| Patent application number | Description | Published |
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| 20110005823 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 01-13-2011 |
| 20110048780 | METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE - A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate. | 03-03-2011 |
| 20110100689 | ELECTRONICS COMPONENT EMBEDDED PCB - An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line. | 05-05-2011 |
| 20110123808 | INSULATOR AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT - An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer. | 05-26-2011 |
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| 20080311446 | FUEL PROCESSOR HAVING TEMPERATURE CONTROL FUNCTION FOR CO SHIFT REACTOR AND METHOD OF OPERATING THE FUEL PROCESSOR - A fuel processor includes a reformer that generates hydrogen gas by reacting a fuel source and water; a burner that heats the reformer to a temperature suitable for a hydrogen generation reaction; a CO shift reactor that removes CO generated during the hydrogen generation reaction in the reformer; a heating element for heating the CO shift reactor; and a cooling element for cooling the CO shift reactor, wherein the cooling element comprises at least one of a cooling water flow line for heat exchange with the CO shift reactor when cooling water flows through the cooling water flow line and a cooling gas flow line for heat exchange with the CO shift reactor when a cooling gas, which is a burner exhaust gas that has heat exchanged with cooling water, flows through the cooling gas flow line. When the fuel processor is operated, a stable CO removal performance can be maintained since the temperature of the CO shift reactor can be actively controlled. | 12-18-2008 |
| 20100126070 | FUEL REFORMER - A fuel reformer, includes: a reformer burner, which generates a flame in a reforming pipe disposed to surround at least the flame of the reformer burner, the reforming pipe being filled with a reforming catalyst and having corrugated portions on a surface facing the reformer burner and a bottom surface of the reforming pipe disposed adjacent to the flame in which a flame blocking member is disposed between the flame of the reformer burner and the reforming pipe to isolate the flame of the reformer burner from the reforming pipe. | 05-27-2010 |
| 20100154210 | Method of manufacturing a printed circuit board having embedded electronic components - A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet. | 06-24-2010 |
