Doo Hwan
Doo Hwan Kim, Seoul KR
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20100279738 | MOBILE TERMINAL CAPABLE OF RECOGNIZING FINGERNAIL TOUCH AND METHOD OF CONTROLLING THE OPERATION THEREOF - A method of controlling a mobile terminal, and which includes displaying, on a touch screen display of the mobile terminal, an operation screen corresponding to a current operating mode executing on the mobile terminal; detecting, via a detecting device, a touch input on the touch screen display of the mobile terminal; determining, via a controller on the mobile terminal, a first finger characteristic describing a finger touching the touch screen display and a second finger characteristic describing the finger touching the touch screen display that is different than the first finger characteristic; performing, via the controller, a first operation relevant to the current operating mode based on the determined first finger characteristic; and performing, via the controller, a second operation relevant to the current operating mode based on the determined second finger characteristic. | 11-04-2010 |
Doo Hwan Lee, Seoul KR
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20110287807 | COMMUNICATION METHOD AND APPARATUS OF DUAL STANDBY MODE TERMINAL - A communication method and apparatus of a dual standby mode mobile terminal for improving the emission performance are provided. The mobile terminal includes a master switch for connecting a master antenna to a master Radio Frequency (RF) unit for communication with a first network, a slave switch for connecting a slave antenna to a slave RF unit for communication with a second network, a slave control unit for controlling communication with the second network and for detecting attachment of a slave Subscriber Identity Module (SIM), and a master control unit for controlling communication with the first network, for detecting attachment of a master SIM, and for controlling the master and slave switches to establish/release either the connection between the master antenna and the master RF unit or the connection between the slave antenna and the slave RF unit. | 11-24-2011 |
Doo Hwan Lee, Suwon KR
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20120315453 | COATING LAYER STRUCTURE OF BASIC MATERIAL OF MOLD - This invention relates to a coating layer structure of a basic material of a mold, which exhibits good adhesion between a coating material and a basic material and does not cause cracking when coated. Such a coating layer structure includes an ion nitriding layer formed at the surface of the basic material, a middle coating layer formed on the ion nitriding layer using AlTiCrN, AlCrSiN, AlTiSiN, or AlTiCrSiN, and a surface coating layer formed on the middle coating layer using AlTiCrCN, AlCrSiCN, AlTiSiCN, or AlTiCrSiCN. | 12-13-2012 |
20130139382 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 06-06-2013 |
20140003012 | CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD | 01-02-2014 |
20140080266 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings. | 03-20-2014 |
Doo Hwan Lee, Gyeonggi-Do KR
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20130081863 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern. | 04-04-2013 |
20130119553 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity. | 05-16-2013 |
20130170154 | PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate. | 07-04-2013 |
Doo Hwan Lee, Chungcheongnam-Do KR
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20140185188 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser. | 07-03-2014 |
Doo Hwan Oh, Seoul KR
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20140370087 | NOVEL USE OF ANGIOGENIN - The present invention provides a pharmaceutical composition for the prevention or treatment of glaucoma, wherein the pharmaceutical composition includes angiogenin or a fragment thereof as an active ingredient. Angiogenin or a fragment thereof according to the present invention activates aqueous humor outflow due to NO generation increase, Schlemm's canal expansion, and intercellular interval widening, thereby reducing intraocular pressure. Accordingly, angiogenin and a fragment may be useful for the prevention and treatment of glaucoma. | 12-18-2014 |