| Patent application number | Description | Published |
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| 20090046746 | PULSED FIBER LASER - A fiber laser system includes a master oscillator configured to generate linear polarized infrared laser radiation with wavelengths of 1015-1085 nm, pulses with durations of 100 ps to 10 ns, pulse train repetition rates of 1 kHz to 10 MHz, spectral bandwidth less than 0.5 nm, and a predominately single spatial mode and a polarization-maintaining optical isolator optically coupled to the master oscillator. The fiber laser system also includes a fiber amplifier system optically coupled to the optical isolator and including a power amplifier configured to amplify the laser radiation transmitted through the optical isolator. The power amplifier includes a polarization-maintaining, large-mode-area, multiple-clad Yb-doped gain fiber having a core, an inner cladding, and at least an outer cladding, one or more diode pump lasers emitting pump light of a nominal wavelength of 976 nm, and a pump coupler configured to couple the pump light into the gain fiber. | 02-19-2009 |
| 20090067035 | METHOD AND APPARATUS FOR CONTINUOUS WAVE HARMONIC LASER - An apparatus for producing coherent, continuous wave, ultraviolet light, includes one or more source lasers in the visible or near-infrared frequency range. The apparatus also includes one or more frequency conversion stages. Each of the one or more frequency conversion stages includes one or more reflectors, an optical resonator, one or more waveguide components, or one or more fiber optic components. At least one of the one or more frequency conversion stages includes a huntite-type aluminum double borate nonlinear optical material to produce light having a wavelength between 190 and 350 nm. The huntite-type aluminum double borate material has a composition given by MAl | 03-12-2009 |
| 20090107962 | METHOD AND APPARATUS FOR A HYBRID MODE-LOCKED FIBER LASER - An apparatus for producing coherent pulsed light with a fiber-based master oscillator/fiber amplifier architecture includes a fiber-coupled mode-locked laser source. The fiber-coupled mode-locked laser source is configured to provide pulses having a pulse duration of less than 1 ns. The apparatus also includes a fiber-coupled amplitude modulator optically coupled to the fiber-coupled mode-locked laser source. The fiber-coupled amplitude modulator is capable of gate durations greater than 1 ns. The apparatus further includes a saturated fiber power amplifier optically coupled to the fiber-coupled amplitude modulator. | 04-30-2009 |
| 20090201954 | METHOD AND APPARATUS FOR PULSED HARMONIC ULTRAVIOLET LASERS - An apparatus for producing coherent, pulsed ultraviolet light with pulse durations that range between 1 ps and 1 μs includes one or more source lasers in the visible or near-infrared frequency range. The apparatus also includes one or more FC stages, at least one of the one or more FC stages including a nonlinear FC device and one or more optical elements. The optical elements include a reflector, a focusing element, a polarization-controlling optic, a wavelength separator, or a fiber optic component. The FC device includes a huntite-type aluminum double borate nonlinear optical material configured to produce FC light having a wavelength between 190 and 350 nm and a composition given by RAl | 08-13-2009 |
| 20110128613 | METHOD AND APPARATUS FOR PULSED HARMONIC ULTRAVIOLET LASERS - An apparatus for producing coherent, pulsed ultraviolet light with pulse durations that range between 1 ps and 1 μs includes one or more source lasers in the visible or near-infrared frequency range. The apparatus also includes one or more FC stages, at least one of the one or more FC stages including a nonlinear FC device and one or more optical elements. The optical elements include a reflector, a focusing element, a polarization-controlling optic, a wavelength separator, or a fiber optic component. The FC device includes a huntite-type aluminum double borate nonlinear optical material configured to produce FC light having a wavelength between 190 and 350 nm and a composition given by RAl | 06-02-2011 |
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| 20080256374 | Sharing Non-Sharable Devices Between an Embedded Controller and A Processor in a Computer System - System and method for sharing a device, e.g., non-volatile memory, between a host processor and a microcontroller. In response to system state change to a first state wherein the microcontroller is assured safe access to the non-volatile memory (e.g., in response to power-on reset, system reset, sleep state, etc.), the microcontroller holds the system in the first state (e.g., system reset), and switches access to the non-volatile memory from the processor to the microcontroller. While the system is held in the first state, the microcontroller accesses the device (e.g., non-volatile memory), e.g., fetches program instructions/data from the non-volatile memory and loads the program instructions/data into a memory of the microcontroller. After the access, the microcontroller changes or allows change of the system state, e.g., switches access to the device, e.g., the non-volatile memory, from the microcontroller to the processor, and releases the system from the first state. | 10-16-2008 |
