Patent application number | Description | Published |
20080239643 | DISPLAY DEVICE - A display devise includes a display panel and a chassis base supporting the display panel. At least one reinforcing member is attached to the chassis base to add rigidity to the chassis base and at least one stand is attached to the chassis base to allow the chassis base to stand upright. A guide stand couples the reinforcing member to the stand, the guide stand comprising a body and a reinforcing plate substantially extending at an angle from the body. | 10-02-2008 |
20130294008 | MULTILAYER ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a multilayer electronic component having a structure in which a dielectric layer and an internal electrode layer are alternately laminated, which includes the dielectric layer and the internal electrode layer including metal powder and an inhibitor, wherein the inhibitor includes 0.5 to 20 mol % of a Ca component based on 100 mol % of a barium titanate (BT) base material, and a method for manufacturing the same. | 11-07-2013 |
20140020942 | LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF - A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer. | 01-23-2014 |
20140240897 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device, including a device body having a plurality of dielectric sheets stacked on one another, the device body having spaced-apart sides and circumferential surfaces connecting the sides; internal electrodes formed on the dielectric sheets; an external electrode having a front portion to cover the sides and a band portion to extend from the front portion to cover parts of the circumferential surfaces; and a reinforcement pattern having a plurality of metal patterns arranged facing one another between the internal electrodes and the circumferential surfaces, wherein a distance between the metal patterns may be smaller than thicknesses of the dielectric sheets on which the internal electrodes are formed. | 08-28-2014 |
20140240899 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film. | 08-28-2014 |
20150014040 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME - A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided. | 01-15-2015 |
20150016015 | MULTI-LAYERED CAPACITOR - Disclosed herein is a multi-layered capacitor including: a multi-layered body which includes a capacity part formed by multi-layering a dielectric layer and an internal electrode and a cover part formed by multi-layering the dielectric layer; and a pair of external terminals disposed on both sides of the multi-layered body, in which the cover part is formed by multi-layering a first dielectric layer made of a ferroelectric material and a second dielectric layer made of a paraelectric material, thereby implementing thinness, miniaturization, and high capacity and increasing durability. | 01-15-2015 |
20150016017 | DIELECTRIC COMPOSITION AND MULTI-LAYERED CERAMIC CAPACITOR - A dielectric composition may include a first dielectric powder; and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the first dielectric powder, and a multilayer ceramic capacitor formed using the same. A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body to face each other with the respective dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The dielectric layers are formed of a dielectric composition including a first dielectric powder and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the first dielectric powder. | 01-15-2015 |
20150016019 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD - A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first external electrode layer containing a glass component and disposed on the end surface of the ceramic body and a second external electrode layer being glass-free and covering the first external electrode layer. | 01-15-2015 |
20150043125 | MULTILAYER CERAMIC ELECTRONIC PART, BOARD HAVING THE SAME MOUNTED THEREON, AND MANUFACTURING METHOD THEREOF - A multilayer ceramic electronic part may include: a ceramic body; an active layer including a plurality of first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; an upper cover layer formed on an upper portion of the active layer; a lower cover layer formed on a lower portion of the active layer and having a thickness thicker than that of the upper cover layer; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive layers extended from both end surfaces of the ceramic body onto upper and lower main surfaces thereof; and first and second insulation layers formed on the first and second conductive layers disposed on both end surfaces of the ceramic body. | 02-12-2015 |
20150077898 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer. | 03-19-2015 |