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Dongsik
Dongsik Jang, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100302323 | FLUID DISCHARGE HEAD AND IMAGE FORMING APPARATUS - A fluid discharge head includes a fluid chamber filled with ink; a discharge opening configured to discharge a droplet of ink from the fluid chamber; a plurality of piezoelectric elements configured as displacement generating units to provide kinetic energy to the ink for the discharge of the ink droplet; and a vibrating plate forming a part of the fluid chamber and connected to the piezoelectric elements, the vibrating plate being configured to transmit a displacement generated by the piezoelectric elements to the ink in the fluid chamber. The vibrating plate includes vibrating portions for the respective the piezoelectric elements. The vibrating portions are configured to be independently displaced for the corresponding piezoelectric elements, and at least one of the piezoelectric elements is configured as a pressure detecting unit to detect an ink pressure in the fluid chamber. | 12-02-2010 |
Dongsik Kim, Gunwi-Gun KR
| Patent application number | Description | Published |
|---|---|---|
| 20100261426 | COMMUNICATION DEVICE AND RELAY DEVICE - A communication device that may select a relay node from a plurality of relay nodes, and be used as a signal receiving node through the selected relay node is provided. Additionally, a relay device that may be used as a relay node to receive and broadcast signals is provided. | 10-14-2010 |
Dongsik Kim, Purvis, MS US
| Patent application number | Description | Published |
|---|---|---|
| 20100095781 | COMPLIANT AND WIRELESS HEALTH MONITORING SENSORS FOR COMPOSITE STRUCTURES - A sensor is provided. The sensor includes a substrate having at least one intrinsically conductive polymer coated on at least a first surface thereof and at least a first and second conductive contact. | 04-22-2010 |
Dongsik Kim, Kwangju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080315374 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM - An integrated circuit package-in-package system comprising: connecting a first integrated circuit device and a package substrate; applying a magnetic film over the first integrated circuit device; mounting a second integrated circuit device having an inner encapsulation over the magnetic film; and forming a package encapsulation over the first integrated circuit device, the magnetic film, and the second integrated circuit device. | 12-25-2008 |
Dongsik Kim, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110242062 | STYLUS AND METHOD OF MANUFACTURING THE SAME - The present disclosure relates to a stylus and a method of manufacturing the same. The stylus is configured to select one of plural pieces of content installed in advance in a communication terminal and indicate an associated operation of the selected piece of content to be performed by touching the selected piece of content with the stylus. The stylus includes a non-conductive elastic pen tip and a protective cap made of a conductive fiber material and covering a convex upper portion of the pen tip to protect the convex upper portion of the pen tip in order to prevent activation of an undesired icon through minimization of any possible recognition failure upon selection of an icon among various icons displayed on a touch screen of a communication terminal Further, the method provides a stylus which includes a non-conductive elastic pen tip and a protective cap made of a conductive fiber material and protecting the pen tip to minimize scratches, which can be formed on a touch screen by the stylus in the case of repeated selection of various icons displayed on the touch screen of a communication terminal. | 10-06-2011 |