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Engl, DE
Andreas Engl, München DE
| Patent application number | Description | Published |
|---|---|---|
| 20090155653 | FUEL CELL SYSTEM - The invention relates to a fuel cell system comprising a reformer and an afterburner each for reacting at least fuel and an oxidant; and a fuel feeder for supplying the reformer and the afterburner with fuel. It is provided for to particular advantage that at least one flow control valve for controlling the fuel supply is included upstream of at least the reformer or the afterburner. The invention relates furthermore to a motor vehicle having one such fuel cell system. | 06-18-2009 |
Andreas Engl, München DE
| Patent application number | Description | Published |
|---|---|---|
| 20090155653 | FUEL CELL SYSTEM - The invention relates to a fuel cell system comprising a reformer and an afterburner each for reacting at least fuel and an oxidant; and a fuel feeder for supplying the reformer and the afterburner with fuel. It is provided for to particular advantage that at least one flow control valve for controlling the fuel supply is included upstream of at least the reformer or the afterburner. The invention relates furthermore to a motor vehicle having one such fuel cell system. | 06-18-2009 |
Andreas Engl, Munich DE
| Patent application number | Description | Published |
|---|---|---|
| 20090246571 | DETERMINATION OF THE LAMBDA VALUE OF REFORMATE WITH THE AID OF A FUEL CELL - The invention relates to a process for determining the lambda value (λ | 10-01-2009 |
| 20090297898 | REFORMING SYSTEM, METHOD FOR OPERATING A REFORMING SYSTEM AND FUEL CELL SYSTEM - The invention relates to a reformer system for generating a hydrogen-rich reformate comprising a reformer to which fuel and an oxidising agent can be supplied. According to the invention it is contemplated that the fuel supplied to the reformer is at least partly coolable by a fluid having other functions in addition to the function of cooling the fuel in the reformer system or a parent system into which the reformer system is integrated. The invention further relates to a method for generating a hydrogen-rich reformate as well as a fuel cell system comprising a reformer system according to the invention. | 12-03-2009 |
| 20100212977 | REFORMER FOR A FUEL CELL SYSTEM AND METHOD FOR OPERATING SAID REFORMER - The invention relates to a reformer ( | 08-26-2010 |
| 20100212991 | FUEL CELL SYSTEM COMPRISING A REFORMER AND AN AFTERBURNER - The invention relates to a fuel cell system ( | 08-26-2010 |
| 20110117464 | FUEL CELL SYSTEM AND METHOD FOR INFLUENCING THE THERMAL BALANCE OF A FUEL CELL SYSTEM - The invention relates to a fuel cells system ( | 05-19-2011 |
Bernhard Engl, Stephans Kirchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20080315934 | Integrated Circuit Comprising a Mixed Signal Single-Wire Interface and Method for Operating the Same - The invention relates to an integrated circuit ( | 12-25-2008 |
Bernhard Engl, Dortmund DE
| Patent application number | Description | Published |
|---|---|---|
| 20080245448 | Method for Producing Metal Sheets from a Magnesium Melt - A method for producing metal sheets from a magnesium melt, comprises the following steps: producing the magnesium melt, casting the magnesium melt to a cast strip, immediately after casting, strip-rolling the cast strip to a rolled strip, cross-cutting the rolled strip to metal sheets, rolling the metal sheets to a final thickness, the rolling of metal sheets being carried out, in relation to the metal sheets, in a direction a at right angle to the rolling direction of the strip-rolling, said direction being maintained during the entire rolling of the metal sheets. The method according to the invention enables very wide sheets to be produced in a simple way which meet the end user's requirements. | 10-09-2008 |
Bernhard Engl, Stephanskirchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20110298473 | DYNAMIC COMPENSATION OF AGING DRIFT IN CURRENT SENSE RESISTOR - A current sense resistor circuit may include a primary current sense resistor that drifts with age. A secondary current sense resistor may drift with age in substantial unison with the primary current sense resistor. A calibration resistor may not drift with age in substantial unison with the primary current sense resistor. A compensation circuit may compensate for aging drift in the resistance of the primary current sense resistor based on a comparison of the calibration resistor with the secondary current sense resistor. The secondary current sense resistor may be in parallel with the primary current sense resistor, except when the compensation circuit is comparing the calibration resistor with the secondary current sense resistor. | 12-08-2011 |
Bernhard Helmut Engl, Bavaria DE
| Patent application number | Description | Published |
|---|---|---|
| 20110068854 | CIRCUIT, TRIM AND LAYOUT FOR TEMPERATURE COMPENSATION OF METAL RESISTORS IN SEMI-CONDUCTOR CHIPS - A temperature compensation circuit for generating a temperature compensating reference voltage (V | 03-24-2011 |
Günter Engl, Erlangen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100307252 | Method and Device for Ultrasound Testing - In a method and device for ultrasonic testing of a workpiece, a multiplicity of ultrasonic testing pulses are launched into the workpiece from a test surface thereof. At least two ultrasonic testing pulses are launched into the workpiece to be tested at launching points that are spaced apart from one another by a test step width measured along the test surface. A single measured value (Ī) assigned to a local point located in the workpiece is calculated on the basis of the received signals assigned to the at least two ultrasonic testing pulses. | 12-09-2010 |
