Enna

Genichirou Enna, Tokyo JP

Patent application number	Description	Published
20100286344	CURABLE COMPOSITION - To provide a curable composition comprising a polymer having a reactive silicon group as a curing component, containing no or substantially no organic metal compound, and having a high curing rate.	11-11-2010

Patent application number	Description	Published
20080262143	ROOM-TEMPERATURE-CURABLE COMPOSITION - To provide a room-temperature-curable composition which comprises an oxyalkylene polymer containing hydrolyzable silicon groups, which has ensured working time and curing rate required for operation, and which can provide a cured article having good tensile properties.	10-23-2008
20080269392	CURABLE COMPOSITION - To provide a hardly colored curable composition having an excellent storage stability while maintaining fast curing properties.	10-30-2008
20090118411	METHOD FOR PRODUCING OXYALKYLENE POLYMER AND CURABLE COMPOSITION - To provide a curable composition excellent in storage stability.	05-07-2009
20090124765	POLYMER COMPOSITION - To provide a polymer composition whereby the viscosity increase during storage can be suppressed low.	05-14-2009
20090163662	CURABLE COMPOSITION - To provide a curable composition which has a high curing rate and can provide a cured product having good durability.	06-25-2009

Patent application number	Description	Published
20100004393	Polyolefin polymer containing vinyl groups at both ends and composition thereof - The present invention is a polyolefin polymer containing vinyl groups at both ends thereof, and a composition and a molded product containing the polymer, wherein the polymer contains a constitutional unit derived from at least one selected from the group consisting of ethylene (a), an α-olefin (b) having 3 to 20 carbon atoms, and a cyclic olefin (c), and	01-07-2010