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Ehrenpfordt
Ricardo Ehrenpfordt, Weissach DE
| Patent application number | Description | Published |
|---|---|---|
| 20100148330 | Leadless package housing - A leadless package for semiconductor elements has at least two semiconductor elements which are situated on a connection region of a lead frame of the leadless package in such a way that when deformations of the semiconductor elements occur, the deformations of the semiconductor elements compensate one another. | 06-17-2010 |
| 20100276182 | METHOD FOR HOT EMBOSSING AT LEAST ONE CONDUCTOR TRACK ONTO A SUBSTRATE AND SUBSTRATE HAVING AT LEAST ONE CONDUCTOR TRACK - In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction. | 11-04-2010 |
Ricardo Ehrenpfordt, Zwickau DE
| Patent application number | Description | Published |
|---|---|---|
| 20110229375 | Microfluidic System for Purposes of Analysis and Diagnosis and Corresponding Method for Producing a Microfluidic System - A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system. | 09-22-2011 |
Ricardo Ehrenpfordt, Komtal-Muenchingen DE
| Patent application number | Description | Published |
|---|---|---|
| 20120024396 | Method for Producing a Microfluidic System - A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system. In addition, the method includes connecting the microfluidic composite substrate and the mating substrate by their connection sides to form a microfluidic channel structure. | 02-02-2012 |
Ricardo Ehrenpfordt, Korntal-Muenchingen DE
| Patent application number | Description | Published |
|---|---|---|
| 20120106112 | Method for Producing an Electrical Circuit and Electrical Circuit - A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips. | 05-03-2012 |