Patent application number | Description | Published |
20120229793 | OPTICAL FIBER SENSORS HAVING LONG ACTIVE LENGTHS, SYSTEMS, AND METHODS - Optical fiber sensors adapted to measure strain or pressure are disclosed. The optical fiber sensor has a lead-in optical fiber having an end surface at a forward end, and a first optical element having a body with an outer dimension, Do, a front end surface coupled to the lead-in optical fiber, a pedestal including a retracted surface that is spaced from the front end surface, the retracted surface at least partially defining an optical cavity, a gutter surrounding the pedestal, the gutter having a gutter depth defining an active region of length, L, the first optical element further exhibiting L/Do≧0.5. Also provided are systems including the optical fiber sensor, and methods for manufacturing and using the optical fiber sensor. Numerous other aspects are provided. | 09-13-2012 |
20140153865 | OPTICAL FIBER SENSORS HAVING LONG ACTIVE LENGTHS, SYSTEMS, AND METHODS - Optical fiber sensors adapted to measure strain or pressure are disclosed. The optical fiber sensor has a lead-in optical fiber having an end surface at a forward end, and a first optical element having a body with an outer dimension, Do, a front end surface coupled to the lead-in optical fiber, a pedestal including a retracted surface that is spaced from the front end surface, the retracted surface at least partially defining an optical cavity, a gutter surrounding the pedestal, the gutter having a gutter depth defining an active region of length, L, the first optical element further exhibiting L/Do≧0.5. Also provided are systems including the optical fiber sensor, and methods for manufacturing and using the optical fiber sensor. Numerous other aspects are provided. | 06-05-2014 |
Patent application number | Description | Published |
20080308884 | Fabrication of Inlet and Outlet Connections for Microfluidic Chips - A method of making a fluid communication channel between a micro mechanical structure provided on a front side of a device and the back side of said device is described. It includes making the required structural components by lithographic and etching processes on said front side. Holes are then drilled from the back side of said device in precise alignment with the structures on said front side, to provide inlets and/or outlets to and/or from the micromechanical structure. | 12-18-2008 |
20090195948 | METHODS FOR MAKING A STARTING SUBSTRATE WAFER FOR SEMICONDUCTOR ENGINEERING HAVING WAFER THROUGH CONNECTIONS - The invention relates to a method of making a starting substrate wafer for semiconductor engineering having electrical wafer through connections ( | 08-06-2009 |
20100006536 | METHODS FOR MAKING MICRO NEEDLES AND APPLICATIONS THEREOF - The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method comprises an anisotropic, crystal plane dependent etch forming said inclined surface(s); and an anisotropic, non crystal plane dependent etch forming said elongated body portion; combined with suitable patterning processes defining said protruding elements to have a predetermined base geometry. | 01-14-2010 |
20100053922 | MICROPACKAGING METHOD AND DEVICES - A method of micro-packaging a component wherein at least a first and a second semi-conductor substrate are provided, one of which has electrical through connections (vias). A depression in either one of the substrates or in both is etched. A component is provided above vias and connected thereto. The substrates are joined to form a sealed package. A micro-packaged electronic or micromechanic device, including a thin-walled casing of a semi-conductor material having electrical through connections through the bottom of the casing is also disclosed. An electronic or micromechanic component is attached to the electrical through connections, and the package is hermetically sealed for maintaining a desired atmosphere, suitably vacuum inside the box. | 03-04-2010 |
20120288422 | GLASS MICRO FLUIDIC DEVICE - A method of making a microfluidic device, includes: providing an optically transparent bottom substrate and an optically transparent top substrate, each made of glass. Recesses are made in the top substrate and the top and bottom substrates are bonded together. Then, material is removed from the top substrate to expose the recesses, and a lid is attached to the top substrate so as to cover the recesses whereby channels are formed. At least that surface of the lid facing towards the recesses in the top substrate has a surface roughness of <5 nm, preferably <2 nm. A microfluidic device, including a body of an optically transparent material, and at least one channel extending inside the body, the channels having a bottom surface, a top surface and side walls is also described. The top and bottom surfaces both exhibit surface a roughness <5 nm, preferably <2 nm. | 11-15-2012 |
