| Patent application number | Description | Published |
| 20090316367 | HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip. The clip includes a main body, two pressing portions extending outwardly from two opposite ends of the main body, two extension portions each extending upwardly from an outer end of a corresponding pressing portion, a locking arm extending slantwise and upwardly from an upper end of each extension portion, a U-shaped operating portion extending from a far end of the locking arm and a J-shaped hook extending from a free end of the operating portion. The operating portion is provided for receiving a depressing force acting on the clip for moving the hook to engage with a clasp on a printed circuit board. | 12-24-2009 |
| 20100108362 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE - An electronic system includes a printed circuit board, a base, and a wire clip. The printed circuit board includes an electronic component and a plurality of hooks around the electronic component. The base thermally contacts the electronic component of the printed circuit board. Two clasps are formed at opposite ends of the base. The wire clip includes two pressing portions, two first connecting portions extending inwardly from first ends of the two pressing portions respectively, and two second connecting portions extending inwardly from second ends of the two pressing portions respectively. The first and second ends of the pressing portion are opposite. The pressing portions of the wire clip are clasped by the clasps of the base. The first connecting portions engage with two hooks of the printed circuit board, and the second connecting portions engage with another two hooks of the printed circuit board. | 05-06-2010 |
| 20100172103 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component. | 07-08-2010 |
| 20110127006 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes mounting feet and fasteners mounted on the mounting feet. Each fastener includes a shaft and two latching portions extending outwardly from an outer circumference of an end of the shaft. Each mounting foot defines a through hole allowing extension of the end of the shaft with two second portions. Each mounting foot defines two latching recesses in a surface thereof. Each of the latching recesses defines two blocking surfaces. When the end of the shaft with the latching portion extends through the through hole and beyond the surface of a corresponding mounting foot, the shaft is rotated with respect to the through hole so as to make the latching portion be received in the latching recesses. The blocking surfaces of the latching recesses stop the latching portions rotating with respect to the through hole to escape from the corresponding mounting foot. | 06-02-2011 |
| Patent application number | Description | Published |
| 20100321278 | PANEL FOR A DISPLAY AND ELECTRONIC DEVICE USING SAME - A panel for a display comprises a transparent substrate, a first light transmission enhancing coating formed on one surface of the substrate, a second light transmission enhancing coating formed on the other surface of the substrate, and a metallic coating formed on the second light transmission enhancing coating. An electronic device using the panel is also provided. | 12-23-2010 |
| 20100328195 | PANEL FOR A DISPLAY AND ELECTRONIC DEVICE USING SAME - A panel for a display comprises a transparent substrate, an anti-reflection coating formed on one surface of the substrate, and a metallic coating formed on the anti-reflection coating. The substrate is formed with a plurality of light scattering portions whose density gradually changes on one surface of the substrate. An electronic device using the panel is also provided. | 12-30-2010 |
| 20100330331 | PANEL FOR A DISPLAY AND ELECTRONIC DEVICE USING SAME - A panel for a display comprises a transparent substrate, a color changing coating formed on one surface of the substrate, an anti-reflection coating formed on the color changing coating, and a metallic coating formed on the anti-reflection coating. The substrate is formed with a plurality of light scattering portions whose density gradually changes on one surface of the substrate. An electronic device using the panel is also provided. | 12-30-2010 |
| 20110143062 | ELECTRONIC DEVICE HOUSING - An electronic device housing includes a substrate and a metallic coating formed on the substrate. The substrate has a surface roughness of less than 60 nm. The metallic coating includes a plurality of first layers and a plurality of second layers. Each one of the first layers and each one of the second layers are alternately deposited on each other. The first layer and the second layer may be respectively tantalum pentoxide layer and silicon dioxide layer or may be respectively niobium pentoxide layer and zirconium dioxide layer. | 06-16-2011 |
