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Ebe, JP
Akinori Ebe, Kyoto-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100263797 | PLASMA PROCESSING APPARATUS - The present invention aims at providing a plasma processing apparatus for performing a plasma processing on a planar substrate body to be processed, the apparatus being capable of generating the plasma with good uniformity and efficiently using the plasma, and having a high productivity. That is, the plasma processing apparatus according to the present invention includes: a vacuum chamber; one or plural antenna supporters (plasma generator supporters) projecting into the internal space of the vacuum chamber; radio-frequency antennas (plasma generators) attached to each antenna supporter; and a pair of substrate body holders provided across the antenna supporter in the vacuum chamber, for holding a planar substrate body to be processed. | 10-21-2010 |
| 20100304046 | PLASMA GENERATOR, PLASMA CONTROL METHOD AND METHOD OF PRODUCING SUBSTRATE - The present invention aims to provide a plasma generator capable of creating a spatially uniform distribution of high-density plasma. This object is achieved by the following construction. Multiple antennas are located on the sidewall of a vacuum chamber, and a RF power source is connected to three or four antennas in parallel via a plate-shaped conductor. The length of the conductor of each antenna is shorter than the quarter wavelength of the induction electromagnetic wave generated within the vacuum chamber. Setting the length of the conductor of the antenna in such a manner prevents the occurrence of a standing wave and thereby maintains the uniformity of the plasma within the vacuum chamber. In addition, the plate-shaped conductor improves the heat-releasing efficiency, which also contributes to the suppression of the impedance. | 12-02-2010 |
| 20110080094 | RADIO-FREQUENCY ANTENNA UNIT AND PLASMA PROCESSING APPARATUS - The present invention aims at providing a radio-frequency antenna unit capable of generating a high-density discharge plasma in a vacuum chamber. The radio-frequency antenna unit according to the present invention includes: a radio-frequency antenna through which a radio-frequency electric current can flow; a protective tube made of an insulator provided around the portion of the radio-frequency antenna that is in the vacuum chamber; and a buffer area provided between the radio-frequency antenna and the protective tube. The “buffer area” refers to an area where an acceleration of electrons is suppressed, and it can be formed, for example, with a vacuum or an insulator. Such a configuration can suppress an occurrence of an electric discharge between the antenna and the protective tube, enabling the generation of a high-density discharge plasma in the vacuum chamber. | 04-07-2011 |
| 20110115380 | PLASMA GENERATION DEVICE AND PLASMA PROCESSING DEVICE - A flange, which forms a portion of a vacuum container, has a rectangular opening surrounded by an insulating frame. A plate-shaped radio-frequency antenna conductor | 05-19-2011 |
Akinori Ebe, Kyoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20100189921 | PLASMA GENERATING METHOD, PLASMA GENERATING APPARATUS, AND PLASMA PROCESSING APPARATUS - A plasma generating method and apparatus which use plural high-frequency antennas | 07-29-2010 |
Hiroji Ebe, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20080308788 | QUANTUM DOT SEMICONDUCTOR DEVICE - A quantum dot semiconductor device includes an active layer having a plurality of quantum dot layers each including a composite quantum dot formed by stacking a plurality of quantum dots and a side barrier layer formed in contact with a side face of the composite quantum dot. The stack number of the quantum dots and the magnitude of strain of the side barrier layer from which each of the quantum dot layers is formed are set so that a gain spectrum of the active layer has a flat gain bandwidth corresponding to a shift amount of the gain spectrum within a desired operation temperature range. | 12-18-2008 |
Hiroji Ebe, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110134950 | Method of manufacturing semiconductor device - The method of manufacturing the semiconductor device comprises the step of forming quantum dots | 06-09-2011 |
Hiroji Ebe, Kawasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090305442 | LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME - The light emitting device comprises a substrate | 12-10-2009 |
Kazutoshi Ebe, Nisshin-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110152709 | MOBILE BODY CONTROL DEVICE AND MOBILE BODY CONTROL METHOD - A mobile body control device includes: a brain activity detecting unit that detects brain activity information of a user; a brain signal separating unit that separates an artifact component from the brain activity information detected by the brain activity detecting unit; a control signal generating unit that slides a sampling period for extracting brain data, at predetermined intervals in an overlapped manner in the brain activity information from which the artifact component is separated, successively calculates feature values for the brain data within each of the sampling periods obtained by sliding, and generates a control signal based on the feature values calculated; and a drive control unit that drives and controls a mobile body with a user riding thereon, based on the control signal generated. | 06-23-2011 |
Kiyoshi Ebe, Ibaraki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080235901 | ELECTRIC VACUUM CLEANER - In a suctioning state, even if the amount of dust trapped in a dust collecting unit in a main air passage is increased, air suctioned from a hose connection port is branched into a first half passage and reduction in the suction air amount can be suppressed. When the suctioning state is switched to a dust moving state by switch means, the dust trapped in a pleated filter is moved to the dust collecting unit, increase in the air passage resistance at the first half passage side caused by clogging of the pleated filter can be suppressed, and reduction in suction power over time can be suppressed. Since an upper air passage and lower air passage are provided in the lid body, the dust collecting unit is exposed with the lid body opened, whereby maintenance performance of the dust collecting unit is improved. | 10-02-2008 |
