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Elenius
Daniel Elenius, San Mateo, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090307162 | METHOD AND APPARATUS FOR AUTOMATED ASSISTANCE WITH TASK MANAGEMENT - The present invention relates to a method and apparatus for assisting with automated task management. In one embodiment, an apparatus for assisting a user in the execution of a task, where the task includes one or more workflows required to accomplish a goal defined by the user, includes a task learner for creating new workflows from user demonstrations, a workflow tracker for identifying and tracking the progress of a current workflow executing on a machine used by the user, a task assistance processor coupled to the workflow tracker, for generating a suggestion based on the progress of the current workflow, and a task executor coupled to the task assistance processor, for manipulating an application on the machine used by the user to carry out the suggestion. | 12-10-2009 |
Klaus Elenius, Turku FI
| Patent application number | Description | Published |
|---|---|---|
| 20110293614 | ISOFORM SPECIFIC ANTI-HER4 ANTIBODIES - Compositions and methods useful for detecting and treating cancers which express the HER4 JM-a isoform are disclosed. | 12-01-2011 |
Peter Elenius, Scottsdale, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080302564 | CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR PREPARING THE SAME - A substrate for an electronic device package includes an electrically conductive core shaped to define a cavity for receiving an electronic device, a first insulating layer positioned on a first side of the core, and a first contact positioned adjacent to a surface within the cavity. Method of fabricating the substrates is also provided. | 12-11-2008 |
| 20090101274 | Single or Multi-Layer Printed Circuit Board With Improved Via Design - A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof. | 04-23-2009 |
| 20110193231 | ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device. | 08-11-2011 |