| Patent application number | Description | Published |
|---|
| 20090230569 | DEVICE COMPRISING A SEMICONDUCTOR CMPONENT, AND A MANUFACTURING METHOD - A device having at least one semiconductor component, which is covered by a protective material on its outer surface. The invention provides for the outer surface to be provided with a surface structure so as to enlarge the heat transfer area to the protective material. The invention furthermore relates to a manufacturing method. | 09-17-2009 |
| 20100148282 | WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP - A method for joining a first wafer to at least a second wafer. The method is characterized by the following operations of depositing a sinterable bonding material on at least one of the wafers, joining the wafers, and sintering the bonding material by heating. Furthermore, a wafer composite and a chip are also described. | 06-17-2010 |
| 20100219487 | METHOD FOR MANUFACTURING A SENSOR COMPONENT AND SENSOR COMPONENT - A method for manufacturing a sensor component and a sensor component. The sensor component has a semiconductor substrate and a metal substrate. The semiconductor substrate and the metal substrate are bonded together with the aid of a low-temperature process. A bonding material containing metal particles is applied in a first step to the semiconductor substrate and/or the metal substrate and a sintering process is used in a second step for producing the bond between the semiconductor substrate and the metal substrate. | 09-02-2010 |