20140063580 | VIA STRUCTURE AND METHOD THEREOF - A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro- mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided. | 03-06-2014 |
20140378804 | INSULATION OF MICRO STRUCTURES - A method of providing a metal coating on a substrate ( | 12-25-2014 |
Patent application number | Description | Published |
20100006536 | METHODS FOR MAKING MICRO NEEDLES AND APPLICATIONS THEREOF - The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method comprises an anisotropic, crystal plane dependent etch forming said inclined surface(s); and an anisotropic, non crystal plane dependent etch forming said elongated body portion; combined with suitable patterning processes defining said protruding elements to have a predetermined base geometry. | 01-14-2010 |
20120018852 | VIA STRUCTURE AND METHOD THEREOF - A vent hole precursor structure ( | 01-26-2012 |
20120018898 | VIA STRUCTURE AND METHOD THEREOF - The invention relates to a layered micro-electronic and/or micro-mechanic structure, comprising at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided. | 01-26-2012 |
20120019886 | VIA STRUCTURE AND METHOD THEREOF - A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided. | 01-26-2012 |
20120097733 | NOVEL BONDING PROCESS AND BONDED STRUCTURES - A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described. | 04-26-2012 |
20120126392 | Methods for Making Micro Needles and Applications Thereof - The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method comprises an anisotropic, crystal plane dependent etch forming said inclined surface(s); and an anisotropic, non crystal plane dependent etch forming said elongated body portion; combined with suitable patterning processes defining said protruding elements to have a predetermined base geometry. | 05-24-2012 |
20120267773 | Functional Capping - A wafer level method of making a micro-electronic and/or micro-mechanic device, having a capping with electrical wafer through connections (vias), comprising the steps of providing a first wafer of a semiconductor material having a first and a second side and a plurality of holes and/or recesses in the first side, and a barrier structure extending over the wafer on the second side, said barrier comprising an inner layer an insulating material, such as oxide, and an outer layer of another material. Then, metal is applied in said holes so as to cover the walls in the holes and the bottom of the holes. The barrier structure is removed and contacts are provided to the wafer through connections on the back-side of the wafer. Bonding structures are provided on either of said first side or the second side of the wafer. The wafer is bonded to another wafer carrying electronic and micro-electronic/mechanic components, such that the first wafer forms a capping structure covering the second wafer. Finally the wafer is singulated to individual devices. | 10-25-2012 |
Patent application number | Description | Published |
20130169778 | METHOD, SYSTEM AND APPARATUS FOR AUTOMATED ALERTS - A method, system and apparatus for automated alerts are provided. Communication, via a processor and communication interface of a communication device, occurs with one or more remote communication devices in a communication session. Data is received at the processor, from a camera device. In response, to the data, an alert is transmitted, via the communication interface, to the one or more remote communication devices in the communication session. | 07-04-2013 |
20130190015 | EFFICIENCY OF ELECTRONIC MESSAGE COMMUNICATIONS BETWEEN MOBILE COMMUNICATION DEVICES - A disclosure provides mobile communication devices that receive information corresponding to users associated with target mobile communication device, via a near field communication protocol. The information is stored in a storage device either within the mobile communication device or within a separate server. If it is determined that the target mobile communication device is within a predetermined distance of the mobile communication device, data entries associated with the stored information are created and retrieved, in real time. The data entries are displayed on the mobile communication device. The data entries may include personal information or email messages from prior communication sessions, which are employed in future communications between the mobile communication devices. | 07-25-2013 |
20130207882 | METHODS AND APPARATUS TO OBTAIN AND PRESENT INFORMATION - Example methods and apparatus to display information are described. On example method includes a method including a mobile device exchanging information with at least one other mobile device; controlling transmission of media, to the mobile device and the at least one other mobile device, based on attributes of the mobile devices; and presenting the received media. | 08-15-2013 |