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Duesterberg
Bernd Duesterberg, Oberkraemer DE
| Patent application number | Description | Published |
|---|---|---|
| 20100173877 | MULTI-PHASE CONTRACEPTIVE PREPARATION BASED ON A NATURAL ESTROGEN - The multiphase preparation having higher contraceptive safety and reduced side effects is based on a combination of a natural oestrogen with dienogest or drospirenon. The multiphase prepration is characterized by a first phase consisting of 2 daily dose dose units of 3 mg of oestradiol valerate, a second phase consisting of 2 groups of daily dose units, wherein a first group is formed by 5 daily dose units each containing a combination of 2 mg of oestradiol valerate and at least two or three times an ovulation-inhibitory dose of dienogest or drospirenon and a second group is formed by 17 daily dose units each containing a combination of 2 mg of oestradiol valerate and at least three or four times the ovulation-inhibitory dose of dienogest or drospirenon, a third phase consisting of 2 daily dose units of 1 mg of oestradiol valerate, and a further phase consisting of 2 daily dose units of pharmaceutically acceptable placebo. | 07-08-2010 |
| 20110124612 | MULTI-PHASE CONTRACEPTIVE PREPARATION BASED ON A NATURAL ESTROGEN - The multiphase preparation having higher contraceptive safety and reduced side effects is based on a combination of a natural oestrogen with dienogest or drospirenon. The multiphase prepration is characterized by a first phase consisting of 2 daily dose dose units of 3 mg of oestradiol valerate, a second phase consisting of 2 groups of daily dose units, wherein a first group is formed by 5 daily dose units each containing a combination of 2 mg of oestradiol valerate and at least two or three times an ovulation-inhibitory dose of dienogest or drospirenon and a second group is formed by 17 daily dose units each containing a combination of 2 mg of oestradiol valerate and at least three or four times the ovulation-inhibitory dose of dienogest or drospirenon, a third phase consisting of 2 daily dose units of 1 mg of oestradiol valerate, and a further phase consisting of 2 daily dose units of pharmaceutically acceptable placebo. | 05-26-2011 |
Bernd Duesterberg, Oberkramer / Ot Barenklau DE
| Patent application number | Description | Published |
|---|---|---|
| 20110146693 | INTRAUTERINE DELIVERY SYSTEM FOR CONTRACEPTION - The invention relates to a method for contraception and for reducing menstrual problems and inducing amenorrhea, wherein an intrauterine delivery device is used for the controlled release of a combination of progestogen or a drug having a progestogenic activity and at least one therapeutically active substance capable of preventing or suppressing abnormal and/or irregular endometrial bleeding over a prolonged period of time. | 06-23-2011 |
Richard Duesterberg, Mountain View, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090052857 | Component Assembly And Fabrication Method - The present invention relates to a component assembly and to a method of fabricating such a component assembly. The component assembly includes a substrate, a mount attached to the substrate, and a component attached to the mount with solder by melting the solder with light from a light source. The mount is composed of a ceramic material having properties advantageous for soldering using a light source. As a first property, the ceramic material is optically absorptive to enable the mount to be heated by the light from the light source. As a second property, the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder, the second thermal conductivity being at least 25% lower than the first thermal conductivity. | 02-26-2009 |
Richard L. Duesterberg, Mountain View, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080212916 | Polarization Maintaining Fiber Pigtail Assembly - The invention provides a fiber pigtail assembly wherein a polarization maintaining fiber is soldered directly to a mounting pad without a sleeve or a ferrule therebetween. A portion of the polarization maintaining fiber near a fiber end is embedded in a vertical slow axis orientation within an asymmetrical solder ball having a flat portion for adhering to the mounting pad. The vertical slow axis orientation of the polarization maintaining fiber within the solder ball enhances power stability and polarization extinction ratio properties of optical modules utilizing the invention. | 09-04-2008 |
| 20110026558 | LIGHT EMITTING SEMICONDUCTOR DEVICE - A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device. | 02-03-2011 |
| 20110026877 | SEMICONDUCTOR DEVICE ASSEMBLY - A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device. | 02-03-2011 |