Patent application number | Description | Published |
20080225076 | METHOD OF FABRICATING PRINTHEAD HAVING HYDROPHOBIC INK EJECTION FACE - A method of fabricating a printhead having a hydrophobic ink ejection face is provided. The method comprises the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face; (b) depositing a layer of relatively hydrophobic polymeric material onto the nozzle surface, the polymeric material being resistant to removal by ashing; and (c) defining a plurality of nozzle openings in the nozzle surface, thereby providing a printhead having a relatively hydrophobic ink ejection face. Steps (b) and (c) may be performed in any order. | 09-18-2008 |
20080225077 | METHOD OF FABRICATING PRINTHEAD USING METAL FILM FOR PROTECTING HYDROPHOBIC INK EJECTION FACE - A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of the printhead; (b) defining a plurality of nozzle openings in the nozzle plate; (c) depositing a hydrophobic polymeric layer onto the nozzle surface; (d) depositing a protective metal film onto the polymeric layer; (e) subjecting the printhead to an oxidizing plasma; and (f) removing the protective metal film, thereby providing a printhead having a relatively hydrophobic ink ejection face. Step (b) may be performed immediately after any of steps (a), (c) or (d). | 09-18-2008 |
20080225078 | PRINTHEAD INCLUDING SEAL MEMBRANE - An inkjet printhead comprising a plurality of nozzle assemblies is provided. Each nozzle assembly has a moving portion for ejection of ink. The printhead includes a seal membrane joining the moving portions to the printhead. | 09-18-2008 |
20080225082 | Printhead having hydrophobic polymer coated on ink ejection face - A printhead having a hydrophobic ink ejection face is provided. At least part of the ink ejection face is coated with a hydrophobic polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins. | 09-18-2008 |
20080225083 | PRINTHEAD HAVING MOVING ROOF STRUCTURE AND MECHANICAL SEAL - A nozzle assembly for an inkjet printhead is provided. The nozzle assembly comprises a nozzle chamber having a roof, the roof having a moving portion moveable relative to a static portion and a nozzle opening defined in the roof, such that movement of the moving portion relative to the static portion causes ejection of ink through the nozzle opening. The nozzle assembly also comprises an actuator for moving the moving portion relative to the static portion, and a mechanical seal interconnecting the moving portion and the static portion. The mechanical seal comprises a polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins. | 09-18-2008 |
20080227229 | METHOD OF FABRICATION MEMS INTEGRATED CIRCUITS - A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of:
| 09-18-2008 |
20090139961 | METAL FILM PROTECTION DURING PRINTHEAD FABRICATION WITH MINIMUM NUMBER OF MEMS PROCESSING STEPS - A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of the printhead; (b) depositing a hydrophobic polymeric layer onto the nozzle surface; (c) depositing a protective metal film onto at least the polymeric layer; (d) depositing a sacrificial material onto the polymeric layer; (e) patterning the sacrificial material to define a plurality of nozzle opening regions; (f) defining a plurality of nozzle openings through the metal film, the polymeric layer and the nozzle plate; (g) subjecting the printhead to an oxidizing plasma; and (h) removing the protective metal film, thereby providing a printhead having a relatively hydrophobic ink ejection face. | 06-04-2009 |
20090147042 | MICROCAPPING OF INKJET NOZZLES - An inkjet printer comprising: a printhead comprising a nozzle plate having a plurality of nozzle openings defined therein, said nozzle plate comprising a first relatively hydrophilic layer and a second relatively hydrophobic layer, said second layer defining an ink ejection face for said printhead; and a capper having a planar capping surface, said capper being moveable between a first position in which said capper is disengaged from said printhead and a second position in which said capping surface sealingly engages with said ink ejection face wherein, in said second position, a meniscus of ink contained in each nozzle opening is pinned at an interface between said first and second layers, such that a microwell is defined between said capping surface and said meniscus. | 06-11-2009 |
20090147044 | PRESSURE CAPPING OF INKJET NOZZLES - An inkjet printer comprising: a printhead comprising a plurality of nozzles for ejecting ink from an ink ejection face of said printhead; and a capper comprising a perimeter seal and a resiliently deformable capper body having a capping surface, said capper being moveable between a first position in which said capper is disengaged from said printhead; a second position in which said perimeter seal sealingly engages with said ink ejection face, such that a sealed air cavity is defined between said capping surface and said printhead; and a third position in which deformation of said capper body urges said capping surface into sealing engagement with said ink ejection face, wherein, in moving from said second position to said third position, said air cavity is compressed and air from said cavity is forced into said nozzles, thereby causing ink to retreat into said printhead. | 06-11-2009 |
