Dong Yeoul
Dong Yeoul Kim, Seoul KR
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20100133082 | Switch Apparatus for Adjusting Power Seat in Vehicle - A switch apparatus for adjusting a power seat in a vehicle, may include a body, a plurality of switches installed on the body including a first switch manipulated in a horizontal direction, and a second switch spaced apart from the first switch and manipulated in a vertical direction, and a guide bracket, a first end portion of which is integrally coupled to the first switch and a second end portion of which is placed around the second switch and selectively coupled to the second switch according to a horizontal movement of the first switch, wherein the second switch is movable in the vertical direction while the first switch is in a neutral position, while the first switch is out of the neutral position, and wherein the second end portion of the guide bracket is interfered with the second switch while the second switch is out of a neutral position. | 06-03-2010 |
Dong Yeoul Lee, Gyeonggi-Do KR
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20090087931 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE - Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die. | 04-02-2009 |
Dong Yeoul Lee, Hwaseong-Si KR
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20120236568 | LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads. | 09-20-2012 |
Dong Yeoul Lee, Suwon KR
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20140159094 | WAVELENGTH-CONVERTING LIGHT EMITTING DIODE (LED) CHIP AND LED DEVICE EQUIPPED WITH CHIP - A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface. | 06-12-2014 |