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Duboc
Agnes Duboc, Paris FR
| Patent application number | Description | Published |
|---|---|---|
| 20100062987 | ANTICONVULSIVE PHARMACEUTICAL COMPOSITIONS - The present invention pertains to pharmaceutical compositions including, as the active ingredients, a combination of vigabatrin and of at least one glutamate receptor activating substance. | 03-11-2010 |
Agnes Duboc, Strasbourg FR
| Patent application number | Description | Published |
|---|---|---|
| 20090292021 | ANTICONVULSIVE PHARMACEUTICAL COMPOSITIONS - Pharmaceutical compositions including, as the active ingredients, a combination of vigabatrin and of at least one substance having anti-ischemic effect, are disclosed. | 11-26-2009 |
Carol Duboc, Pacific Palisades, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120000013 | TOILET PLUNGER CLEANING SYSTEM - A toilet plunger cleaning system wherein a toilet plunger is provided having a handle with an inner chamber and a plunger head. The handle chamber has a reciprocating cylinder filled with a cleaning fluid. A plurality of circumferentially spaced normally closed holes are provided in the handle communicating with holes in the cylinder. A lever on the exterior of the handle is activated to align the holes in the cylinder with the holes in the handle to release fluid about the lower portion of the handle and the plunger head to clean and/or sanitize the same. | 01-05-2012 |
Philippe Duboc, Bern CH
| Patent application number | Description | Published |
|---|---|---|
| 20110003040 | CULINARY CAPSULE - Described is a capsule comprising a plurality of compacted food articles comprising a dehydrated food powder mixed in a fat-based binding system. A method for the production of the capsule is further described. | 01-06-2011 |
Robert M. Duboc, Menlo Park, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090098685 | Low Cost Hermetically Sealed Package - Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices. | 04-16-2009 |