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Eichstadt

Andreas M. Eichstadt, Hemer DE

Patent application numberDescriptionPublished
20090057008Sealing Body for a Cable Sleeve - A sealing body for a cable sleeve, in which a compensation element is embodied as an elastomer element that is inlaid or embedded in the gel-like sealing element is disclosed. The compensation element, by means of which the alterations in the material behavior of the gel-like sealing element which occur in use can be compensated, is embodied as an elastomer element inlaid in the gel-like sealing element.03-05-2009
20090309313Sealing Body for a Cable Sleeve - A sealing body for a cable sleeve for an optical fiber cable is disclosed. The sealing body has a central, cylindrical sealing body segment. The central, cylindrical sealing body segment has, on an outer casing surface, a plurality of cutouts distributed over the circumference thereof, in each case one cylinder-segment-like sealing body segment being capable of being inserted into each of the cutouts of the central sealing body segment, and in each case one cable insertion opening for receiving and individually sealing off in each case one single cable being formed between the central sealing body segment and each cylinder-segment-like sealing body segment. Each of the cylinder-segment-like sealing body segment has a gel-like sealing element, which can be compressed individually independently of the sealing elements of other cylinder-segment-like sealing body segments in order to individually seal off the cable inserted into the respective cable insertion opening.12-17-2009

David E. Eichstadt, Park Ridge, IL US

Patent application numberDescriptionPublished
20090163019FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS OF SEED LAYER UNDERETCHING - A method for forming an interconnect structure for a semiconductor device includes defining a via in a passivation layer so as expose a top metal layer in the semiconductor device. A seed layer is formed over the passivation layer, sidewalls of the via, and the top metal layer. A barrier layer is formed over an exposed portion of the seed layer, the exposed portion defined by a first patterned opening of a first diameter, and a solder material is formed over the barrier layer using a second patterned opening of a second diameter. The second patterned opening is configured such that the second diameter is larger than the first diameter.06-25-2009

Patent applications by David E. Eichstadt, Park Ridge, IL US

Francis J. Eichstadt, Hamilton, OH US

Patent application numberDescriptionPublished
20080286577Toughened polyacetal compositions and blends having low surface gloss - Polyacetal compositions and blends toughened with polyvinylbutyral having enhanced adhesive surface properties, including enhanced surface adhesion and low surface gloss, are disclosed. Also disclosed are articles of manufacture comprising the polyacetal compositions described herein.11-20-2008

Frederic Paul Eichstadt, Livry/seine FR

Patent application numberDescriptionPublished
20090064658BYPASS TURBOMACHINE WITH REDUCTION OF JET NOISE - In a bypass turbomachine, at least one air takeoff orifice is provided in the primary channel, said orifice leading to an air takeoff pipe housed inside an air inlet sleeve of the nacelle. The air takeoff pipe opens out in the vicinity of the pylon into two air diffusion pipes each secured to a respective maintenance cover, each air diffusion pipe opening out into an air injection pipe secured to a thrust reverser cover and itself opening out to the outside of the nacelle via the trailing edge thereof, each air injection pipe being suitable for uncoupling from the corresponding air diffusion pipe when the corresponding thrust reverser cover slides downstream.03-12-2009

Johannes Eichstadt, Neubrandenburg DE

Patent application numberDescriptionPublished
20090297898REFORMING SYSTEM, METHOD FOR OPERATING A REFORMING SYSTEM AND FUEL CELL SYSTEM - The invention relates to a reformer system for generating a hydrogen-rich reformate comprising a reformer to which fuel and an oxidising agent can be supplied. According to the invention it is contemplated that the fuel supplied to the reformer is at least partly coolable by a fluid having other functions in addition to the function of cooling the fuel in the reformer system or a parent system into which the reformer system is integrated. The invention further relates to a method for generating a hydrogen-rich reformate as well as a fuel cell system comprising a reformer system according to the invention.12-03-2009
20110058996REFORMER FOR CONVERTING GASEOUS FUEL AND OXIDIZING AGENT INTO A REFORMATE - The invention relates to a reformer for reacting fuel and oxidant into reformate, comprising a reforming zone (03-10-2011