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Donna S.
Donna S. Davis, Beaumont, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20080233375 | Films for use in high strength bags - Thermoplastic films particularly suited for use in bags including at least a core layer comprising an ethylene copolymer, wherein the films are subjected to post-quench biaxial orientation are provided. Optionally, the films may have a first skin layer and/or a second skin layer located on each side of the core layer. Embodiments may have the desirable combination of improved puncture toughness and ultimate tensile strength, low manufacturing cost and desirable optical and tactile properties. | 09-25-2008 |
Donna S. Iwane, Waipahu, HI US
| Patent application number | Description | Published |
|---|---|---|
| 20090112650 | ONLINE METHOD OF PROCURING MORTGAGE LOANS - A method for prioritizing candidate wholesale loan lenders in response to a loan request by a mortgage broker for a client including establishing a lender database serving as a repository of electronic client files generated by said mortgage broker in connection with a client's loan request, permitting subscribing wholesale lenders to access to said lender database via a network, allowing the lenders access said electronic client files from said lender database according to a permission associated with each electronic client file, forwarding via said lender database responses to said mortgage broker, and assigning a hierarchy of the selected subscribing wholesale lenders' responses to said loan request. | 04-30-2009 |
| 20100274709 | ONLINE METHOD OF PROCURING MORTGAGE LOANS - A method for prioritizing candidate wholesale loan lenders in response to a loan request by a mortgage broker for a client including establishing a lender database serving as a repository of electronic client files generated by said mortgage broker in connection with a client's loan request, permitting subscribing wholesale lenders to access to said lender database via a network, allowing the lenders access said electronic client files from said lender database according to a permission associated with each electronic client file, forwarding via said lender database responses to said mortgage broker, and assigning a hierarchy of the selected subscribing wholesale lenders' responses to said loan request. | 10-28-2010 |
Donna S. Zupanski-Nielsen, Yorktown Heights, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080202792 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 08-28-2008 |
| 20080203585 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 08-28-2008 |
| 20080206979 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 08-28-2008 |