Dongsub
Dongsub Choi, Bundang-Ku Sungnam City KR
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20120208301 | Methods and Systems for Creating or Performing a Dynamic Sampling Scheme for a Process During Which Measurements Are Performed on Wafers - Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one tot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process. | 08-16-2012 |
Dongsub Choi, Yongin City KR
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20080316442 | FEEDFORWARD/FEEDBACK LITHO PROCESS CONTROL OF STRESS AND OVERLAY - A method and apparatus for process control in a lithographic process are described. Metrology may be performed on a substrate either before or after performing a lithographic patterning process on the substrate. One or more correctables to the lithographic patterning process may be generated based on the metrology. The lithographic patterning process performed on the substrate (or a subsequent substrate) may be adjusted with the correctables. | 12-25-2008 |
20120094400 | FEEDFORWARD/FEEDBACK LITHO PROCESS CONTROL OF STRESS AND OVERLAY - A method and apparatus for process control in a lithographic process are described. Metrology may be performed on a substrate either before or after performing a patterning process on the substrate. One or more correctables to the lithographic patterning process may be generated based on the metrology. The patterning process performed on the substrate (or a subsequent substrate) may be adjusted with the correctables. | 04-19-2012 |
20130060354 | METHOD AND SYSTEM FOR DETECTING AND CORRECTING PROBLEMATIC ADVANCED PROCESS CONTROL PARAMETERS - The invention may be embodied in a system and method for monitoring and controlling feedback control in a manufacturing process, such as an integrated circuit fabrication process. The process control parameters may include translation, rotation, magnification, dose and focus applied by a photolithographic scanner or stepper operating on silicon wafers. Overlay errors are used to compute measured parameters used in the feedback control process. Statistical parameters are computed, normalized and graphed on a common set of axes for at-a-glance comparison of measured parameters and process control parameters to facilitate the detection of problematic parameters. Parameter trends and context relaxation scenarios are also compared graphically. Feedback control parameters, such as EWMA lambdas, may be determined and used as feedback parameters for refining the APC model that computes adjustments to the process control parameters based on the measured parameters. | 03-07-2013 |
20130107259 | OVERLAY TARGET GEOMETRY FOR MEASURING MULTIPLE PITCHES | 05-02-2013 |
20130336572 | Focus Monitoring Method Using Asymmetry Embedded Imaging Target - A method for monitoring mask focus includes measuring profile asymmetries in a target feature including sub-resolution assist features and deriving a focus response based on a known correlation between the profile and focus of a corresponding mask. A computer system in a lithographic process may adjust mask focus based on such derived information to conform to a desired fabrication process. | 12-19-2013 |
20140065736 | DEVICE CORRELATED METROLOGY (DCM) FOR OVL WITH EMBEDDED SEM STRUCTURE OVERLAY TARGETS - Aspects of the present disclosure describe a target for use in measuring a relative position between two substantially coplanar layers of a device. The target includes periodic structures in first and second layers. Differences in relative position of the first and the second layers between the first and second periodic structures and the respective device-like structure can be measured to correct the relative position of the first and the second layers between the first and second periodic structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 03-06-2014 |
Dongsub Choi, Sungnam City KR
Patent application number | Description | Published |
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20080286885 | METHODS AND SYSTEMS FOR CREATING OR PERFORMING A DYNAMIC SAMPLING SCHEME FOR A PROCESS DURING WHICH MEASUREMENTS ARE PERFORMED ON WAFERS - Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process. | 11-20-2008 |
20110051150 | UNIQUE MARK AND METHOD TO DETERMINE CRITICAL DIMENSION UNIFORMITY AND REGISTRATION OF RETICLES COMBINED WITH WAFER OVERLAY CAPABILITY - A combined metrology mark, a system, and a method for calculating alignment on a semiconductor circuit are disclosed. The combined metrology mark may include a mask misregistration structure and a wafer overlay mark structure. | 03-03-2011 |
20120022679 | ADVANCED PROCESS CONTROL OPTIMIZATION - A method for automatic process control (APC) performance monitoring may include, but is not limited to: computing one or more APC performance indicators for one or more production lots of semiconductor devices; and displaying a mapping of the one or more APC performance indicators to the one or more production lots of semiconductor devices. | 01-26-2012 |
