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Edmund P.

Edmund P. Hodzen, Columbus, IN US

Patent application numberDescriptionPublished
20090025374System and Method for Cleaning Combustion Soot from Exhaust Gas Treatment Sensors - A system and method are provided for cleaning combustion soot from an exhaust gas aftertreatment sensor. The system and method determine whether to conduct a sensor desoot event, and if it is determined that a sensor desoot event is to be conducted, the exhaust gas temperature is increased such that the temperature of the sensor correspondingly increases to or above a desoot temperature, the exhaust gas temperature is then controlled to maintain the temperature of the sensor at or above the desoot temperature for a predefined time period, and the exhaust gas temperature is then decreased after the temperature of the sensor has been at or above the desoot temperature for the predefined time period.01-29-2009

Edmund P. Szwajkowski, Bensalem, PA US

Patent application numberDescriptionPublished
20090032140NOVEL NON-CHROME METAL TREATMENT COMPOSITION - Chromate-free compositions for applying a conversion or passivation coating for metals, more particularly zinc coated metal surfaces. The methods of the invention comprise contacting the requisite metal surface with a phosphonomethylated polyamine. Other aspects of the disclosed tech involve methods and compositions in which the following optional components can be included: fluoacid, silane, inorganic phosphorus, acid, latex film forming component and pH adjustment agent.02-05-2009

Edmund P. Taddey, West Springfield, MA US

Patent application numberDescriptionPublished
20090283250HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY HEAT TRANSFER APPARATUS - A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix.11-19-2009