Patent application number | Description | Published |
20080283495 | MICRO ELECTRO MECHANICAL SYSTEM DEVICE AND METHOD OF MANUFACTURING THE SAME - A MEMS (Micro Electro Mechanical System) device and a method of manufacturing the same, in which an detection indicator is formed on a chamber layer stacked on a substrate such that a user easily inspects whether the chamber layer has a required thickness. The MEMS device can include two detection indicators that are formed on the chamber layer and have different depth from each other, or an detection indicator which is formed on the chamber layer and has a tapered sectional shape in which an upper surface of the detection indicator is gradually narrowed in a downward direction such that a user can easily inspect whether the chamber layer has a required thickness. The user can precisely determine whether the chamber layer is planarized to a required thickness by planarizing the detection indicator formed on the chamber layer, and inspecting the detection indicator by using an optical microscope, thereby facilitating inspection for a thickness of the chamber layer. | 11-20-2008 |
20080297564 | INKJET PRINTHEAD - An inkjet printhead includes a substrate in which an ink feed hole is formed, a plurality of ejection devices formed on the substrate at sides of the ink feed hole, a chamber layer stacked on the substrate and in which a plurality of ink chambers, which correspond to the ejection devices and in which ink supplied from the ink feed hole is filled, are formed, and a nozzle layer in which a plurality of nozzles corresponding to the ink chambers are formed, wherein the ink feed hole includes a plurality of through holes formed through the substrate in the thickness direction thereof. | 12-04-2008 |
20080303869 | INK JET PRINT HEAD AND MANUFACTURING METHOD THEREOF - An ink jet print head and a manufacturing method thereof that is improved so as to simplify a glue layer forming process including a glue layer of the ink jet print head is made of a silicone modified resin having a photosensitive property, such as a silicone modified polyimide resin. The glue layer can be formed by coating a silicone modified polyimide resin solution on a substrate, forming a silicone modified polyimide resin layer by vaporizing a solvent from the coated silicone modified polyimide resin solution, and patterning the silicone modified polyimide resin layer. | 12-11-2008 |
20090001048 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to a predetermined depth, forming a sacrifice layer on the chamber layer to fill the trenches and the ink chambers, forming a nozzle layer, in which a plurality of nozzles are formed, on the sacrifice layer and the chamber layer, forming an ink feed hole by etching a lower part of the substrate until the sacrifice layer that is filled in the trench is exposed, and removing the sacrifice layer and the island. | 01-01-2009 |
20090047605 | METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE USING PHOTOLITHOGRAPHY PROCESS AND METHOD OF MANUFACTURING INKJET PRINTHEAD USING THE METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE - Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation. | 02-19-2009 |
20090141083 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a silicon on insulator (SOI) substrate including a lower silicon substrate, a middle insulating layer, an upper silicon substrate, and an ink feed hole, the ink feed hole penetrates the SOI substrate to supply ink, an insulating layer stacked on the upper silicon substrate of the SOI substrate, a chamber layer stacked on the insulating layer in which a plurality of ink chambers filled with ink supplied from the ink feed hole is formed, a nozzle layer stacked on the chamber layer in which a plurality of nozzles is formed to correspond to the ink chambers, a plurality of heaters formed on the insulating layer which heats ink in the ink chambers to generate bubbles and eject ink through the nozzles, and a driving circuit region on which a driving circuit is formed to drive the heaters. | 06-04-2009 |
20090153623 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a substrate, a chamber layer to define an ink chamber on an upper portion of the substrate, and an adhesive portion to adhere to the substrate and the chamber, wherein the adhesive portion is formed of a phenolic sensitive resin. | 06-18-2009 |
20100051580 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole. | 03-04-2010 |
20100053272 | INK EJECTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes. | 03-04-2010 |
20100171793 | INK FEEDHOLE OF INKJET PRINTHEAD AND METHOD OF FORMING THE SAME - An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate. | 07-08-2010 |