| Patent application number | Description | Published |
|---|
| 20080237873 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA - An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening in the substrate open at the top and having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor. | 10-02-2008 |
| 20100224991 | INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM - An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit. | 09-09-2010 |
| 20100320589 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMPS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant. | 12-23-2010 |
| 20110068463 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH QUAD FLAT NO-LEAD PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base array having terminals and an open region; attaching a coverlay layer directly on the base array; placing a component in the open region and directly on the coverlay layer; forming an encapsulation over the base array and the component; removing the coverlay layer to leave a plane of the terminals and a plane of the component partially exposed and substantially coplanar; and removing a portion of the base array between the terminals, the terminals electrically isolated. | 03-24-2011 |
| 20110079885 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHAPED LEAD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a ridge, and a second concave surface; forming a die attach paddle adjacent the package lead and having an another retention structure around a perimeter of the die attach paddle with an another first concave surface, an another ridge, and an another second concave surface; attaching an integrated circuit die to the die attach paddle; connecting a conductive connector to the integrated circuit die and the package lead; and applying an encapsulation over the integrated circuit die, the encapsulation conformed to the retention structure and exposing a portion of the package lead. | 04-07-2011 |
| 20110079886 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package paddle; forming a pad extension having a spacing to the package paddle; forming a lead adjacent the pad extension, the pad extension between the package paddle and the lead; forming a conductive layer directly on and between the package paddle and the pad extension; and connecting an integrated circuit to the pad extension and the lead, the integrated circuit over the package paddle. | 04-07-2011 |
| 20110079888 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge. | 04-07-2011 |
| 20110108966 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a conductive layer having a first surface and a second surface; forming first concave trenches in the first surface of the conductive layer and the first concave trenches are connected by a first flat region of the first surface; connecting an integrated circuit to the first flat region with a conductive interconnect; encapsulating the integrated circuit with an encapsulation that fills the first concave trenches; and forming second concave trenches having a similar size in the second surface of the conductive layer with the second concave trenches connected by a second flat region that is larger than the first flat region, and the second concave trenches are formed through the conductive layer to expose the encapsulation. | 05-12-2011 |
