| Patent application number | Description | Published |
|---|
| 20090275382 | METHOD FOR INTERACTING A DISPLAY WITH MECHANICAL REELS - Various methods for interacting with mechanical reels via a video screen are disclosed. In one embodiment, the method comprises providing a gaming machine having one or more mechanical reels positioned behind a video screen, wherein the video screen includes a touch screen and user interface for receiving user input. The mechanical reels spin and generate a game outcome, visible to the player through a video screen. A request is received, via the user interface, to rearrange the placement order of the mechanical reels, and the rearranged order of the mechanical reels is displayed on the video screen. | 11-05-2009 |
| 20090275383 | MECHANICAL REELS WITH INTERACTIVE DISPLAY - Systems for enhancing a mechanical reel game are disclosed. In one embodiment, the gaming machine includes a video screen having a touch screen, and a set of mechanical reels positioned behind the video screen. A user interface is displayed on the video screen and is configured to receive user input to rearrange the placement order of the mechanical reels. The video screen then displays the mechanical reels in the rearranged order. | 11-05-2009 |
| 20090275386 | MECHANICAL REELS WITH INTERACTIVE DISPLAY AND RELATED METHODS - Methods for enhancing a mechanical reel game are disclosed. According to one method, a game is initiated by spinning a plurality of mechanical reels in response to a player wager, wherein each mechanical reel has a plurality of game symbols. The gaming machine ascertains whether a triggering event is established during the game. In response to a triggering event, one or more video images are presented and overlay one or more the mechanical reels to obscure the game symbols on the mechanical reels in response to the triggering event. In one embodiment, the video images include one or more video depictions of game symbols. The mechanical reels obscured by the video images are fixed, and the mechanical reels not obscured by the video images are spun. One or more paylines are evaluated for winning outcomes based on the combination of the video depictions of game symbols and the game symbols presented on the mechanical reels on the one or more paylines. A bonus prize is awarded for a winning outcome appearing on a payline. | 11-05-2009 |
| Patent application number | Description | Published |
|---|
| 20080292923 | System for continuous removal of a specific gas from a flowing mixture of gases - A system comprising a cylindrical housing containing a sorbent cartridge selective of one or more gases in a gaseous mixture. End caps on opposite ends of the housing seal to the ends of the cartridge and direct the flow of gas mixture through a portion of the cartridge. The first end cap has entrance and exit ports for the gas mixture and for a purging gas for cartridge regeneration. The second end cap includes a compartment to receive and return the gas mixture to the first cap exit port. The purging gas follows a similar pathway via the remaining portion of the cartridge. The cartridge is rotatable within the housing; thus, the exhausted portion of the medium may be rotated into position for regeneration while a regenerated portion of the medium is rotated into position for re-use, thus providing continuous adsorption from the gas mixture. | 11-27-2008 |
| 20090042071 | Multi-tube fuel reformer with augmented heat transfer - A catalytic reformer assembly including a reactor comprising a plurality of parallel tubes arranged within a tubular housing. A metal substrate, formed preferably as a metal foam lattice, is brazed to the tubes on both their inside and outside surfaces. A catalytic washcoat is applied to the metal substrate within the tubes, defining thereby the tubes as individual catalytic reforming reactors. Endothermic reforming reactions within the tubes are supported by heat from hot combustor exhaust flowing around the tubes in contact with the augmenting heat transfer metal substrates outside the tubes. Radial temperature gradients are small because of excellent heat transfer across the tube walls, resulting in excellent mechanical stability of the washcoat on the metal substrate. Preferably, the tubes are formed of Inconel 625 and the metal substrate is formed of Fecralloy®, a high temperature alloy having excellent thermal conductivity and oxidation resistance. | 02-12-2009 |
| 20090308858 | Hot zone igniter - An igniter for igniting combustible gases in a hot zone, such as in a solid oxide fuel cell, comprising a subassembly including an electrical resistance heating tip comprising SiC, metal leadframe clips formed of a nickel-based superalloy and attached to the heating tip, wire leads formed of a nickel-chromium alloy and connected to the leadframe clips for supplying electric current to the heating tip, and a nickel-based braze alloy comprising palladium and cobalt for connecting the leadframe clips to the heating tip and to the wire leads; an alumina ceramic body for receiving the brazed subassembly; and a potting compound comprising zirconia for potting the subassembly into the alumina ceramic body. | 12-17-2009 |
