| Patent application number | Description | Published |
|---|
| 20100132994 | APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT - An apparatus and method, the apparatus includes an electronic chip package including an electronic chip having a first contact pad and a second contact pad thereon and being free of an intervening contact pad therebetween, a first dielectric layer coupled to the electronic chip over the first and second contact pads, and a second dielectric layer coupled to the first dielectric layer such that a dielectric layer boundary is formed therebetween. The first dielectric layer has a first contact pad via formed therethrough at a first location corresponding to the first contact pad and extending down thereto. The second dielectric layer has a second contact pad via formed therethrough at a second location corresponding to the second contact pad and extending down thereto such that a second contact pad multi-layer via is formed through the first and second dielectric layers at the second location corresponding to the second contact pad. | 06-03-2010 |
| 20100133683 | SYSTEM AND APPARATUS FOR VENTING ELECTRONIC PACKAGES AND METHOD OF MAKING SAME - An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers. | 06-03-2010 |
| 20100133705 | APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT - An apparatus and method, the apparatus includes an electronic chip package including an electronic chip having a first and a second contact pad formed thereon, a first dielectric layer coupled to the electronic chip, a second dielectric layer coupled to the first dielectric layer such that a dielectric boundary lies therebetween, a first and a second cover pad positioned along the dielectric boundary, a metal interconnect formed along a first multi-layer via and coupled to the first cover pad and contact pad, and a metal interconnect formed along a second multi-layer via and coupled to the second cover pad and contact pad. The first multi-layer via extends through the second dielectric layer, the first cover pad, and the first dielectric layer to the first contact pad. The second multi-layer via extends through the second dielectric layer, the second cover pad, and the first dielectric layer to the second contact pad. | 06-03-2010 |
| 20100224992 | SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP - An embedded chip package (ECP) includes a plurality of re-distribution layers joined together in a vertical direction to form a lamination stack, each re-distribution layer having vias formed therein. The embedded chip package also includes a first chip embedded in the lamination stack and a second chip attached to the lamination stack and stacked in the vertical direction with respect to the first chip, each of the chips having a plurality of chip pads. The embedded chip package further includes an input/output (I/O) system positioned on an outer-most re-distribution layer of the lamination stack and a plurality of metal interconnects electrically coupled to the I/O system to electrically connect the first and second chips to the I/O system. Each of the plurality of metal interconnects extends through a respective via to form a direct metallic connection with a metal interconnect on a neighboring re-distribution layer or a chip pad on the first or second chip. | 09-09-2010 |
| Patent application number | Description | Published |
|---|
| 20110040588 | VIRTUAL MEETING AGGREGATOR SYSTEM AND METHOD - A meeting aggregator system and method enables the formulation of various meeting plan options, analysis of the return on investment and costs associated with each option. The meeting aggregator system accesses an inventory of meeting facilities (e.g., telepresence facilitites, web conference rooms, conference rooms for live meetings, etc.). The meeting aggregator accesses a variety of data sources and implements custom cost calculations to consider travel costs, cultural factors, environmental factors, travel policies and user preferences. A decision tool provides users access to interactive planning, analysis and resource booking. | 02-17-2011 |
| 20110040591 | VIRTUAL MEETING AGGREGATOR PRICE COMPARISON SYSTEM AND METHOD - A meeting aggregator system and method enables the formulation of various meeting plan options, analysis of the return on investment and costs associated with each option. The meeting aggregator system accesses an inventory of meeting facilities (e.g., telepresence facilities, web conference rooms, conference rooms for live meetings, etc.). The meeting aggregator accesses a variety of data sources and implements custom cost calculations to consider travel costs, cultural factors, environmental factors, travel policies and user preferences. A decision tool provides users access to interactive planning, analysis and resource booking. | 02-17-2011 |