| 20090058429 | Detecting Closure of an Electronic Device Using Capacitive Sensors - System and method for determining closure of an electronic device. The electronic device may include a top portion and a bottom portion, and may be connecting via a hinge or other closing mechanism. The top portion and/or the bottom portion may include one or more capacitive sensors which provide signals corresponding to physical contact and a controller coupled to the one or more capacitive sensors. The controller may operate to receive the signals from the one or more capacitive sensors, determine if the electronic device has been closed based on the received signals, and initiate a sequence of events corresponding to the closure of the electronic device. The sequence of events may result in the device entering a low power state. | 03-05-2009 |
| 20090327678 | Enhancing Security of a System Via Access by an Embedded Controller to A Secure Storage Device - System and method for performing pre-boot security verification in a system that includes a host processor and memory, an embedded microcontroller with an auxiliary memory, e.g., an on-chip ROM, or memory controlled to prohibit user-tampering with the contents of the memory, and one or more pre-boot security components coupled to the embedded microcontroller. Upon power-up, but before host processor boot-up, the embedded microcontroller accesses the auxiliary memory and executes the program instructions to verify system security using the one or more pre-boot security components. The one or more pre-boot security components includes at least one identity verification component, e.g., a smart card, or a biometric sensor, e.g., a fingerprint sensor, a retinal scanner, and/or a voiceprint sensor, etc., and/or at least one system verification component, e.g., TPM, to query the system for system state information, and verify that the system has not been compromised. | 12-31-2009 |
| 20100039121 | LOW COST FINGERPRINT SENSOR SYSTEM - Low cost fingerprint system having a single chip solution includes a circuit board, a fingerprint sensor array fabricated onto a first surface of the circuit board, and an integrated circuit die for processing information received from the fingerprint sensor array is mounted directly to a second surface of the circuit board. The integrated circuit die may be electrically connected to the sensor by, for example, vias in the circuit board. | 02-18-2010 |
| 20110240189 | INTERLOCKING COMPRESSIBLE, PAIRED SPOKE WHEEL SYSTEM - An interlocking, compressible spoke wheel system having a ring of paired spokes. The locking of left and right spokes into pairs provides improved tire displacement under loads. The left and right half wheels formed by sets of left spokes and right spokes. enable a novel mounting system for the wheel rim or tire to attach to the spoke system. | 10-06-2011 |
| Patent application number | Description | Published |
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| 20080289858 | PRINTED CIRCUITS AND METHOD FOR MAKING SAME - A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. | 11-27-2008 |
| 20080292784 | Method for Metallizing Liquid Crystal and Polymer - A method for making printed circuits and printed circuit boards which utilizes a process for forming a thin metal layer, such as a copper layer, on underlying substrates such as a liquid crystalline polymer material. Forming such a thin metal layer on the surface of the substrate enables fine line imaging for forming printed circuits and printed circuit boards. The process includes providing a metallized substrate, removing the metal from the substrate, vacuum baking the substrate, dipping the substrate in permanganate solution, rinsing the substrate with water, neutralizing the substrate, subjecting the substrate to an electroless copper procedure and plating the substrate with copper. | 11-27-2008 |
| 20080292796 | Method and Apparatus for Forming Plated Liquid Crystalline Polymer Substrate - A method and apparatus for forming plated liquid crystalline polymer substrates which includes placing a plated liquid crystalline polymer substrate on or within a fixture and applying vacuum and heat to the fixture and the plated liquid crystalline polymer substrate. The plated liquid crystalline polymer substrate may contain printed circuits and can be formed to any shape, configuration, and size without destroying the printed circuits contained on the liquid crystalline polymer substrate. | 11-27-2008 |
| 20090020314 | DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS - A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion. | 01-22-2009 |
| 20090020315 | AUTOMATED DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS AND MULTILAYER PRINTED CIRCUITS - A method for making multilayer printed circuits includes a) coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, b) imaging the coated substrate with a circuit design, c) developing the imaged substrate, d) directly plating the developed image onto the coated substrate, e) coating the plated substrate with a liquid photoimageable cover coat, f) imaging the coated plated substrate with a predesigned circuitry, g) developing the liquid photoimageable cover coat, and repeating steps a) through d). Steps e) through g) are then repeated followed by steps a) through d) until a desired number of layers is achieved for the multilayer circuit. The method may be automated by having a conveyer like system which automatically unrolls and directs a roll of non-metallized substrate through various coating, imaging, developing, and plating stations. | 01-22-2009 |
| 20100326711 | PRINTED CIRCUITS AND METHOD FOR MAKING SAME - A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium. | 12-30-2010 |