Dongsub Choi, Gyeonggi-Do KR
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20140375984 | HYBRID IMAGING AND SCATTEROMETRY TARGETS - Metrology targets, design files, and design and production methods thereof are provided. The metrology targets are hybrid in that they comprise at least one imaging target structure configured to be measurable by imaging and at least one scatterometry target structure configured to be measurable by scatterometry. Thus, the hybrid targets may be measured by imaging and scatterometry simultaneously or alternatingly and/or the measurement techniques may be optimized with respect to wafer regions and other spatial parameters, as well as with respect to temporal process parameters. The hybrid targets may be used to monitor process parameters, for example via comparative overlay measurements and/or high resolution measurements. | 12-25-2014 |
Dongsub Kim, Seoul KR
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20130117635 | MEMORY SYSTEM INCLUDING NONVOLATILE MEMORY DEVICE AND CONTROLLING METHOD OF CONTROLLING NONVOLATILE MEMORY DEVICE - Disclosed is a method of controlling a nonvolatile memory device which includes programming data in a user data area of the nonvolatile memory device and state information on logical states of the data in a meta area of the nonvolatile memory device; and adjusting levels of a plurality of read voltages using the state information to read the data from the user data area using the plurality of read voltages having the adjusted levels. | 05-09-2013 |
Dongsub Kim, Suwon-Si KR
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20130106776 | SYSTEM AND METHOD FOR IDENTIFYING INPUTS INPUT TO MOBILE DEVICE WITH TOUCH PANEL | 05-02-2013 |
20130241855 | TOUCH SCREEN, METHOD OF MANUFACTURE THE SAME, AND MOBILE TERMINAL HAVING THE SAME - A touch screen, a method of manufacturing the same, and a mobile terminal having the same for minimizing a border area of the mobile terminal are provided. The touch screen includes a flexible display panel including an active area in which an image is displayed and a wiring area including signal lines for transmitting data corresponding to the image, and a flexible touch panel attached to a front surface of the display panel and including a touch detection area at which touch sensors for detecting a touch are positioned and a wiring area at which signal lines for transmitting a touch signal are positioned, wherein the wiring area of the display panel and the wiring area of the touch panel are bent so as not to be parallel to the active area and the touch detection area. | 09-19-2013 |
20140015865 | DISPLAY CONTROL METHOD AND APPARATUS FOR POWER SAVING - A display control method and an apparatus for power saving of a display unit are provided. The method includes, determining a display mode in response to input of external illumination data, detecting input of a Red-Green-Blue-White (RGBW) data frame, applying a weight corresponding to the determined display mode to at least a White (W) sub-pixel value among pixel values of the RGBW data frame, determining luminance control data using the pixel values to which the weight is applied; and controlling the lighting system to output light based on the determined luminance control data, and controlling the display panel to transmit the light based on the determined luminance control data. | 01-16-2014 |
Dongsub Lee, Gyeonggi-Do KR
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20100119935 | CYLINDRICAL SECONDARY BATTERY OF IMPROVED SAFETY - Disclosed herein is a cylindrical secondary battery constructed in a structure in which a crimping region, at which a cap assembly is mounted to the open upper end of a cylindrical container having an electrode assembly mounted therein, is formed at the upper end of the container, wherein the crimping region is constructed in a structure in which the upper end of the crimping region is gently bent at a predetermined radius of curvature (R), such that the crimping region surrounds a gasket located at the inside of the crimping region, the bent front end extends inward, such that the bent end presses the gasket, and an inclination of a predetermined angle is formed at the sidewall of the crimping region, such that the upper part of the crimping region is directed inward. According to the secondary battery of the present invention, the sealability of the gasket is improved, and external impacts are partially absorbed by the inclination formed at the crimping region. Consequently, the deformation of the crimping region is minimized, whereby the leakage of the electrolyte is prevented, and the safety of the battery is greatly improved. | 05-13-2010 |