Eiji Kono
Eiji Kono, Aichi-Ken JP
Patent application number | Description | Published |
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20100193941 | SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink. | 08-05-2010 |
20110235279 | COOLING DEVICE - A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member. | 09-29-2011 |
20120126390 | SEMICONDUCTOR DEVICE - A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin. | 05-24-2012 |
Eiji Kono, Aichi JP
Patent application number | Description | Published |
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20090314474 | HEAT SINK FOR POWER MODULE - A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. | 12-24-2009 |
Eiji Kono, Kariya-Shi JP
Patent application number | Description | Published |
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20090139704 | HEAT SINK DEVICE - A heat radiator | 06-04-2009 |
20090174063 | Semiconductor Module - A semiconductor module | 07-09-2009 |
20090200065 | HEAT DISSIPATION DEVICE AND POWER MODULE - A heat radiator | 08-13-2009 |
20090302458 | Heat Sink For Power Module - A heat sink ( | 12-10-2009 |
20140140004 | HEAT SINK FOR POWER MODULE - A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins. | 05-22-2014 |
Eiji Kono, San Diego, CA US
Patent application number | Description | Published |
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20080231754 | System and method for dynamically establishing microdisplay driver offsets using brightness value in rear projection TV having dynamic iris control - In a rear projection microdisplay TV with dynamic iris control, sensed average picture level (APL) or other sensed brightness level is used to dynamically establish microdisplay driver offsets including white balance. | 09-25-2008 |
20090156051 | HDMI source detection - A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract. | 06-18-2009 |
20140092305 | HDMI SOURCE DETECTION - A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor connecting a DC power source to the DDC/CEC ground node. The node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, where the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when a switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract. | 04-03-2014 |
Eiji Kono, Yamanashi JP
Patent application number | Description | Published |
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20160067870 | UMBILICAL MEMBER CLAMPING DEVICE FOR CLAMPING UMBILICAL MEMBERS VIA ELASTIC BODY - An umbilical member clamping device includes a base member attached to a body of a robot, an elastic body provided so as to surround a periphery of an umbilical member bundle including umbilical members, a clamp member secured to the base member so as to press the umbilical member bundle to the base member via the elastic body, and an insert member inserted to a corner portion of a space which receives the umbilical member bundle and which is defined by the clamp member and the base member when the clamp member is secured to the base member. | 03-10-2016 |