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Eitan
Alecsander P. Eitan, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120069914 | EFFICIENT COMPRESSED SENSING CHANNEL ESTIMATION FOR SINGLE-CARRIER COMMUNICATION SYSTEMS - Methods and devices for receiving wireless signals employ compressed sensing-based estimation techniques to receive single-carrier transmissions, exploiting the common sparseness of the wireless channel, enabling signal reception in the presence of significant Delay and Doppler spreads. When implemented for an ATSC or ATSC-M/H mobile TV standard signal, the compressed sensing channel estimation algorithm enables data reception in Delay and Doppler spread conditions beyond the capabilities of conventional channel estimation methods. | 03-22-2012 |
Amram Eitan, Scottsdale, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080242079 | IN-SITU FORMATION OF CONDUCTIVE FILLING MATERIAL IN THROUGH-SILICON VIA - The formation of electronic assemblies including a die having through vias is described. In one embodiment, a method includes providing Si die including a first surface and a second surface opposite the first surface, and forming a via extending through the Si die from the first surface to the second surface. The via is formed to have a larger width at the first surface than at the second surface, the larger width at the first surface being no less than 100 microns. The method also includes placing a plurality of particles in the via, wherein at least some of the particles comprise a polymer and at least some of the particles comprise a metal. The method also includes heating the die and the particles in the via to cross-link at least part of the polymer in the via, and cooling the die to solidify the polymer and form a electrically conductive composite including the cross-linked polymer and the metal in the via. Other embodiments are described and claimed. | 10-02-2008 |
| 20090294515 | Mounting integrated circuit components on substrates - A poly(alkylene carbonate) tack agent may be used to secure an electrical component, such as an integrated circuit, to a substrate for soldering. The tack agent may disintegrate or vaporize at normal reflow temperatures so that no clean up is needed. In some embodiments, flexless soldering may be implemented. If flux is desired, the flux may be mixed with the tack agent in some embodiments. For example, the flux may be incorporated in microcapsules within the tack agent. | 12-03-2009 |
Amran Eitan, Scottsdale, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090068830 | Microelectronic package interconnect and method of fabrication thereof - A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles. | 03-12-2009 |
Sharon Eitan, San Mateo, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080292187 | Apparatus and software for geometric coarsening and segmenting of still images - An apparatus and software for processing an image reduces the number of pixels constituting the image by sequentially eliminating alternate rows and columns of pixels, the information represented by each pixel being eliminated (a “source” pixel) being redistributed into adjacent “destination” pixel locations. The redistribution is made in proportion to the similarity between the source and each destination pixel, e.g., similarity of color and/or luminance values. | 11-27-2008 |