Dong-Jin Park
Dong-Jin Park, Daegu KR
Patent application number | Description | Published |
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20110053660 | MOBILE PHONE CRADLE AND VEHICLE INCLUDING THE SAME - A mobile phone cradle may include a housing, a lower body displaceably received in the housing, an upper body rotatably fixed to an upper portion of the lower body and displaceably received in the housing, wherein a mobile phone is held on the upper body, a first elastic member, wherein one end of the first elastic member is selectively wound around a roller rotatably mounted on the housing to move the lower body upwards and the other end of the elastic member is fixed to the lower body, a fixing member selectively fixing the lower body to the housing, and a moving unit guiding displacement of the lower body along the housing, wherein the upper body is rotated at a predetermined angle when taken out of the housing by the first elastic member. | 03-03-2011 |
20110315730 | CUP HOLDER FOR VEHICLE - A cup holder apparatus for a vehicle may include an accommodating tray provided inside a vehicle compartment and having an accommodation space for accommodating a cup therein, a cup support member rotatably provided around a rotating shaft (Z axis) against the accommodating tray and including a bottom portion for safe-placing the cup in the accommodation space and a support portion formed in a stand from the bottom portion to support an outer periphery of the cup, and a release prevention member prepared separately from the cup support member and connected to the bottom portion of the cup support member, while being rotatably coupled to the accommodating tray, to prevent release of the cup support member from the accommodating tray, wherein the release of the release prevention member from the accommodating tray is hindered by an upper stopper formed on the accommodating tray while the cup support member is rotatably coupled to the upper stopper and is rotated around the rotating shaft. | 12-29-2011 |
20120000602 | METHOD OF STACKING FLEXIBLE SUBSTRATE - A method of stacking a flexible substrate is provided. The method includes the steps of: preparing a carrier substrate; stacking an adhesive layer on the carrier substrate; and stacking a flexible substrate having at least one image display device on the adhesive layer using a laminating or pressing method. Thus, the flexible substrate is easily fabricated without modification of conventional mass-production equipment for fabricating a display, and thereby a lightweight, thin, and compact flexible display can be realized. | 01-05-2012 |
Dong-Jin Park, Suwon-Si KR
Patent application number | Description | Published |
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20080283288 | Printed circuit board using paste bump and manufacturing method thereof - A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 11-20-2008 |
20090064497 | Printed circuit board using paste bump and manufacturing method thereof - The method of manufacturing a printed circuit board using paste bumps includes perforating a core board to form at least one via hole, filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, stacking a paste bump board on at least one surface of the core board, and forming an outer layer circuit on a surface of the paste bump board. The method provides a structurally stable all-layer IVH structure due to increased strength in the BVH's of the plated core boards and the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 03-12-2009 |
20090120660 | Electrical member and method of manufacturing a printed circuit board using the same - An electrical member and a method of manufacturing a printed circuit board using the electrical member are disclosed. The method includes: forming an intaglio groove in an insulation layer, where the intaglio groove has at least one protrusion formed within; stacking a seed layer over the intaglio groove; forming a plating layer by performing electroplating over the seed layer; and forming a circuit pattern, which includes the plating layer filled in the intaglio groove, by removing a portion of the plating layer such that the insulation layer is exposed. | 05-14-2009 |
20100022052 | Method for manufacturing package on package with cavity - A manufacturing method of a package on package with a cavity. The method can include forming a first upper substrate cavity in one side of an upper substrate; mounting an upper semiconductor chip on the other side of the upper substrate; forming a lower substrate cavity in one side of a lower substrate; mounting a lower semiconductor chip in the lower substrate cavity formed in the lower substrate; and stacking the upper substrate above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip. The package on package and a manufacturing method thereof can reduce the overall thickness of the package by forming cavities in both upper and lower substrates to accommodate a semiconductor chip mounted in the lower substrate. | 01-28-2010 |
20100025092 | Core substrate and multilayer printed circuit board using paste bumps - A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected. | 02-04-2010 |
Dong-Jin Park, Seongnam-Si KR
Patent application number | Description | Published |
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20090133253 | Method of manufacturing printed circuit board - A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer. | 05-28-2009 |