| 20100043289 | Fuel cell reformer - An improved multiple-tube catalytic reformer comprising a tubular body containing a radiator core having a plurality of longitudinal cells for low-pressure flow-through of combustion gases, the core being formed preferably either by winding of corrugated metal or as an extruded metal monolith. A plurality of reformer tubes, preferably non-cylindrical, containing hydrocarbon catalyst are arrayed in longitudinal openings within the radiator core and preferably are brazed thereto to maximize heat transfer from the radiator core to the reformer tubes. During manufacture, the metal radiator core is economically bored by laser cutting to form the openings to admit the reformer tubes for brazing. Preferably, the reformer tubes are numbered, sized, shaped, and arrayed to minimize the longest conduction path in the radiator core to the center of any reformer tube. | 02-25-2010 |
| Patent application number | Description | Published |
|---|
| 20090166781 | EMI SHIELDING FOR IMAGER DEVICES - A module that provides EMI shielding for imager devices is disclosed which includes a die comprising an imager device and a plurality of contact pads, a stack positioned above the imager device, the stack comprising at least one lens, a conductive layer positioned above the stack, the conductive layer comprising at least one light opening, and a plurality of wire bonds, each of which conductively couples the conductive layer to one of the contact pads on the die. A method of providing EMI shielding for an imager module is also disclosed which includes conductively coupling a conductive layer of the module to a plurality of contact pads on an imager die and forming an encapsulant material that encapsulates at least the plurality of wire bonds, the conductive layer and the contact pads. | 07-02-2009 |
| 20100013087 | EMBEDDED DIE PACKAGE AND PROCESS FLOW USING A PRE-MOLDED CARRIER - An embedded die package includes a carrier with an electrical device in the cavity of the carrier, a first dielectric layer covering the sides and top of the electrical device except for vias over selected bonding pads of the electrical device, a plurality of metal conductors, each of which is in contact with at least one of the vias, one or more additional dielectric layers lying over the metal conductors and the first dielectric layer, wherein a top layer of the one or more dielectric layers has openings with metalization underneath coupled to at least one of the metal conductors, and solder bumps protruding from each of the openings. | 01-21-2010 |
| 20100148337 | STACKABLE SEMICONDUCTOR PACKAGE AND PROCESS TO MANUFACTURE SAME - In one form a stackable electrical device package has a first plurality of traces, the electrical device bonded to at least some of the first plurality of traces, a second plurality of vertical posts attached to the first plurality of traces, and encapsulation material enclosing the electrical device and sides of the first plurality of traces and the second plurality of vertical posts such that bottoms of the first plurality of traces are exposed on the bottom of the semiconductor package, and tops of the vertical posts are exposed on the top of the semiconductor package. In another form a multiple electrical device package has a semiconductor device in a wafer having a plurality of contacts on an upper surface of the wafer, a first plurality of traces attached to the top of the wafer, a second plurality of vertical posts attached to the first plurality of traces, an electrical device bonded to at least some of the first plurality of traces, and encapsulation material enclosing the electrical device and sides of the first plurality of traces and the second plurality of vertical posts such that tops of the vertical posts are exposed on the top of the semiconductor package. | 06-17-2010 |
| 20110068461 | EMBEDDED DIE PACKAGE AND PROCESS FLOW USING A PRE-MOLDED CARRIER - An embedded die package includes a carrier with an electrical device in the cavity of the carrier, a first dielectric layer covering the sides and top of the electrical device except for vias over selected bonding pads of the electrical device, a plurality of metal conductors, each of which is in contact with at least one of the vias, one or more additional dielectric layers lying over the metal conductors and the first dielectric layer, wherein a top layer of the one or more dielectric layers has openings with metalization underneath coupled to at least one of the metal conductors, and solder bumps protruding from each of the openings. | 03-24-2011 |
| 20110147917 | INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED COMPONENTS - This document discusses, among other things, a semiconductor die package having a first and a second discrete components embedded into a dielectric substrate. An integrated circuit (IC) die is surface mounted on a first side of the dielectric substrate. The semiconductor die package includes a plurality of conductive regions on the second side of the dielectric substrate for mounting the semiconductor die package. A plurality of through hole vias couple the IC die to the first and second discrete components and the plurality of conductive regions. | 06-23-2011 |
