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Droege
Andreas Droege, Oberreichenbach DE
| Patent application number | Description | Published |
|---|---|---|
| 20090238509 | MULTIPLE ROW, AXIALLY BIASED ANGULAR BALL BEARING AND METHOD FOR PRODUCTION THEREOF - The invention relates to a multiple-row and axially biased angular ball bearing with a one-piece outer ring and an inner ring consisting of two inner ring halves. In order to facilitate an easy and precise setting of the desired pretensioning force and to produce a transport-safe mount cartridge, it is intended that the axial distance of at least two close-end contact surfaces of the angular ball bearing should be equal to zero in the pretensioned state, and that the axial distance of at least two close-end contact surfaces of the angular ball bearing should be greater than zero in a nonpretensioned state. | 09-24-2009 |
Hartmut Droege, Stuttgart DE
| Patent application number | Description | Published |
|---|---|---|
| 20090205197 | Method of providing flexible heat sink installations for early blade board manufacturing - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks. | 08-20-2009 |
| 20090268410 | FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while live circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks. | 10-29-2009 |
Helmut Droege, Qingdao CN
| Patent application number | Description | Published |
|---|---|---|
| 20100029971 | PROCESS FOR PREPARING ORGANOSILANES - The invention relates to a process for preparing organosilanes of the general formula I | 02-04-2010 |