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Dye
Albert Dye, Coatbridge GB
| Patent application number | Description | Published |
|---|---|---|
| 20090278124 | SCRIBE BASED BOND PADS FOR INTEGRATED CIRCUITS - An apparatus including a semiconductor substrate is disclosed. A first semiconductor die is disposed on the semiconductor substrate. A first bond out pad is disposed on the semiconductor substrate adjacent to the first semiconductor die. A first sawn semiconductor die is disposed on the semiconductor substrate adjacent to the first semiconductor die and the first bond out pad. | 11-12-2009 |
Julian Dye, Middlesex GB
| Patent application number | Description | Published |
|---|---|---|
| 20090324719 | EXTRACELLULAR MATRIX COMPOSITION - The invention relates to a process for preparing an extracellular matrix composition comprising cross-linked fibrinogen or a derivative thereof, to an extracellular matrix composition obtained by said process and to the use of said composition in wound healing, tissue regeneration or as a tissue engineering scaffold. | 12-31-2009 |
Michael John Dye, Oxford GB
| Patent application number | Description | Published |
|---|---|---|
| 20110195451 | Protein Expression - An isolated DNA molecule having a sequence which comprises in a 5′ to 3′ direction (i) one or more promoter elements, (ii) the geneof interest, and (iii) a poly-adenylation 5 signal, and (iv) a terminator element, and expressing the geneof interest incorporated into the DNA molecule in an expression system, and use of said molecule to enhance expression of a gene of interest. | 08-11-2011 |