Kouhei Ebe, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090054729 | ENDOSCOPE INSERTION SUPPORT SYSTEM AND ENDOSCOPE INSERTION SUPPORT METHOD - According to the invention, a VOI generation setting section disposed in an endoscope insertion support apparatus comprises a VOI setting function section, a VOI extending function section, a VOI direction determining function section, a VOI branch determining function section, a VOI resetting function section, a VOI information storage function section, a VOI size determining function section and a VOI branch extracting function section. This configuration enables a VOI (Volume of Interest) to be effectively set in a tubular organ having a strictured part and tubular path area information on the tubular organ to be extracted. | 02-26-2009 |
Masayoshi Ebe, Nagano-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090056992 | WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN - A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin. | 03-05-2009 |
Masayoshi Ebe, Nagano JP
| Patent application number | Description | Published |
|---|---|---|
| 20100214751 | CHIP COMPONENT MOUNTED WIRING BOARD - A wiring board to be used with being mounted on a packaging board includes a chip component surface-mounted on a surface facing the packaging board. The chip component includes terminal electrodes at both end portions of the component body thereof. Each of the terminal electrodes is provided in a form in which a plated film (Sn) formed on the surface of the terminal electrode is separated into two portions, one portion being on the wiring board side, and another portion being on the packaging board side. In one aspect, each of the terminal electrodes of the chip component is separated into a portion on the wiring board side and a portion on the packaging board side, and the plated film (Sn) is formed on a surface of each of the separated portions of each of the terminal electrodes. | 08-26-2010 |
Michihiro Ebe, Miyagi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080233664 | Semiconductor integrated circuit production method and device - A semiconductor integrated circuit production method prepares an SOI layer thickness database that correlates measurement data of each SOI layer thickness with each SOI substrate identification data. The production method extracts the measurement data for each SOI substrate from the SOI layer thickness database, and carries out layer thickness adjustment surface treatment for the SOI substrates based on these data. A semiconductor integrated circuit production device includes an SOI layer thickness database storage unit for storing the SOI layer thickness database, and a layer thickness adjustment conditions control unit for extracting the measurement data for each SOI substrate from the SOI layer thickness database and deciding conditions for the layer thickness adjustment surface treatment based on these data. The semiconductor integrated circuit production device also includes a surface treatment unit that adjusts SOI layer thickness by carrying out the surface treatment on the SOI layers in accordance with the decided conditions. | 09-25-2008 |
Takaaki Ebe, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080298854 | Developing device and image forming apparatus - A developing device includes a developer supporting member abutting against an image supporting member for developing a static latent image on the image supporting member. In a state that a film member is disposed between the image supporting member and the developer supporting member, it is arranged such that the film member is extended with a tensional force N (N) when the image supporting member and the developer supporting member rotate. The tensional force N has a relationship as follows: | 12-04-2008 |
| 20090185837 | Developing device and image forming apparatus - A developing device includes a developer supporting member having an elastic layer and a surface layer, and a supply member for supplying developer to the developer supporting member. The surface layer is formed of a mixture containing at least an acrylic resin and a polyether type urethane resin. The developer supporting member and the supply member are configured so that the following equations are satisfied: | 07-23-2009 |
| 20110052272 | DEVELOPER MATERIAL CARRYING BODY, DEVELOPING UNIT, AND IMAGE FORMING APPARATUS - A developer material carrying body rotates in contact with an image carrying body on which an electrostatic latent image is formed. The developer material carrying body deposits a developer material to the electrostatic latent image. The developer material carrying body includes a surface having a surface potential (Vo) 0.15 seconds after having been charged, and a relaxation time (τ) required for the surface potential changes to change from Vo to Vo/e. The surface potential and relaxation time are related such that 2.0≦Vo≦10 and 0<τ<0.20. | 03-03-2011 |
| 20110135344 | Developing device and image forming apparatus - A developer bearing body rotates in a first direction. A supply brush roller, out of contact with the body, also rotates in the first direction. A brush contact member has a first contact portion in contact with bristles of the roller above a first horizontal plane passing through a rotational axis of the roller and upstream in the first rotational direction of the roller, of a portion of the roller opposing the body. A thickness adjusting member has a second contact portion in contact with the body below a second horizontal plane passing through a rotational axis of the body and downstream in the first rotational direction of the body, of the portion of the roller opposing the body. A first vertical plane passing through the first contact portion is closer to the axis of the roller than is a second vertical plane passing through the second contact portion. | 06-09-2011 |