| Patent application number | Description | Published |
|---|
| 20080284039 | INTERCONNECT STRUCTURES WITH TERNARY PATTERNED FEATURES GENERATED FROM TWO LITHOGRAPHIC PROCESSES - A method for fabricating an interconnect structure for interconnecting a semiconductor substrate to have three distinct patterned structures such that the interconnect structure provides both a low k and high structural integrity. The method includes depositing an interlayer dielectric onto the semiconductor substrate, forming a first pattern within the interlayer dielectric material by a first lithographic process that results in both via features and ternary features being formed in the interconnect structure. The method further includes forming a second pattern within the interlayer dielectric material by a second lithographic process to form line features within the interconnect structure. Hence the method forms the three separate distinct patterned structures using only two lithographic processes for each interconnect level. | 11-20-2008 |
| 20090035480 | STRENGTHENING OF A STRUCTURE BY INFILTRATION - The present invention provides a method of strengthening a structure, to heal the imperfection of the structure, to reinforce the structure, and thus strengthening the dielectric without compromising the desirable low dielectric constant of the structure. The inventive method includes the steps of providing a semiconductor structure having at least one interconnect structure; dicing the interconnect structure; applying at least one infiltrant into the interconnect structure; and infiltrating the infiltrant to infiltrate into the interconnect structure. | 02-05-2009 |
| 20090075472 | METHODS TO MITIGATE PLASMA DAMAGE IN ORGANOSILICATE DIELECTRICS - Methods of minimizing or eliminating plasma damage to low k and ultra low k organosilicate intermetal dielectric layers are provided. The reduction of the plasma damage is effected by interrupting the etch and strip process flow at a suitable point to add an inventive treatment which protects the intermetal dielectric layer from plasma damage during the plasma strip process. Reduction or elimination of a plasma damaged region in this manner also enables reduction of the line bias between a line pattern in a photoresist and a metal line formed therefrom, and changes in the line width of the line trench due to a wet clean after the reactive ion etch employed for formation of the line trench and a via cavity. The reduced line bias has a beneficial effect on electrical yields of a metal interconnect structure. | 03-19-2009 |
| 20090200683 | INTERCONNECT STRUCTURES WITH PARTIALLY SELF ALIGNED VIAS AND METHODS TO PRODUCE SAME - An interconnect structure having partially self aligned vias with an interlayer dielectric layer on a substrate, containing at least two conducting metal lines that traverse parallel to the substrate and at least two conducting metal vias that are orthogonal to the substrate. A method of producing the self aligned vias by depositing an interlayer dielectric layer onto a substrate, depositing at least one hardmask onto the interlayer dielectric layer, lithographically forming a via pattern with elongated via features and lithographically forming a line pattern in either order, then either transferring the line patterns first into the interlayer dielectric layer forming line features or transferring the via pattern first into the interlayer dielectric layer as long as the patterns overlap to forming self aligned via features, depositing conducting metals and filling regions corresponding to the line and via features, and planarizing and removing excess metal from the line and via features. | 08-13-2009 |
| 20090294982 | INTERCONNECT STRUCTURES WITH TERNARY PATTERNED FEATURES GENERATED FROM TWO LITHOGRAPHIC PROCESSES - A method for fabricating an interconnect structure for interconnecting a semiconductor substrate to have three distinct patterned structures such that the interconnect structure provides both a low k and high structural integrity. The method includes depositing an interlayer dielectric onto the semiconductor substrate, forming a first pattern within the interlayer dielectric material by a first lithographic process that results in both via features and ternary features being formed in the interconnect structure. The method further includes forming a second pattern within the interlayer dielectric material by a second lithographic process to form line features within the interconnect structure. Hence the method forms the three separate distinct patterned structures using only two lithographic processes for each interconnect level. | 12-03-2009 |