| 20110266670 | WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE - Annular reinforcement structures that can be used in wafer level chip scale packages (WLCSP) are described. The WLCSP comprises a substrate with an IC device and a bond pad connected to the IC device, a passivation layer protecting an outer portion of the bond pad, an annular ring structure formed on an inner portion of the bond pad, an under bump metal (UBM) layer covering the annular ring structure, and a solder ball attached to the UBM layer. The annular ring structure contains a substantially planar top with vertical or non-vertical sidewalls that slope down to the inner portion of the bond pad. The annular ring structure can slow the solder crack propagation in the solder ball and therefore increase the solder joint reliability in the WLCSP. As well, the annular ring structure can increase the surface area for solder attachment to the UBM layer, improving overall ball shear strength are described. Other embodiments are described. | 11-03-2011 |
| 20120001322 | DOUBLE MOLDED CHIP SCALE PACKAGE - Chip scale semiconductor packages and methods for making and using the same are described. The chip scale semiconductor packages (CSPs) contain a die with an integrated circuit device, a patterned plating layer, and a second interconnect structure formed from a Cu etched substrate that has a portion of an upper surface connected to the patterned plating layer, a side surface, and a bottom surface. The die can be attached to the patterned plating layer by a first interconnect structure that uses wirebonding or that uses a flip chip attachment process. The CSP contains a double molded structure where a first molding layer encapsulates the die, the patterned plating layer, the first interconnect structure, and the upper surface of the second interconnect structure. The second molding layer encapsulates the side surface of the second interconnect structure without encapsulating the bottom surface of the second interconnect structure. With such a configuration, the second molding layer helps control warpage during the manufacturing process and no printed circuit board (PCB) substrate is needed when the package is used in an electronic device since the signal routing is performed by the second interconnect structure. Other embodiments are described. | 01-05-2012 |
| Patent application number | Description | Published |
|---|
| 20080224192 | PACKAGING METHODS FOR IMAGER DEVICES - An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the first surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed. | 09-18-2008 |
| 20110121413 | MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS - This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal. | 05-26-2011 |
| Patent application number | Description | Published |
|---|
| 20090065496 | INDUCTION COOKWARE - An induction cooking utensil is constructed such that it cooks food within its chamber while maintaining a relatively cool outer surface (e.g., preferably an outer surface that is cool enough to pick up with one's bare hands). The cooking utensil includes an inner wall that is made at least in part of an electrically conductive material and an outer wall that is made at least in part of the electrically non-conductive material. A reflective layer is disposed between the inner and outer walls to reflect radiant heat away from the outer wall. | 03-12-2009 |
| 20090065497 | INDUCTION COOKWARE - An induction cooking utensil includes an inner wall and an outer wall that is separated by a vacuumed-gap. Disposed within the vacuumed-gap is a piece of getter material that absorbs at least some gas present within the gap. The getter material may thus be used to create and/or preserve the vacuum. | 03-12-2009 |
| 20090065498 | INDUCTION COOKWARE - An induction cooking utensil is constructed to have an inner wall that is made at least in part of electrically conductive material and an outer wall having a bottom portion and a sidewall portion. The bottom portion is made at least in part of a non-conductive material (e.g., so as to not interfere substantially with the magnetic field produced by the induction cooktop) and the sidewall portion is made at least in part of a metallic material. | 03-12-2009 |
| 20090065499 | INDUCTION COOKWARE - An induction cooking utensil is constructed such that it cooks food within its chamber while maintaining a relatively cool outer surface (e.g., preferably an outer surface that is cool enough to pick up with one's bare hands). The cooking utensil includes an inner wall that is made at least in part of an electrically conductive material and an outer wall that is made at least in part of the electrically non-conductive material and separated from the inner wall by a gap. Holes are formed in the outer wall that permit circulation of air between the gap and the outside of the cooking utensil to provide for convective cooling. | 03-12-2009 |
| 20090065500 | Induction Cookware - An induction cooking utensil is constructed such that it cooks food within its chamber while maintaining a relatively cool outer surface (e.g., preferably an outer surface that is cool enough to pick up with one's bare hands). The cooking utensil includes an inner wall that is made at least in part of an electrically conductive material and an outer wall that is made at least in part of the electrically non-conductive material. A reflective layer, a vacuum-sealed thermal insulator and/or a gas more resistant to conducting heat than air is disposed between the inner and outer walls to resist the transfer of heat from the inner wall to the outer wall. | 03-12-2009 |
| Patent application number | Description | Published |
|---|
