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| 20100271007 | DIAGNOSING DEVICE OF SIGNAL STATUS IN MEASUREMENT AND CONTROL BY MEASURING MEANS AND CONTROL MEANS - This aims to provide a diagnosing device for detecting the measurements of an electric current, a voltage and a resistance by a temperature/moisture or pressure sensor or a signal state in control means, precisely with a simple circuit constitution, for diagnosing the soundness of a circuit while simplifying a power source circuit, to suppress the cost more than the conventional circuit having no diagnosing function, and for diagnosing the signal status in the measurement or control by a measuring means or a control means. An alternating voltage generating means containing a pulse-wave voltage and an alternating current is connected with the primary side of a transformer, and a driven member such as the measuring means for any of varying electric current, voltage and resistance is connected with the secondary side. The change in the primary-side current, which is caused with the electric power fed through an insulating transformer by the action of the driven member connected with the secondary side, is measured so that the signal status in the measuring or control means is diagnosed according to the measurement result. | 10-28-2010 |
| 20110121771 | SIGNAL STATUS DIAGNOSING DEVICE FOR CONTROLL ACTUATOR AS DRIVEN OBJECT - Provided is a signal status diagnosing device for a control actuator, which is enabled by a simple constitution to perform the transmission of the status of a drive signal in a control actuator, the transmission of a signal indicating the occurrence of troubles such as disconnection or shorting of a wiring line, and the transmission of an electric power by a common means, thereby to prevent the rise of a production cost due to the increase in a parts count or the complexity of a circuit constitution and to diagnose the transmission of the measurement result and the soundness of the circuit precisely. The signal status diagnosing device comprises a current measuring means using an insulating transformer having its primary side and secondary side insulated, for measuring the primary side current which flows when an electric current flows to a driven member connected with the secondary side, a means for converting the electric current measured by the current measuring means, into a voltage corresponding to the driven state of the driven member, thereby to feed back the converted voltage to the drive voltage signal, and a voltage measuring means for measuring the voltage, at which the signal converted from the current measured by the current measuring means into a voltage has been fed back to the drive voltage signal. The signal status diagnosing device performs the signal status diagnosis of the control actuator. | 05-26-2011 |
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| 20090326297 | PRODUCTION METHOD OF ALPHA-OLEFIN LOW POLYMER - The object of the present invention is to provide a production method of an α-olefin low polymer, wherein a low polymer of an α-olefin is obtained in high yield. The present invention relates to that when an inert gas is allowed to exist in a gas phase part of a reactor | 12-31-2009 |
| 20100030000 | PRODUCTION METHOD OF ALPHA-OLEFIN LOW POLYMER AND STORAGE METHOD OF PYRROLE COMPOUND - The object of the present invention is to provide production method of an α-olefin low polymer using a chromium series catalyst comprising a pyrrole compound as a component. The present invention relates to that in producing an α-olefin low polymer such as 1-hexene using an α-olefin such as ethylene as a raw material, a chromium series catalyst constituted of a chromium compound (a), a pyrrole compound (b) and an aluminum-containing compound (c) is used as a polymerization catalyst, and a concentration of a pyrrole dimer contained in the pyrrole compound (b) is 2% by weight or less based on the pyrrole compound (b). | 02-04-2010 |
| 20100036185 | PRODUCTION METHOD OF ETHYLENE LOW POLYMER - The object of the present invention is to provide a method of recovering decene under the condition that a decomposition product of a chromium series catalyst and the like is difficult to form from a high boiler from which an ethylene low polymer has been separated, in a production method of an ethylene low polymer using a chromium series catalyst. The present invention relates to that an ethylene low polymer and a high boiler containing a chromium series catalyst, decene, tetradecene and a by-produced polymer are separated by evaporation operation from a reaction liquid containing an ethylene low polymer obtained by low polymerization reaction using a chromium series catalyst, and the high boiler is concentrated such that the tetradecene concentration is 5% by weight or more by an evaporative separator | 02-11-2010 |
| 20100093952 | DEPOSIT DEACTIVATION TREATMENT METHOD - The object of the present invention is to provide a treatment method which deactivates deposits in a reactor and the like in a production process of an α-olefin low polymer. The present invention relates to that after completion of the production of a low polymer of ethylene in a reactor | 04-15-2010 |
| 20100331503 | PRODUCTION METHOD OF POLYOLEFIN, POLYOLEFIN AND 1-HEXENE FOR LINEAR LOW DENSITY POLYETHYLENE PRODUCTION RAW MATERIAL - The object of the present invention is to provide a production method for a polyolefin, in which catalyst activity is improved, and a polyolefin such as a linear low density polyethylene can advantageously be industrially produced. The present invention relates to a production method for a polyolefin, in which in producing a polyolefin by the polymerization reaction of an olefin using a catalyst, an organohalide is present in the reaction system in an amount of from 0.05 to 10 ppm by weight in terms of the halogen atom as a concentration in a raw material olefin, and 1-hexene for linear low density polyethylene production raw material, containing an organohalide in an amount of from 0.05 to 10 ppm by weight in terms of the halogen atom. | 12-30-2010 |
