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Eda, Kanagawa
Hajime Eda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090258493 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A substance to be polished made of a silicon oxide film formed on a semiconductor substrate is chemically and mechanically polished and planarized by bringing the substance to be polished into contact with a polishing pad having a modulus of elasticity within a range of 400 to 600 megapascals and by relatively sliding the substance to be polished and the polishing pad, in a condition that a polishing pressure is within a range of 50 to 200 hectopascals and that a rotation number of the polishing pad is within a range of 10 to 80 rpm, and in a state that a polishing slurry containing cerium oxide particles and an anionic surfactant is supplied to the polishing pad. | 10-15-2009 |
| 20110070745 | POLISHING METHOD, POLISHING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A polishing method includes performing conditioning process of injecting a conditioning agent onto a surface of a non-foam polishing pad arranged on a polishing table at a predetermined pressure, and polishing a surface of a polishing target while supplying a polishing slurry containing oxide particles and a surfactant onto the polishing pad, wherein an average of a residual cerium amount is equal to or smaller than 0.35 at % when a plurality of measurement regions, each 200 μm□ in area including the surface of the polishing pad, in a cross section of the polishing pad are measured after the conditioning process. | 03-24-2011 |
| 20110076833 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - In a method of manufacturing a semiconductor device for planarizing a silicon oxide film with chemical mechanical polishing using a silicon film formed on a semiconductor substrate as a stopper film, a surface modification film for hydrophilizing the surface of the silicon film is formed on an upper layer of the polysilicon film, and slurry for the chemical mechanical polishing contains cerium oxide particles, a surface active agent, and resin particles having a cationic or anionic functional group. | 03-31-2011 |
Masakatsu Eda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100230248 | BELT DEVICE AND FIXING DEVICE - A belt device includes a belt; a driving unit that is provided inside the belt and drives the belt; a supporting unit that is provided inside the belt and supports the belt; and a position determination member that is fixed to one end in an axial direction of the driving unit or the supporting unit and comes in contact with an edge portion of the belt in the case where the belt is mounted so as to determine a position of the belt. | 09-16-2010 |
Shigeto Eda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090317304 | Pipette Core Member, Pipette, and Pipette Device - A pipette core member is used in a pipette for sampling a sample. This pipette core member includes: a pump body including a reservoir communicated with one suction/discharge port of an electroosmotic flow pump, the electroosmotic flow pump and the reservoir being integrally formed; and a capillary connected to the electroosmotic flow pump and communicated with the other suction/discharge port of the electroosmotic flow pump. The capillary is secured to the pump body. | 12-24-2009 |
| 20100142040 | MICROSCOPE - A microscope with which a transparent or semitransparent sample can be stereoscopically observed is provided. The microscope includes a placement portion for placing the sample thereon, a magnifier for magnifying the sample to a size viewable through an objective lens, a pattern body where a pattern has been drawn, and a light projector for applying light to at least the pattern body. The placement portion, the pattern body, and the light projector are arranged at positions which enable light projected from the light projector to be applied through the pattern body to the sample arranged within a depth of field of the magnifier by the placement portion. | 06-10-2010 |
Tsuyoshi Eda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100013092 | Semiconductor device and manufacturing method therefor - Provided is a semiconductor device having a bump structure which is capable of resolving inconvenience in mounting. The semiconductor device comprises: an electrode pad; and a columnar bump formed on the electrode pad, the columnar bump comprising: a first high melting point metal layer ( | 01-21-2010 |
| 20110001508 | SEMICONDUCTOR INTEGRATED CIRCUIT, AND METHOD FOR TESTING SEMICONDUCTOR INTEGRATED CIRCUIT - In order to reduce the number of electrodes included in test patterns, the semiconductor integrated circuit includes, a plurality of first and second chains, a first common electrode connected to one end of each first chain, a second common electrode connected to one end of each second chain, and a plurality of selection electrodes. Each selection electrode is connected to the other end of any one of the plurality of first chains and to the other end of any one of the plurality of second chains. When a test target chain is selected from the plurality of first chains, a first reference voltage is applied to the first common electrode, a second reference voltage is applied to a target selection electrode that is connected to the test target chain, and a current flowing in the target selection electrode is measured to obtain a resistance value of the test target chain. | 01-06-2011 |