| Patent application number | Description | Published |
|---|
| 20090200066 | BARE MICROELECTRONIC CHIP PROVIDED WITH A RECESS FORMING A HOUSING FOR A WIRE ELEMENT CONSTITUTING A FLEXIBLE MECHANICAL SUPPORT, FABRICATION PROCESS AND MICROSTRUCTURE - A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip. | 08-13-2009 |
| 20100136746 | METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY MEANS OF A FLEXIBLE CONNECTION - The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection. | 06-03-2010 |
| 20100245182 | Assembly of Radiofrequency Chips - The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device. | 09-30-2010 |
| 20110001237 | ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT - The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element. | 01-06-2011 |
| 20110149540 | METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTRONIC CHIP WITH A DEFORMABLE LINK ELEMENT, FABRICATION METHOD OF A PLURALITY OF CHIPS, AND ASSEMBLY OF AT LEAST ONE CHIP WITH A WIRE ELEMENT - A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove. | 06-23-2011 |
| 20110198735 | ASSEMBLY OF A MICROELECTRONIC CHIP HAVING A GROOVE WITH A WIRE ELEMENT IN THE FORM OF A STRAND, AND METHOD FOR ASSEMBLY - Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand. | 08-18-2011 |
| 20110247198 | METHOD FOR MAKING AN ASSEMBLY OF CHIPS BY MEANS OF RADIOFREQUENCY TRANSMISSION-RECEPTION MEANS MECHANICALLY CONNECTED BY A RIBBON - A method for making an assembly of chips equipped with radiofrequency transmission-reception means, including successively: making a plurality of chips, on a substrate, each chip having at least one reception area, connecting the reception areas of the chips of the assembly in series with an electrically insulating flat ribbon having a plurality of metallic patterns electrically insulated from one another, each pattern forming at least a part of a flat antenna electrically connected at the level of at least one connection area of the antenna to a corresponding reception area, and separating the chips at the level of the substrate, the chips being mechanically connected to one another by the ribbon. | 10-13-2011 |
