Patent application number | Description | Published |
20080290980 | CONTROL OF EDDY CURRENTS IN MAGNETIC VIAS FOR INDUCTORS AND TRANSFORMERS IN INTEGRATED CIRCUITS - An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency. | 11-27-2008 |
20090015363 | INTEGRATED TRANSFORMER - A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn. | 01-15-2009 |
20090166804 | FORMING INDUCTOR AND TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS USING DAMASCENE PROCESSING FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another. | 07-02-2009 |
20090169874 | FORMING ELECTROPLATED INDUCTOR STRUCTURES FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a magnetic material on a substrate, wherein the magnetic material comprises rhenium, cobalt, iron and phosphorus, and annealing the magnetic material at a temperature below about 330 degrees Celsius, wherein the coercivity of the annealed magnetic material is below about 1 Oersted. | 07-02-2009 |
20090207576 | SLOTTED MAGNETIC MATERIAL FOR INTEGRATED CIRCUIT INDUCTORS - An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers. | 08-20-2009 |
20100115301 | CPU POWER DELIVERY SYSTEM - A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout. | 05-06-2010 |
20100118501 | Integrated inductor - An inductor and multiple inductors embedded in a substrate (e.g., IC package substrate, board substrate, and/or other substrate) is provided herein. | 05-13-2010 |
20100141533 | ANTENNA STRUCTURE - An antenna structure that includes a magnetic film coated on a textured backside of an antenna substrate to reduce the size of antenna from an average size of the antenna for a predetermined frequency band. | 06-10-2010 |
20100259911 | MAGNETIC MICROINDUCTORS FOR INTEGRATED CIRCUIT PACKAGING - Magnetic microinductors formed on semiconductor packages are provided. The magnetic microinductors are formed as one or more layers of coplanar magnetic material on a package substrate. Conducting vias extend perpendicularly through the plane of the magnetic film. The magnetic film is a layer of isotropic magnetic material or a plurality of layers of anisotropic magnetic material having differing hard axes of magnetization. | 10-14-2010 |
20100295649 | INTEGRATED TRANSFORMER - A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn. | 11-25-2010 |
20110001202 | FORMING INDUCTOR AND TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS USING DAMASCENE PROCESSING FOR INTEGRATED CIRCUITS - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another. | 01-06-2011 |
20110068887 | ON-DIE MICRO-TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS - Some embodiments include a die having a transformer. The transformer includes windings formed from a set of lines, such that no two lines belonging to any one winding are nearest neighbors. The lines are formed within one layer on the die. Other embodiments are described. | 03-24-2011 |
20110268457 | METHOD AND APPARATUS FOR OPTICAL SIGNALING - A method and apparatus for optical signaling. In one embodiment, a laser driver converts a digital voltage sequence to a current signal having a bias mode adjustable by a bias control and a modulation mode adjustable by a modulation control. A laser generates an optical signal responsive to the current signal of the laser driver. In one embodiment, a photo-detector receives an optical signal and generates a single ended current signal. A transimpedance amplifier circuit converts the single ended current signal to a differential voltage signal. A clock recovery circuit generates an aligned clock signal and a sampler circuit uses the aligned clock signal to retrieve a digital voltage sequence. | 11-03-2011 |
20120194245 | PULSE WIDTH MODULATOR - Disclosed herein are pulse width modulator (PWM) solutions with comparators not relying on a variable reference to adjust duty cycle. In accordance with some embodiments, a pulse width modulator having a comparator with an applied adjustable waveform to generate a bit stream with a controllably adjustable duty cycle is provided. | 08-02-2012 |
20120221884 | ERROR MANAGEMENT ACROSS HARDWARE AND SOFTWARE LAYERS - Generally, this disclosure provides error management across hardware and software layers to enable hardware and software to deliver reliable operation in the face of errors and hardware variation due to aging, manufacturing tolerances, etc. In one embodiment, an error management module is provided that gathers information from the hardware and software layers, and detects and diagnoses errors. A hardware or software recovery technique may be selected to provide efficient operation, and, in some embodiments, the hardware device may be reconfigured to prevent future errors and to permit the hardware device to operate despite a permanent error. | 08-30-2012 |
20130016452 | CHARGE STORAGE DEVICE, METHOD OF MAKING SAME, METHOD OF MAKING AN ELECTRICALLY CONDUCTIVE STRUCTURE FOR SAME, MOBILE ELECTRONIC DEVICE USING SAME, AND MICROELECTRONIC DEVICE CONTAINING SAMEAANM Gardner; Donald S.AACI Mountain ViewAAST CAAACO USAAGP Gardner; Donald S. Mountain View CA USAANM Hannah; Eric C.AACI Pebble BeachAAST CAAACO USAAGP Hannah; Eric C. Pebble Beach CA USAANM Chen; RongAACI SunnyvaleAAST CAAACO USAAGP Chen; Rong Sunnyvale CA USAANM Gustafson; John L.AACI PleasantonAAST CAAACO USAAGP Gustafson; John L. Pleasanton CA US - In one embodiment a charge storage device includes first ( | 01-17-2013 |
20130182365 | INTEGRATED INDUCTORS - Multiple-inductor embodiments for use in substrates are provided herein. | 07-18-2013 |
20140093782 | NANOMACHINED STRUCTURES FOR POROUS ELECTROCHEMICAL CAPACITORS - Embodiments of the invention describe energy storage devices, porous electrodes, and methods of formation. In an embodiment, an energy storage device includes a porous structure containing multiple main channels that extend into an electrically conductive structure at an acute angle. In an embodiment, an energy storage device includes a porous structure containing an array of V-groove or pyramid recesses. | 04-03-2014 |
20140335918 | ENERGY STORAGE DEVICE, METHOD OF MANUFACTURING SAME, AND MOBILE ELECTRONIC DEVICE CONTAINING SAME - An energy storage device comprises a first porous semiconducting structure ( | 11-13-2014 |