| Patent application number | Description | Published |
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| 20100103757 | SEMICONDUCTOR DEVICE - A semiconductor device may include, but is not limited to, a first signal line, a second signal line, and a first shield line. The first signal line is supplied with a first signal. The first signal is smaller in amplitude than a potential difference between a power potential and a reference potential. The second signal line is disposed in a first side of the first signal line. The second signal line is supplied with a second signal. The second signal is smaller in amplitude than the potential difference. The first shield line is disposed in a second side of the first signal line. The second side is opposite to the first side. The first shield line reduces a coupling noise that is applied to the first shield line from the second side. | 04-29-2010 |
| 20110065249 | Method of manufacturing a semiconductor device in which an increase in area of the semiconductor device is suppressed - A method of manufacturing a semiconductor device includes: performing, in a case of manufacturing a first semiconductor device which operates by a first power supply voltage, at least one step from among channel ion implantation, gate oxide film formation, and gate electrode patterning according to a process of forming an element which operates with the first power supply voltage; performing, in a case of manufacturing a second semiconductor device which operates by a second power supply voltage, at least one step from among the channel ion implantation, the gate oxide film formation, and the gate electrode patterning according to a process of forming an element which operates with the second power supply voltage; and commonly performing at least diffusion region formation in the case of manufacturing the first semiconductor device and in the case of manufacturing the second semiconductor device. | 03-17-2011 |
| Patent application number | Description | Published |
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| 20110010047 | CONTROLLER OF HYBRID CONSTRUCTION MACHINE - A controller of a hybrid construction machine which can achieve minimization of a required number of sensors is provided. A sub pump driven by output of an electric motor is connected to discharge sides of main pumps. Proportional solenoid throttling valves are provided in connection process between the sub pump and the main pumps for controlling a flow rate supplied from the sub pump to the main pump. A control unit is provided for electrically controlling the openings of the proportional solenoid throttling valves. Pressure sensors are connected to the control unit which controls the openings of the proportional solenoid throttling valves in response to pressure signals from the pressure sensors. | 01-13-2011 |
| 20110035102 | Control Device For Hybrid Construction Machine - The amount of assist for a sub-pump (SP) is reduced when a rotating motor (RM) is singly operated, and the amount of assist for the sub-pump (SP) is increased except when the rotating motor (RM) is singly operated. A controller (C) has a function which, when a signal representing single operation of a rotating motor is inputted in the controller from a single operation detecting means and, at the same time, when a single indicating that assist is required is inputted from an assist controlling input means (A | 02-10-2011 |
| 20110060491 | Device For Controlling Hybrid Construction Machine - When an actuator in an operational mechanical system having a short continuous operation time is operated using a small-capacity electric motor (MG), an electric motor is rotated in the range exceeding a rated capacity, and during traveling with a long continuous operation time, the electric motor is rotated at the rated capacity or less. A controller (C) determines, from a signal provided from mode sensors ( | 03-10-2011 |
| 20110071738 | CONTROLLER OF HYBRID CONSTRUCTION MACHINE - Effective use of energy is provided by recovering energy produced during braking in operation of a rotation motor RM alone for electric generation. A control unit C has functions: of operating a passage-resistance control unit ( | 03-24-2011 |
| 20110072810 | CONTROLLER OF HYBRD CONSTRUCTION MACHINE - Disclosed is a controller of a hybrid, construction machine wherein electric power is generated by utilizing the standby flow rate of first and second main pumps, and the standby flow rate is converted into energy. Pilot channels are connected to the upstream side of on/off valves which are closed when first and second main pumps ensure a standby flow rate, and a controller unit judges that the first and second main pumps are discharging at the standby low rate based on pressure signals from first and second pressure sensors, and brings first and second solenoid valves to an open position. | 03-31-2011 |
| 20110082610 | CONTROLLER OF HYBRID CONSTRUCTION MACHINE - An efficient use of discharged energy of a boom cylinder is provided. A control unit C has a function of receiving an output signal from a sensor | 04-07-2011 |
| 20110268588 | CONTROLLER OF HYBRID CONSTRUCTION MACHINE - Discharge energy of a rotation motor RM and a boom cylinder BC are used as an assist force for an electric motor MG. An assist motor AM and a sub pump SP driven by output of the electric motor MG are integrally rotated on the discharge side of main pumps MP1, MP2. The assist motor AM is rotated by the discharge energy of the rotation motor RM and the boom cylinder BC, and the driving force of the assist motor AM is used to assist the output of the electric motor MG. | 11-03-2011 |