20090278899 | Printhead Integrated Circuit Comprising Polymeric Cover Layer - A printhead integrated circuit comprises a substrate having drive circuitry and a plurality of nozzle assemblies positioned on the substrate. Each nozzle assembly has a moving portion moveable relative to a stationary portion for ejection of ink. The printhead integrated circuit is covered with a polymeric layer. The polymeric layer covers a gap defined between each moving portion and each stationary portion. | 11-12-2009 |
20090314365 | MEMS Integrated Circuit Comprising Microfluidic Diaphragm Valve - A MEMS integrated circuit comprising one or more microfluidic diaphragm valves and control circuitry for the valves. Each valve comprises: an inlet port; an outlet port; a weir positioned between the inlet and outlet ports, the weir having a sealing surface; a diaphragm membrane for sealing engagement with the sealing surface; and a thermal bend actuator for moving the diaphragm membrane between a closed position in which the membrane is sealingly engaged with the sealing surface and an open position in which the membrane is disengaged from the sealing surface. The control circuitry is configured to control actuation of the actuator so as to control opening and closing of the valve. | 12-24-2009 |
20090314367 | Bonded Microfluidics System Comprising CMOS-Controllable Microfluidic Devices - A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform. The microfluidic system comprises one or more microfluidics devices controlled by control circuitry in the integrated circuit. At least one of the microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of the integrated circuit. The MEMS layer is covered with a polymeric layer which defines the bonding surface of the integrated circuit. | 12-24-2009 |
20090314368 | Microfluidic System Comprising Pinch Valve and On-Chip MEMS Pump - A microfluidic system comprising a pneumatic or an hydraulic pinch valve. The pinch valve comprises: a microfluidic channel defined in a compliant body; an inflatable control channel cooperating with a valve section of the microfluidic channel such that pneumatic or hydraulic pressurization of the control channel causes inflation of the control channel and pinching closure of the valve section. The microfluidic system comprises an on-chip MEMS pump in fluidic communication with the control channel for pressurizing said control channel. | 12-24-2009 |
20090314970 | Mechanically-Actuated Microfluidic Pinch Valve - A microfluidic pinch valve. The valve comprises a microfluidic channel defined in a compliant body; a valve sleeve defined by a section of the microfluidic channel, the valve sleeve having a membrane wall defining part of an outer surface of the body; a compression member for pinching the membrane wall against an opposed wall of the valve sleeve; and a thermal bend actuator for moving the compression member between a closed position in which the membrane wall is sealingly pinched against the opposed wall, and an open position in which the membrane wall is disengaged from the opposed wall. | 12-24-2009 |
20090314972 | Mechanically-Actuated Microfluidic Diaphragm Valve - A microfluidic diaphragm valve. The valve comprises: an inlet port; an outlet port; a weir positioned between the inlet and outlet ports, the weir having a sealing surface; a diaphragm membrane for sealing engagement with the sealing surface; and a thermal bend actuator for moving the diaphragm membrane between a closed position in which the membrane is sealingly engaged with the sealing surface and an open position in which the membrane is disengaged from said sealing surface. | 12-24-2009 |
20090315126 | Bonded Microfluidic System Comprising Thermal Bend Actuated Valve - A microfluidic system comprising a MEMS integrated circuit bonded to a microfluidics platform. The microfluidics platform comprises a polymeric body having at least one microfluidic channel defined therein. The MEMS integrated circuit comprises at least one thermal bend actuator. The microfluidic system is configured such that movement of the actuator causes closure of the channel. | 12-24-2009 |
20090317298 | Microfluidic System Comprising Microfluidic Pump, Mixer or Valve - A microfluidic system. The system comprises: (A) a microfluidics platform comprising: a compliant body having a microfluidic channel defined therein; an elongate chamber defined by a section of the microfluidic channel, the chamber having a membrane wall defining part of an outer surface of the body; and a plurality of compression members spaced apart along the membrane wall, each compression member being configured for pinching a respective part of the membrane wall against an opposed wall of the chamber; and (B) a MEMS integrated circuit bonded to the outer surface of the body, the MEMS integrated circuit comprising: a plurality of moveable fingers, each finger engaged with a respective compression member, each finger being configured to urge the respective compression member between a closed position in which the respective part of the membrane wall is sealingly pinched against the opposed wall, and an open position in which the respective part of the membrane wall is disengaged from the opposed wall; a plurality of thermal bend actuators, each associated with a respective finger for controlling movement of the respective finger, and control circuitry for controlling actuation of the actuators. | 12-24-2009 |