20090134118 | Method of manufacturing printed circuit board - A method of manufacturing a printed circuit board is disclosed. The method may include: stacking a cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the cover layer and the copper clad laminate; stacking a seed layer over a surface of the intaglio groove and the cover layer; removing a portion of the seed layer stacked over the cover layer, by removing a portion of the cover layer; forming a plating layer, by plating an inside of the intaglio groove; and removing the remaining cover layer and the copper foil. | 05-28-2009 |
20090136656 | Method of manufacturing printed circuit board - A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil. | 05-28-2009 |
Dong-Jin Park, Taegu-Kwangyokshi KR
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20080212008 | Array panel for liquid crystal display device and method of manufacturing the same - An array panel for a liquid crystal display device includes a substrate, a gate line and a gate electrode on the substrate, wherein the gate line is connected to the gate electrode, a gate insulating layer on the gate line and the gate electrode, an active layer on the gate insulating layer, an ohmic contact layer on the active layer, a data line, a source electrode, and a drain electrode on the ohmic contact layer, wherein the data line, the source electrode, and the drain electrode are formed of molybdenum, a passivation layer on the data line, the source and drain electrodes, and a pixel electrode on the passivation layer, wherein the ohmic contact layer has the same shape as the data line, the source, and drain electrodes, and the active layer has the same shape as the data line, and the source electrode, and the drain electrode except for a channel area between the source electrode and the drain electrode, and the channel area has a āUā shape. | 09-04-2008 |
Dong-Jin Park, Anyang-Si KR
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20120201572 | ROLLER FOR IMAGING APPARATUS AND IMAGING APPARATUS INCLUDING THE ROLLER - A roller includes a shaft including reinforcing fiber and a binder resin; and an elastic body surrounding an outer surface of the shaft, wherein an average length to average diameter ratio (L/D) of the reinforcing fiber is from about 15,000:1 to about 50,000:1. | 08-09-2012 |
Dong-Jin Park, Hwaseong-Si KR
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20120210115 | Secure Boot Method and Method for Generating a Secure Boot Image - In a secure boot method, an initial boot loader verifies a first digital signature included in a first boot loader using a public key. The first boot loader is executed if the first digital signature is valid. The first boot loader verifies a first message authentication code included in a second boot loader using a unique key. The second boot loader is executed if the first message authentication code is valid. | 08-16-2012 |
20130254842 | OPERATION OF MOBILE DEVICE AS TRUSTED MOBILE WEB CLIENT OR TRUSTED MOBILE WEB SERVER - A method of operating a mobile device comprises executing a trusted service application in a trusted operating system through secure access, executing a trusted web server module in the trusted operating system, wherein the trusted web server module is configured to transfer information using an internet protocol and the information is generated by execution of the trusted service application, and executing a user application in a rich operating system through normal access, wherein the user application is configured to relay communication between a remote web server and the trusted web server module through a security session. | 09-26-2013 |
Dong-Jin Park, Gyeonggi-Do KR
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20130031802 | FUNCTIONAL SHOE INCLUDING WEIGHT SUPPORT UNIT - As described above, just as a person inserts his/her toes into a space under furniture and does sit-ups by using the force of the toes, a functional shoe of the present invention provides a portion into which an instep and a toe base portion are inserted on the functional shoe to use the force of the toe base portion which may exert the greatest force from among portions of a foot, thereby adding momentum. | 02-07-2013 |
Dong-Jin Park, Bucheon-Si KR
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20150035508 | MODE SELECTION CIRCUIT AND SWITCH CONTROL CIRCUIT INCLUDING THE MODE SELECTION CIRCUIT AND MULTI FUNCTIONS PIN - A mode selection circuit generates a mode voltage according to a clamping current flowing when a voltage of a multi-pin is clamped to a predetermined clamping voltage, and selects one of a plurality of mode signals according to the mode voltage. The mode voltage is controlled according to a passive element connected to the multi-pin. | 02-05-2015 |
20150035512 | Charge Pump and Switch Control Circuit - A charge pump includes: a first diode that is connected to a first node; a second diode that is connected to a second node; a pump capacitor that is connected to a third node to which the first diode and the second diode are connected; a power supply capacitor that is connected to the pump capacitor; a third diode that is connected between the pump capacitor and the power supply capacitor; and a zener diode that is connected in parallel to the third diode and the power supply capacitor. A power supply device decreases a ripple of an output current using a ripple reduction signal. | 02-05-2015 |