Günter Engl, Erlangen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100307252 | Method and Device for Ultrasound Testing - In a method and device for ultrasonic testing of a workpiece, a multiplicity of ultrasonic testing pulses are launched into the workpiece from a test surface thereof. At least two ultrasonic testing pulses are launched into the workpiece to be tested at launching points that are spaced apart from one another by a test step width measured along the test surface. A single measured value (Ī) assigned to a local point located in the workpiece is calculated on the basis of the received signals assigned to the at least two ultrasonic testing pulses. | 12-09-2010 |
Karl Engl, Niedergebraching DE
| Patent application number | Description | Published |
|---|---|---|
| 20100230698 | Optoelectronic Semiconductor Body - An optoelectronic semiconductor body includes a substrate with a front side for emitting electromagnetic radiation. The optoelectronic semiconductor body has a semiconductor layer sequence that is arranged on a rear side of the substrate and has an active layer suitable for generating the electromagnetic radiation. The optoelectronic semiconductor body also includes first and second electrical connection layers that are arranged on a first surface of the semiconductor body that faces away from the substrate. | 09-16-2010 |
| 20110049555 | Optoelectronic Semiconductor Chip and Method for Producing Same - An optoelectronic semiconductor chip has a semiconductor layer sequence having an active layer that generates radiation between a layer of a first conductivity type and a layer of a second conductivity type. The layer of the first conductivity type is adjacent to a front side of the semiconductor layer sequence. The semiconductor layer sequence contains at least one cutout extending from a rear side, lying opposite the front side, of the semiconductor layer sequence through the active layer to the layer of the first conductivity type. The layer of the first conductivity type is electrically connected through the cutout by means of a first electrical connection layer which covers the rear side of the semiconductor layer sequence at least in places. | 03-03-2011 |
| 20110101390 | Monolithic, Optoelectronic Semiconductor Body and Method for the Production Thereof - An optoelectronic semiconductor body comprises a semiconductor layer sequence which is subdivided into at least two electrically isolated subsegments. The semiconductor layer sequence has an active layer in each subarea. Furthermore, at least three electrical contact pads are provided. A first line level makes contact with a first of the at least two subsegments and with the first contact pad. A second line level makes contact with the second of the at least two subsegments and with a second contact pad. A third line level connects the two subsegments to one another and makes contact with the third contact pad. Furthermore, the line levels are each arranged opposite a first main face, wherein the first main face is intended to emit electromagnetic radiation that is produced. | 05-05-2011 |
| 20110104836 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT - In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence. | 05-05-2011 |
| 20110114988 | Led Chip - A light-emitting diode chip ( | 05-19-2011 |
| 20110241031 | OPTOELECTRONIC PROJECTION DEVICE - An optoelectronic projection device which generates a predefined image during operation, including a semiconductor body having an active layer that generates electromagnetic radiation and a radiation exit side and is an imaging element of the projection device, wherein, to electrically contact the semiconductor body, a first contact layer and a second contact layer are arranged at a rear side of the semiconductor body, the rear side lying opposite the radiation exit side, and are electrically insulated from one another by a separating layer. | 10-06-2011 |
| 20110260205 | RADIATION-EMITTING SEMICONDUCTOR CHIP - A radiation-emitting semiconductor chip includes a carrier and a semiconductor body having a semiconductor layer sequence, wherein an emission region and a protective diode region are formed in the semiconductor body having the semiconductor layer sequence; the semiconductor layer sequence includes an active region that generates radiation, the active region being arranged between a first semiconductor layer and a second semiconductor layer; the first semiconductor layer is arranged on a side of the active region which faces away from the carrier; the emission region has a recess extending through the active region; the first semiconductor layer in the emission region is electrically conductively connected to a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer toward the carrier; and the first connection layer in the protective diode region is electrically conductively connected to the second semiconductor layer. | 10-27-2011 |
| 20110272728 | Radiation-Emitting Semiconductor Chip - A radiation-emitting semiconductor chip ( | 11-10-2011 |
| 20120018763 | RADIATION-EMITTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR CHIP - A radiation-emitting semiconductor chip includes: a carrier and a semiconductor body with a semiconductor layer sequence including an active region that generates radiation, a first semiconductor layer and a second semiconductor layer; wherein the active region is arranged between the first semiconductor layer and the second semiconductor layer; the first semiconductor layer is arranged on a side of the active region which faces away from the carrier; the semiconductor body comprises at least one recess which extends through the active region; the first semiconductor layer is electrically conductively connected to a first connection layer extending in the recess from the first semiconductor layer in a direction of the carrier; and the first connection layer is electrically connected to the second semiconductor layer via a protective diode. | 01-26-2012 |
Karl Engl, Regensburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20100171135 | Optoelectronic Semiconductor Body and Method for Producing the Same - The invention relates to an opto-electronic semiconductor body having a semiconductor layer sequence ( | 07-08-2010 |