| 20110155409 | ELECTRONIC DEVICE HOUSING - An electronic device housing is provided. The electronic device housing includes a substrate, a metallic-appearing coating formed on the substrate, and a top coating formed on the metallic-appearing coating. The top coating contains nano-titanium dioxide powder and fluorocarbon resin. The electronic device housing has self-cleaning and anti-fingerprint properties. | 06-30-2011 |
| 20110159258 | ELECTRONIC DEVICE HOUSING AND METHOD FOR MAKING THE SAME - An electronic device housing includes a substrate and a nano titanium dioxide coating formed on the substrate is provided. The nano titanium dioxide coating has a thickness of about 10-100 nm. The nano titanium dioxide coating is formed of rutile crystals or composite crystals formed of rutile and anatase. A method for making the electronic device is also described there. | 06-30-2011 |
| 20110159275 | ELECTRONIC DEVICE HOUSING - An electronic device housing is provided. The electronic device housing includes a substrate, a metallic coating formed on the substrate, and a top paint coating formed on the metallic coating. The top paint coating contains nano-titanium dioxide powder. The top paint coating has a self-cleaning property. It can oxygenize and clean off dust and sweat accumulated on the surface of the electronic device housing. | 06-30-2011 |
| 20110159277 | ELECTRONIC DEVICE HOUSING - An electronic device housing is provided. The electronic device housing comprises a substrate, a base paint coating formed on the substrate, and a metallic coating formed on the base paint coating. The metallic coating comprises a plurality of first layers interleaved with a plurality of second layers, and a third layer provided outermost. The first layer and the second layer are respectively a zirconium dioxide layer and an aluminum oxide layer, or are respectively composite component layer of niobium pentoxide and zirconium dioxide, and silicon dioxide layer. The third layer is a magnesium fluoride layer. | 06-30-2011 |
| 20110256361 | ELECTRONIC DEVICE HOUSING AND METHOD FOR MAKING THE SAME - An electronic device housing is provided. The electronic device housing includes a substrate, a first metallic coating formed on the substrate, and a second metallic coating formed on a portion of the first metallic coating. The first and second metallic coatings are formed by vacuum sputtering or vacuum vapor deposition. The first and second metallic coatings are all non-conductive. A method for making the electronic device housing is also described there. | 10-20-2011 |
| Patent application number | Description | Published |
| 20090057957 | APPARATUS FOR MAKING MAGNESIUM-BASED CARBON NANOTUBE COMPOSITE MATERIAL AND METHOD FOR MAKING THE SAME - An apparatus for fabrication of a magnesium-based carbon nanotube composite material, the apparatus includes a thixomolding machine, and a feeding device. The thixomolding machine includes a heating barrel, a feeding inlet, a nozzle, a heating portion, and a plunger. The heating barrel includes a first end and a second end. The feeding inlet is disposed at the first end. The nozzle is disposed at the second end. The heating portion is disposed around the heating barrel. The plunger is disposed at a center of the heating barrel. The feeding device includes a hopper; an aspirator connected to the hopper, a first container, and a second container. The hopper is in communication with the first container and the second container. A method for fabricating a magnesium-based carbon nanotube composite material is also provided. | 03-05-2009 |
| 20090081408 | MAGNESIUM-BASED COMPOSITE MATERIAL AND METHOD FOR MAKING THE SAME - The present invention relates to a magnesium-based composite material includes a magnesium-based metallic material, and at least one nanoscale reinforcement film disposed therein. The present invention also relates to a method for fabricating the above-described a magnesium-based composite material, the method includes the steps of: (a) providing at least two magnesium-based plates; (b) providing at least one nanoscale reinforcement film; (c) sandwiching the at least one nanoscale reinforcement film between the at least two magnesium-based plates to form a preform; and (d) hot rolling the preform to achieve the magnesium-based composite material. | 03-26-2009 |
| 20090162574 | Method for making light metal-based nano-composite material - A method for fabricating a light metal-based nano-composite material, the method includes the steps of: (a) providing melted metal and nanoscale reinforcements; (b) ultrasonically dispersing the nanoscale reinforcements in the melted metal by means of ultrasonically mixing to achieve a mixture with the nanoscale reinforcements uniformly dispersed therein; and (c) cooling the mixture. | 06-25-2009 |