20090317302 | Microfluidic System Comprising MEMS Integrated Circuit - A microfluidic system comprising a MEMS integrated circuit. The MEMS integrated circuit comprises: a silicon substrate having one or more microfluidic channels defined therein; at least one layer of control circuitry for controlling one or more microfluidic devices; a MEMS layer comprising the microfluidic devices; and a polymeric layer covering the MEMS layer. Part of the polymeric layer provides a seal for the microfluidic devices. | 12-24-2009 |
20090318312 | Microfluidic System Comprising Mechanically-Actuated Microfluidic Pinch Valve - A microfluidic system. The system comprises: (A) a microfluidics platform comprising: a compliant body having a microfluidic channel defined therein; a valve sleeve defined by a section of the microfluidic channel, the valve sleeve having a membrane wall defining part of an outer surface of the body; and a compression member for pinching the membrane wall against an opposed wall of the valve sleeve; and (B) a MEMS integrated circuit bonded to the outer surface of the body, the MEMS integrated circuit comprising: a moveable finger engaged with the compression member, the finger being configured to urge the compression member between a closed position in which the membrane wall is sealingly pinched against the opposed wall, and an open position in which the membrane wall is disengaged from the opposed wall; a thermal bend actuator associated with the finger, the actuator configured for controlling movement of the finger; and control circuitry for controlling actuation of the actuator so as to control opening and closing of the valve sleeve. | 12-24-2009 |
20100090296 | WAFER ASSEMBLY COMPRISING MEMS WAFER WITH POLYMERIZED SILOXANE ATTACHMENT SURFACE - A wafer assembly comprises a wafer having a MEMS layer formed on a frontside and a polymer coating covering the MEMS layer. A holding means is releasably attached to the polymer coating so that the wafer assembly facilitates performance of backside operations on a backside of the wafer. The polymer coating is comprised of a polymerized siloxane. | 04-15-2010 |
20100149266 | Mems Integrated Circuit With Polymerized Siloxane Layer - A MEMS integrated circuit comprises: a silicon substrate having a passivated CMOS layer, a MEMS layer disposed on the passivated CMOS layer, and a polymer layer disposed on the MEMS layer. The CMOS layer comprises drive circuitry for actuating actuator devices in the MEMS layer and the polymer layer comprises a polymerized siloxane. | 06-17-2010 |
20110018935 | PRINTHEAD HAVING POLYSILSESQUIOXANE COATING ON INK EJECTION FACE - A printhead having an ink ejection face coated with a hydrophobic polymeric material. The polymeric material is comprised of a polysilsesquioxane, such as poly(methylsilsesquioxane) or poly(phenylsilsesquioxane). The printhead is compatible with various printhead maintenance operations requiring contact with the ink ejection face. | 01-27-2011 |
20110018936 | PRINTHEAD HAVING POLYMER INCORPORATING NANOPARTICLES COATED ON INK EJECTION FACE - A printhead having an ink ejection face, wherein at least part of the ink ejection face is coated with a polymeric material. The polymeric material is comprised of a polymerized siloxane incorporating nanoparticles. The printhead may be compatible with various printhead maintenance operations, ink characteristics and inkjet nozzle types. | 01-27-2011 |
20110018937 | PRINTHEAD HAVING INK EJECTION FACE COMPLEMENTING INK OR OTHER FEATURES OF PRINTHEAD - An inkjet printhead for ejection of an ejectable fluid. The printhead has an ink ejection face coated with a polymeric material incorporating nanoparticles. The nanoparticles impart predetermined characteristics to the ink ejection face, which complement an inherent property of the ejectable fluid, a printhead maintenance regime associated with the printhead or a type of nozzle actuator. | 01-27-2011 |
20110090286 | PRINTHEAD INTEGRATED CIRCUIT HAVING EXPOSED ACTIVE BEAM COATED WITH POLYMER LAYER - A printhead integrated circuit includes: a substrate comprising drive circuitry; a ceramic nozzle plate spaced apart from the substrate, the nozzle plate having a plurality of nozzle openings and a plurality of moveable portions defined therein; an active beam disposed on each moveable portion of the nozzle plate, such that each moveable portion is moveable towards the substrate when a current from the drive circuitry is passed through a respective active beam; and a polymer layer coating the nozzle plate and the active beams, wherein the polymer layer is comprised of a polymerized siloxane. | 04-21-2011 |