| Patent application number | Description | Published |
|---|
| 20090073073 | Foldable Reflect Array - A foldable reflect array may include a plurality of geometrically-flat reflect antennas. Each of the reflect antennas may include a respective plurality of antenna elements to receive and retransmit an incident wavefront, and each of the plurality of reflect antennas may be foldably coupled to at least one other of the plurality of reflect antennas. | 03-19-2009 |
| 20090128413 | COMBINING MULTIPLE-PORT PATCH ANTENNA - An exemplary apparatus providing an antenna for radiating electromagnetic energy is disclosed as having: a first dielectric substrate having opposite first and second surfaces, a patch of conducting material disposed on the first surface, a ground plane of conducting material disposed of the second surface, at least three input means coupled to a plurality of microstrip feed lines wherein the microstrip feed lines have an aspect ratio suitably configured to maximize antenna bandwidth. Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve and/or modify the performance characteristics of the antenna. Exemplary embodiments of the present invention generally provide an antenna for providing wideband power combining and wideband radiation functions. | 05-21-2009 |
| 20090174621 | Methods and Apparatus for Multilayer Millimeter-Wave Window - Methods and apparatus for a multilayer millimeter-wave window according to various aspects of the present invention operate in conjunction with a multilayer window that is substantially transparent to a passing millimeter-wave. The window may include multiple perforations in a thermally conductive element to be disposed in the path of the passing wave. A dielectric is positioned between each thermally conductive element and acts as a seal between wave source and an ambient environment. The window may also be configured to conform to a contoured surface or structure. | 07-09-2009 |
| 20100149038 | Portable Millimeter-Wave Near Field Scanner - There is disclosed an apparatus to test an antenna. A transmitter generates a test signal radiated by the antenna under test. A near field scanner includes a field sampling probe to capture electromagnetic energy radiated by an antenna under test. An x-y positioning system including x and y positioning motors moves the field sampling probe over a measurement surface disposed proximate to the antenna under test. A quasi-optical beam transport system couples at least a portion of the captured electromagnetic energy from the field sampling probe to a scanner output port. A receiver is coupled to the scanner output port. | 06-17-2010 |
| 20100210225 | MODULAR SOLID-STATE MILLIMETER WAVE (MMW) RF POWER SOURCE - A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1:N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1:N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements. Placement of the amplifier chips away from the radiating face provides a short path with large thermal cross-section through the heat sink to the backplane to remove heat. The topology can produce high output power combined with a high antenna gain to produce large power-aperture products previously only achievable with a Gyrotron. As amplifier chips become more powerful, the topology can be adapted to use fewer chips. | 08-19-2010 |