| 20110251956 | SYSTEM AND METHOD FOR CORRESPONDENT BANK CUSTOMER ATM TRANSACTION PROCESSING - Systems and methods provide the customer of a correspondent bank, having a pre-arranged relationship with an ATM bank to use the ATM bank's ATM network, with the opportunity to deposit funds via check or cash using the ATM bank's ATM network. A correspondent bank profile and/or individual customer profiles are created and stored on the ATMs of the ATM bank and/or the backend system. The correspondent bank customer initiates a transaction with an ATM on the ATM network, is authenticated, and the ATM determines the customer is a customer of the correspondent bank. Based thereon, the ATM offers the customer the option to perform a deposit transaction. The ATM bank clears the deposited funds and sends transaction information to the correspondent bank including MICR data, check image, and transaction information. The transaction is settled through a demand deposit account owned by the correspondent bank and maintained by the ATM bank. | 10-13-2011 |
| 20120030112 | Generation And Use Of Cash Value Debit Cards - Systems and methods for generating and using a cash value debit card are described. A request from a user to add value to a cash value debit card account financially secured by a financial entity against an account of the user may be received. The user may be authenticated to the account of the user with the financial entity. Monetary funds may be debited from the account of the user by an amount to add to the cash value debit card account, and the debited amount may be added to the cash value debit card account. A request to withdraw monetary funds from the cash value debit card account may be received. A determination may be made as to whether to authorize the withdrawal from the cash value debit card account. The withdrawal may be authorized, and the cash value debit card account may be debited accordingly. | 02-02-2012 |
| 20120030113 | Generation And Use Of Negotiable Instruments - Systems and methods for generating and using negotiable instrument are described. A request from a user to generate a negotiable instrument financially secured by a financial entity against an account of the user is received, and the user is authenticated to the account of the user with the financial entity. Upon authenticating the user to the account, data representative of the negotiable instrument financially secured by the financial entity against the account of the user is transmitted. The data may include a printable image and barcode for scanning by a second computing device of the financial entity. The transmitted data representative of the negotiable instrument may be received by a computing device. The computing device may output the data representative of the negotiable instrument to a printer for local generation of the negotiable instrument on the printer without the need for special inks and/or other data. | 02-02-2012 |
| Patent application number | Description | Published |
|---|
| 20090246107 | Dry-Scrubbing Media Compositions and Methods of Production and Use - Dry-scrubbing media compositions, methods of preparation and methods of use are provided. The compositions contain activated alumina and magnesium oxide. Optionally, activated carbon and other impregnates, such as hydroxides of group 1A metals, are included. The compositions exhibit improved efficiency and capacity for the removal of compounds, such as hydrogen sulfide, from an air-stream. The compositions are particularly useful for reducing or preventing the release of toxic gaseous compounds from the areas such as landfills, petroleum storage areas, refineries, drinking water systems, sewage treatment facilities, swimming pools, hospital morgues, animal rooms, and pulp and paper production sites. | 10-01-2009 |
| 20100296990 | Dry Scrubbing Air Filtration Media - A solid air filtration medium includes an impregnate with an organic amine and an inorganic metal salt. The medium has from about 0.1 to about 25% by weight of impregnate. The impregnate contains from about 0.1 to about 5% by weight organic amine, and the organic amine includes aqueous urea, solid urea, melamine or mixtures thereof. The impregnate contains from about 0.1 to about 5% by weight metal salt, and the metal salt includes magnesium oxide, calcium oxide or mixtures thereof. The impregnate optionally further includes a surfactant such as polyacrylic acid. Methods for forming a solid air filtration medium having an impregnate containing an organic amine and an inorganic metal salt and methods for removing contaminants from a fluid stream are also provided. | 11-25-2010 |
| 20110316186 | Filtration Media Having Recycled Waste Materials - A method for forming a filtration media from waste media includes combining the waste media with a binder to form a dry mixture, adding a liquid composition to the dry mixture to form a slurry, and extruding the slurry to form a filtration media. The waste media may include fines or oversized media resulting from a prior media production process that have been subjected to a hydration process. The waste media may be ground and sized prior to combining it with the binder. The binder may include clay, cellulose materials, and combinations thereof. The liquid composition may include water and optionally one or more additional additives selected from the group consisting of permanganates, acids, bases, amines and combinations thereof. In one embodiment, the slurry is extruded into a honeycomb matrix. | 12-29-2011 |
