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Dong-Hyeon
Dong-Hyeon Hwang, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100119842 | INJECTION PREFORM PLASTIC HAVING SURFACE EFFECT OF METALLIC APPEARANCE - An injection preform providing a metallic texture and a fabrication method thereof, in which on a surface of an injection substrate whereon a thin-film primer coating layer (TPPCL) is formed providing the metallic texture formed with various patterns and to preserve the texture on the surface of the injection substrate. The injection preform typically includes: an injection substrate having a surface on which the various patterns are formed by mold discharge corrosion; a TPPCL formed on the surface of the injection substrate to increase reflectivity of the injection substrate, so that the TPPCL provides the metallic texture with various patterns while preserving surface texture of the injection substrate; a non-conductive metal-deposited layer deposited on a surface of the thin film primer coating layer; a color coating layer (CCL) formed on a surface of the non-conductive metal-deposited layer; and a clear layer formed on a surface of the CCL. | 05-13-2010 |
| 20100129661 | COATING COMPOUND FOR PORTABLE ELECTRONIC APPARATUS AND COATING METHOD FOR THE PORTABLE ELECTRONIC APPARATUS - A coating compound and method for a portable electronic apparatus having frequent contact with users, such as a portable terminal, a Portable Multimedia Player (PMP), a Personal Digital Assistant (PDA), or the like. A housing of the portable electronic apparatus has the coating compound coated arranged thereon, and a bead portion is blended and added to the coating compound prior to applying the coating compound onto the housing so that convexes and concaves are formed on and in an outer surface of the housing by the bead portion. The coating method includes manufacturing a housing of the portable electronic apparatus by injection, coating the coating compound onto the manufactured housing, and drying the coating compound coated onto the housing so that particles of acrylic beads and urethane beads included in the coating compound protrude from an outer surface of the housing. | 05-27-2010 |
Dong-Hyeon Hwang, Jeollabuk-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110293581 | BONE-REGENERATING COMPOSITION CONTAINING ANGIOGENIN - The present invention relates to a bone-regenerating composition containing angiogenin and to a bone-generating scaffold comprising the composition. Angiogenin has a superior ability to induce initial angiogenesis and bone regeneration as compared to the platelet rich plasma (PRP) which is used as a conventional element for stimulating bone regeneration, thus improving the speed of bone regeneration | 12-01-2011 |
Dong-Hyeon Jang, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080230877 | SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method of fabricating the same. The method includes providing a semiconductor substrate on which a chip pad is formed. A wire redistribution layer connected to the chip pad is formed. An insulating layer which includes an opening exposing a portion of the wire redistribution layer is formed. A metal ink is applied within the opening to thereby form a bonding pad. The applied metal ink within the opening and the insulating layer can be cured simultaneously. | 09-25-2008 |
| 20090184411 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure. | 07-23-2009 |
| 20090209063 | Chipstack package and manufacturing method thereof - A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages. | 08-20-2009 |
| 20090215229 | Board on chip package and method of manufacturing the same - A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provided through the interposer to expose the contact pads. A board, which may have a first surface supporting a plurality of metal lines, may have a second surface adhered to the interposer. The board may have an opening through which the contact pads may be exposed. A plurality of bonding wires may connect the contact pads to the metal lines through the opening. | 08-27-2009 |
| 20090302418 | FUSE STRUCTURE OF A SEMICONDUCTOR DEVICE - Provided is a fuse structure of a semiconductor device. The fuse structure may include an insulating layer pattern structure, a fuse and a protecting layer pattern. The insulating layer pattern structure may be formed on a substrate. The insulating layer pattern structure may have an opening. The fuse may be formed in the opening. The protecting layer pattern may be formed in the opening of the insulating layer pattern structure to cover the fuse. | 12-10-2009 |
| 20100032807 | Wafer level semiconductor module and method for manufacturing the same - A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas. | 02-11-2010 |
| 20110237004 | CHIPSTACK PACKAGE AND MANUFACTURING METHOD THEREOF - A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages. | 09-29-2011 |
Dong-Hyeon Kim, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110235726 | METHOD AND APPARATUS FOR UPDATING CHANNEL INFORMATION IN MOBILE COMMUNICATION TERMINAL - An apparatus and method for updating channel information in a mobile communication terminal supporting Digital Multimedia Broadcasting (DMB) are provided. The method includes sending a broadcasting information request to an Over The Air (OTA) server over a mobile communication network, receiving broadcasting information from the OTA server over the mobile communication network, and updating stored broadcasting information based on the received broadcasting information. | 09-29-2011 |
Dong-Hyeon Kim, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100002092 | METHOD AND APPARATUS FOR PROCESSING CONTINUOUS IMAGE DATA CAPTURED BY DIGITAL IMAGE PROCESSOR - Provided are a method and apparatus for processing continuous image data captured by a digital image processor which encodes/decodes a plurality of continuous images in a Moving Picture Expert Group (MPEG) format. The apparatus includes a digital signal processing unit which compresses the continuous image data into video data in consideration of correlations between neighboring images, or converts the compressed video data into displayable data. | 01-07-2010 |
Dong-Hyeon Kim, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100190527 | APPARATUS AND METHOD FOR PERIPHERAL DEVICE CONTROL IN PORTABLE TERMINAL - An apparatus and a method for a peripheral device control in a portable terminal are provided. In the method for the peripheral device control in the portable terminal, the method includes selectively changing a communication path between a communication modem and a storage to a communication path between a controller and the storage by controlling a switch when the communication modem is turned off, determining information necessary for the peripheral device control through the communication path between the controller and the storage and controlling the peripheral device when the information satisfies a control condition. | 07-29-2010 |
Dong-Hyeon Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100210714 | Her-2/neu DNA Vaccine Having Anti-Cancer Activity - The present invention relates to human Her-2/neu expressing plasmid constructs having anti-cancer activity and a DNA vaccine comprising same for preventing and/or treating cancer. The Her-2/neu DNA vaccines of the present invention can be effectively used as a therapeutic vaccine in reducing metastasis after tumor surgery or as a prophylactic vaccine for people with genetic high risk. | 08-19-2010 |
Dong-Hyeon Yoon, Gyeongsangbuk-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110293581 | BONE-REGENERATING COMPOSITION CONTAINING ANGIOGENIN - The present invention relates to a bone-regenerating composition containing angiogenin and to a bone-generating scaffold comprising the composition. Angiogenin has a superior ability to induce initial angiogenesis and bone regeneration as compared to the platelet rich plasma (PRP) which is used as a conventional element for stimulating bone regeneration, thus improving the speed of bone regeneration | 12-01-2011 |