| Patent application number | Description | Published |
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| 20090209062 | Method of manufacturing semiconductor device and the semiconductor device - A method of manufacturing a semiconductor device which can reduce the number of times of resin-injection, thereby facilitating the miniaturization of the semiconductor device, and the semiconductor device. After resin is injected into a space between at least two second semiconductor chips flip-chip joined to a first semiconductor chip through an injection opening, the resin is hardened. | 08-20-2009 |
| 20090321266 | METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD - There is provided a method for manufacturing a printed circuit board having an insulative board and a plurality of electroconductive pads arranged in a grid shape on the insulative board, the method comprising: a step for forming an electroconductive film on the insulative board; a step for forming a pattern on the electroconductive film so as to form the electroconductive pads, a lead wire connected to at least one of the electroconductive pads, and inter-pad wiring for electrically connecting each of the electroconductive pads not connected to the lead wire to any of the electroconductive pads connected to the lead wire, the inter-pad wiring being disposed between mutually adjacent electroconductive pads; a step for plating each of the electroconductive pads by immersing the insulative board in a plating bath and energizing each of the electroconductive pads through the lead wire; and a step for removing the inter-pad wiring. | 12-31-2009 |
| 20100025710 | Semiconductor device and fabrication method thereof - There is provided a semiconductor device including: a semiconductor chip having a penetrating electrode penetrating through from a first main surface of the semiconductor chip to a second main surface on the opposite side thereof, a photoreceptor portion formed on the first main surface, and a first wire at a periphery of the photoreceptor portion; a light transmitting chip adhered to the first main surface at the periphery of the light transmitting chip, with a bonding layer interposed between the light transmitting chip and the first main surface, the light transmitting chip covering the light transmitting chip; and a light blocking resin layer formed only on the side surfaces of the light transmitting chip and the bonding layer. | 02-04-2010 |
| 20100038017 | Camera module and method of manufacturing camera module - There is provided a method of manufacturing a camera module including a sensor package having an image pickup element, and a lens configuration in which a lens holder, and a receptacle accommodating the sensor package are integrally formed, the sensor package being fixed within the receptacle, the method including: applying a photo-curing resin to predetermined portions of the receptacle; performing alignment of a relative position of the sensor package to the lens configuration; a first joining whereby the photo-curing resin is cured so that the sensor package is fixed within the receptacle while maintaining the relative position of the sensor package to the lens configuration; and a second joining whereby a thermosetting resin is applied so as to fill a space formed between the sensor package and the lens configuration, and then curing the thermosetting resin. | 02-18-2010 |
| 20100065953 | Semiconductor package - A semiconductor package according to the present invention includes a substrate; first and second semiconductor chips mounted on a first surface of the substrate; and a heat-radiation sheet. The heat-radiation sheet includes a heat-transferable conductive layer and first and second insulating layers formed on top and bottom surfaces of the heat-transferable conductive layer, respectively. The heat-radiation sheet includes a first portion arranged between the first semiconductor chip and the second semiconductor chip; and a second portion extending at least a side of the first portion. The second portion is connected to the substrate. The second insulating layer of the second portion is formed to expose a part of the heat-transferable conductive layer. | 03-18-2010 |
| 20110024904 | SEMICONDUCTOR PACKAGE, PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a wiring board; a first electrode for external connection; a ball pad; a semiconductor chip; a mold resin; an electrode unit connected with the ball pad and penetrating the mold resin; and a second electrode for external connection connected with a portion of the electrode unit on a side of an outer surface of the mold resin. The electrode unit includes a first ball disposed on the ball pad; a second ball disposed between the first ball and the second electrode; and a solder material connecting between the ball pad and the first ball, between the first ball and the second ball, and between the second ball and the second electrode for external connection; each of the first ball and the second ball including a core part having a glass transition temperature which is higher than a melting point of the solder material. | 02-03-2011 |
