Patent application number | Description | Published |
20100089978 | METHOD AND APPARATUS FOR WAFER BONDING - An improved apparatus for bonding semiconductor structures includes equipment for treating a first surface of a first semiconductor structure and a first surface of a second semiconductor structure with formic acid, equipment for positioning the first surface of the first semiconductor structure directly opposite and in contact with the first surface of the second semiconductor structure and equipment for forming a bond interface between the treated first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together. The equipment for treating the surfaces of the first and second semiconductor structures with formic acid includes a sealed tank filled partially with liquid formic acid and partially with formic acid vapor. Opening an inlet valve connects the tank to a nitrogen gas source and allows nitrogen gas to flow through the tank. Opening an outlet valve allows a mixture of formic acid vapor with nitrogen gas to flow out of the tank. The mixture is used for treating the surfaces of the first and second semiconductor structures. | 04-15-2010 |
20110010908 | APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTOR WAFERS - A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer. | 01-20-2011 |
20110014774 | APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING - An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder. | 01-20-2011 |
20150083342 | METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTOR WAFERS - A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly. | 03-26-2015 |
Patent application number | Description | Published |
20150113434 | METHOD AND APPARATUS FOR PROVIDING A USER DEVICE WITH FUNCTIONALITY ENABLING INSTANCES OF POST INFORMATION PROVIDED BY SELECTED USERS TO BE ADDED TO A NEWS FEED - Methods, apparatuses, and computer program products are described herein that are configured to provide, to a user, network based functionality enabling the user to first add another user to their community and optionally to their news feed. One example embodiment may include a method for providing the first user an option to add a second user to a community of the first user, providing a response communication configured to indicate an acceptance to add the second user to the community of the first user, and providing a visual link configured to indicate an intention of the first user to post information provided by the second user to a news feed of the first user, the news feed of the first user configured to provide post information provided by the second user and one or more other connected and added users. | 04-23-2015 |
20150113447 | Method And Apparatus For Providing Plan Making Functionality Enabling A User To Execute From A Social Networking Service Feature Currently In Use - Methods, apparatuses, and computer program products are described herein that are configured to provide, to a user, network based functionality enabling the user to make a plan from a social networking service feature the user is currently utilizing. One example embodiment may include a method for providing a social networking service feature comprising a visual link, the selection of the visual link configured for enabling plan making functionality, the visual link associated with at least one of a second user, a group of users, a destination, or an event, detecting activation of the visual link, and providing plan making functionality, the plan making functionality configured to provide functionality for inviting one or more other users, and receiving information indicative of at least one of one or more users invited to attend, a date or time, and an intent of the plan by use of tags or selected from one or more destinations or events. | 04-23-2015 |
20150178691 | Method And Apparatus For Providing A User Device With Functionality Enabling Users To Provide Their Intention To Attend A Particular Destination Or Event - Methods, apparatuses, and computer program products are described herein that are configured to provide, to a user, network based functionality enabling the user to convey their social intent, including an intent to attend a destination. One example embodiment may include a method for providing a first page associated with a destination, the first page comprising a visual link configured for display and selection, display of the visual link configured to convey an intention of the first user to attend the destination, the selection of the visual link configured to open a target page, the target page associated with the destination, in an instance in which the target page is associated with the destination, receiving a selection indicating the at least one of the time. | 06-25-2015 |
Patent application number | Description | Published |
20150246488 | FABRICATING THREE-DIMENSIONAL OBJECTS WITH OVERHANG - The claimed subject matter includes a system and method to design 3D objects for fabrication. In embodiments, the method includes sampling coordinates of a two-dimensional object. The method also includes generating fabrication coordinates based on the coordinates and a plane comprising a top layer of a three-dimensional (3D) object. Additionally, the method includes generating a 2D triangular mesh for the top layer of an overhang based on the sampled coordinates, an angle between the top layer and two points in a previous top layer border less than or equal to an overhang threshold angle. | 09-03-2015 |
20150251357 | FABRICATING FULL COLOR THREE-DIMENSIONAL OBJECTS - A method, computing system, and one or more computer-readable storage media for fabricating full color three-dimensional objects are provided herein. The method includes transforming a three-dimensional model into instructions for a fabrication device by slicing the three-dimensional model into layers with color information preserved, generating two-dimensional polygons for each layer based on colors on faces, colors on textures, and/or gradient colors, and determining a tool path for fabricating an object from colored materials based on the two-dimensional polygons for each layer. Determining the tool path includes generating instructions that direct the fabrication device to apply colored material for all two-dimensional polygons of a same color before switching colors, smooth an exterior of the object by switching colors at an internal vertex of each two-dimensional polygon within each layer, and deposit transitional material within an infill area, a support structure, and/or an area outside the object when switching colors. | 09-10-2015 |