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Eckberg

Eric A. Eckberg, Rochester, MN US

Patent application numberDescriptionPublished
20080266798SYSTEM AND METHOD FOR LIQUID COOLING OF AN ELECTRONIC SYSTEM - A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion.10-30-2008
20090038171ALIGNMENT TOOL FOR ASSEMBLY OF MICROPROCESSOR BOARD TO SERVER CHASSIS - An alignment tool for assembly of a microprocessor board to a server chassis includes a peg hole portion receptive of a first peg of the server chassis and at least one filler tab insertable between the first peg and a secondary hole of the microprocessor board. The alignment tool further includes an orientation hole portion receptive of a second peg of the server chassis, and connected to the peg hole portion. A method of aligning the server chassis to the microprocessor board utilizing the alignment tool includes placing the alignment tool with the peg hole portion over the first peg and an orientation hole portion over a second peg. The microprocessor board, including a secondary hole, is placed over the server chassis such that the secondary hole is placed over the first peg. At least one filler tab of the alignment tool is inserted into a gap between the first peg and the secondary hole.02-12-2009
20090308033MODIFIED HEXAGONAL PERFORATED PATTERN - Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.12-17-2009

Patent applications by Eric A. Eckberg, Rochester, MN US

Richard P. Eckberg, Hillsborough, NC US

Patent application numberDescriptionPublished
20100151240Laminate Containing Solvent Resistant Polyurethane Adhesive Compositions - A laminate includes a backing material coated with a solvent resistant adhesive composition. The adhesive composition includes a hydroxyl or urea or hydrocarbon terminated unsaturated polyurethane or polyurethane-urea polymer and a peroxide or a silicone hydride.06-17-2010

Richard Paul Eckberg, Saratoga Springs, NY US

Patent application numberDescriptionPublished
20110033715Paper Release Compositions Having Improved Adhesion to Paper and Polymeric Films - The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.02-10-2011

Patent applications by Richard Paul Eckberg, Saratoga Springs, NY US

Ulf P. Eckberg, Soquel, CA US

Patent application numberDescriptionPublished
20110113020MAINTAINING CONSISTENCY IN A DATABASE - Maintaining consistent DNS information is disclosed. Information associated with a resource is received. A resource record is populated with the information. View information is derived from the resource record.05-12-2011