| 20100208763 | Semiconductor Chip and Method for Manufacturing a Semiconductor Chip - A semiconductor chip with a semiconductor body has a semiconductor layer sequence with an active region provided for generating radiation. A mirror structure that includes a mirror layer and a dielectric layer that is arranged at least in regions between the mirror layer and semiconductor body is arranged on the semiconductor body. | 08-19-2010 |
Karl Engl, Peatling DE
| Patent application number | Description | Published |
|---|---|---|
| 20110215295 | METHOD OF PRODUCING A RADIATION-EMITTING THIN FILM COMPONENT AND RADIATION-EMITTING THIN FILM COMPONENT - A method of producing a radiation-emitting thin film component includes providing a substrate, growing nanorods on the substrate, growing a semiconductor layer sequence with at least one active layer epitaxially on the nanorods, applying a carrier to the semiconductor layer sequence, and detaching the semiconductor layer sequence and the carrier from the substrate by at least partial destruction of the nanorods. | 09-08-2011 |
Karl Engl, Pentling DE
| Patent application number | Description | Published |
|---|---|---|
| 20120043572 | Optoelectronic Semiconductor Body - An optoelectronic semiconductor body with a semiconductor layer sequence ( | 02-23-2012 |
Korbinian Engl, Kirchasch DE
| Patent application number | Description | Published |
|---|---|---|
| 20100001757 | INTEGRATED CIRCUIT AND METHOD OF PROTECTING A CIRCUIT PART TO BE PROTECTED OF AN INTEGRATED CIRCUIT - A integrated circuit comprises a circuit part to be protected and protective lines located at least one wiring level of the integrated circuit. In addition, the integrated circuit comprises logical gates coupled to the protective lines, whereby a logic circuit is formed, and a processing unit implemented to detect a manipulation of the integrated circuit by applying test patterns to the logic circuit and verifying a logic output value of the logic circuit responsive to the test patterns. | 01-07-2010 |
Maximilian Engl, Friedberg-Bachern DE
| Patent application number | Description | Published |
|---|---|---|
| 20080229816 | Device for Pressure-Based Load Detection - A device for intake manifold pressure-based determination of the air mass flowing into the cylinder combustion chamber is provided. A logic unit determines the inflowing air mass based on the intake manifold pressure using a calculation model for load detection that determines the intake manifold pressure in an upper partial range of the intake manifold pressure. A sensor device for direct detection of the intake manifold pressure measures the intake manifold pressure only in a lower partial range of the intake manifold pressure in the internal combustion engine. The logic unit determines the inflowing air mass as a function of the intake manifold pressure measured by the sensor device when within the lower partial range of the intake manifold pressure, and based on the intake manifold pressure determined by use of the calculation model when within the upper partial range. | 09-25-2008 |
Reimund Engl, Regensburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20080220564 | Semiconductor module - A semiconductor module is disclosed. One embodiment provides a first semiconductor chip, a second semiconductor chip and a spacer. The first semiconductor chip has a depression at a first main surface. The spacer is applied to the first main surface and at least partly fills the depression. The second semiconductor chip is applied to the spacer. | 09-11-2008 |
| 20080246137 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF - An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer. | 10-09-2008 |
| 20080296782 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer. | 12-04-2008 |
| 20090072379 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness. | 03-19-2009 |
| 20090093090 | METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFACE-MOUNTABLE FLAT EXTERNAL CONTACTS - A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts. | 04-09-2009 |
| 20110189821 | SEMICONDUCTOR DEVICE - A semiconductor device and method is disclosed. One embodiment provides a method comprising placing a first semiconductor chip on a carrier. After placing the first semiconductor chip on the carrier, an electrically insulating layer is deposited on the carrier. A second semiconductor chip is placed on the electrically insulating layer. | 08-04-2011 |
Reimund Engl, Regensberg DE
| Patent application number | Description | Published |
|---|---|---|
| 20090065914 | SEMICONDUCTOR DEVICE WITH LEADERFRAME INCLUDING A DIFFUSION BARRIER - A semiconductor device includes a leadframe having a first face and an opposing second face, a portion of the first face defining a die pad, a diffusion barrier deposited on at least a portion of the die pad, and at least one chip coupled to the diffusion barrier. | 03-12-2009 |
Werner Engl, Luhe-Wildenau DE
| Patent application number | Description | Published |
|---|---|---|
| 20100026309 | Modular Electrical System and Method for its Operation - A modular electrical system including a first current-emitting source module and a first current-consuming sink module which is connected to the first current-emitting source module is provided. The first sink module has a first sink identification means to identify maximum power requirement of the first sink module. The object of providing power balancing between a first source module and a first sink module is achieved in that the first source module has a first source identification means for identifying the power capacity of the first source module, wherein in order to calculate a power ratio of the system the first sink identification means and the first source identification means are connected to a two-wire line for the purpose of generating a differential voltage. | 02-04-2010 |