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| 20090034150 | SUBSTRATE HOLDING SYSTEM AND EXPOSURE APPARATUS USING THE SAME - A substrate holding system including a substrate attracting device, an exhausting device, and a control device to operate the exhausting device so that a pressure around the substrate and a pressure at an interval between the substrate and the substrate attracting device are lowered to a first pressure and that only the pressure at the interval is subsequently lowered to a second pressure, which is lower than the first pressure. | 02-05-2009 |
| 20090103232 | Substrate Holding System and Exposure Apparatus Using the Same - A substrate holding system for holding a substrate based on vacuum attraction and electrostatic attraction including a rim configured to support the substrate, a protrusion for the electrostatic attraction, configured to support the substrate inside the rim, and a protrusion for the vacuum attraction, configured to support the substrate inside the rim. A substrate supporting surface area of the protrusion of the electrostatic attraction is larger than a substrate supporting surface area of the protrusion for the vacuum attraction. | 04-23-2009 |
| 20090135383 | EXPOSURE APPARATUS - An exposure apparatus including a moving member movable with a substrate, an interferometer configured to measure a position of the moving member, a blower device for blowing temperature-conditioned air, a plurality of supply openings communicating with the blower device, and a flow rate adjusting device configured to adjust a gas flow rate blown through the plurality of supply openings based on an operation of the moving member. | 05-28-2009 |
| 20090237638 | EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD - An exposure apparatus for exposing a substrate through liquid includes a stage for holding and moving the substrate. The stage includes a holding section for holding the substrate and a supporting section disposed around the holding section. The supporting section includes a recovery port including a gap between the substrate held by the holding section and the supporting section, the recovery port for recovering the liquid, a space for storing the liquid recovered through the recovery port, a liquid recovery mechanism for draining the liquid that has collected in a lower part of the space, and a sloshing reduction member disposed in the space, the sloshing reduction member for reducing sloshing of the liquid. | 09-24-2009 |
| 20100141911 | EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD - An exposure apparatus, exposing a substrate via liquid so as to transfer a pattern of a mask onto the substrate, includes a stage configured to move while holding the substrate. The stage includes a substrate supporting portion on which the substrate is disposed, a supporting surface disposed outside the substrate supporting portion configured to support the liquid together with the substrate, and a frame portion formed so as to surround the supporting surface. The frame portion includes a depression and a member whose top surface is located in a plane including the supporting surface. | 06-10-2010 |
| 20110051109 | MEASUREMENT APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A measurement apparatus which includes a plurality of sensors arranged on a movable member, and a plurality of scales attached to a structure, and measures a position of the movable member by detecting a displacement of the movable member using a sensor and a scale that face each other, the plurality of scales including two first scales configured to detect displacements of the movable member in a first direction, and two second scales configured to detect displacements of the movable member in a second direction different from the first direction, and the apparatus comprising a controller configured to reduce a measurement error resulting from a geometrical error between the two first scales. | 03-03-2011 |
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| 20090044972 | Circuit board, method of forming wiring pattern, and method of manufacturing circuit board - When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment. | 02-19-2009 |
| 20090195933 | HEAD ASSEMBLY - A head assembly for writing or reading information to or from a recording medium. The head assembly includes a suspension having an electrode pad; a mounting member placed on the suspension; a head mounted on the mounting member and having an electrode, for writing or reading information; and a first bonding member made of a hot-melt adhesive and fixing the electrode to the electrode pad. | 08-06-2009 |
| 20090321500 | REPAIR APPARATUS AND REPAIR METHOD - A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board. | 12-31-2009 |
| 20100006325 | PRINTED WIRING BOARD - A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material. | 01-14-2010 |
| 20100326726 | SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD - A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders. | 12-30-2010 |
| 20110303441 | BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE - Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches. | 12-15-2011 |
| 20110303443 | MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT - A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion. | 12-15-2011 |
| 20110303449 | PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD - A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion. | 12-15-2011 |
| 20110303450 | MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER - Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component. | 12-15-2011 |
| 20110304059 | CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE - A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads. | 12-15-2011 |
