCE ACOUSTIC NOISE AND ENSURE MAXIMUM EFFICIENCIES IN DRIVING PIEZOELECTRIC ELEMENTS IN HAPTIC APPLICATIONS - A device and method are provided to drive piezoelectric elements in haptic applications. In one embodiment, a pattern generator provides user programmable PWM waveforms to a driver. The load of the driver is an inductor in series with the piezoelectric element. The filtration of the inductor in series with the capacitance of the piezoelectric element suppresses the high-frequency components of the PWM pulse train, and recovers a value commensurate with the duty cycle of the PWM pulse train. The resulting waveform across the piezoelectric element is converted to physical motion, thereby creating a haptic effect on a user interface. Advantageously, there is reduced power loss, reduced switching induced noise, and a more haptic rich environment. | 06-02-2011 |
20120229264 | SMART LINEAR RESONANT ACTUATOR CONTROL - The present invention provides a haptics control system that may include a driver to generate a continuous drive signal and to output the drive signal to a mechanical system on an electrical signal line, wherein the continuous drive signal causes the mechanical system to vibrate to produce a haptic effect. The haptics control system may further include a monitor, coupled to the electrical signal line, to capture a Back Electromotive Force (BEMF) signal generated by the mechanical system in the electrical signal line, to measure a BEMF signals attribute, and to transmit an adjustment signal to the driver based on the BEMF signals attribute. The driver is further configured to adjust the continuous drive signal according to the adjustment signal. | 09-13-2012 |
20140026649 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 01-30-2014 |
20140034104 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 02-06-2014 |
20140035630 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 02-06-2014 |
20140175524 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 06-26-2014 |
20140175600 | VERTICALLY INTEGRATED SYSTEMS - Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer. | 06-26-2014 |
20140217945 | CONTROL TECHNIQUES FOR MOTOR DRIVEN SYSTEMS UTILIZING BACK-EMF MEASUREMENT TECHNIQUES - A method and apparatus for automatic resonance detection is disclosed for a motor-driven mechanical system such as a voice coil motor (VCM) in which a resonance detector and driver are provided. The automatic resonance detector may be implemented on the same integrated circuit as the driver, and dynamically determines the natural resonant frequency of the VCM driven by the driver. The resonant frequency is determined by measuring the back electromotive force (BEMF) of the VCM, detecting the slope of the BEMF signal, and determining the resonant frequency from the slope of the BEMF signal. | 08-07-2014 |