| Patent application number | Description | Published |
| 20100006142 | Deposition apparatus for improving the uniformity of material processed over a substrate and method of using the apparatus - Deposition apparatus for uniformly forming material on a substrate in accordance with an exemplary embodiment is provided. The deposition apparatus includes an energy source, an electrode in a facing, spaced relationship with respect to the substrate, and interface structure joined to the electrode. The interface structure is configured to electrically couple energy from the energy source through and about the interface structure to the electrode for formation of a substantially uniform electric field between the electrode and a predetermined area of the substrate when the interface structure is supplied with energy from the energy source. | 01-14-2010 |
| 20100071766 | Semiconductor device having a multi-layer substrate and a method of forming the semiconductor device - A semiconductor device is provided in accordance with an exemplary embodiment. The semiconductor device includes a semiconductive layer disposed over a multi-layer substrate. The multi-layer substrate includes a plurality of dissimilar regions, one of which is an inner magnetic region and the remainder of the multi-layer substrate is thermally symmetrical about the inner magnetic region. | 03-25-2010 |
| 20100252605 | WEB SUPPORT ASSEMBLY - A web support assembly for a moving web of substrate material includes a base having a primary support arm pivotally mounted thereto so as to be displaceable from a first position to a second position. The web support assembly includes a first biasing member in mechanical communication with the primary support arm. The first biasing member operates to impart a first biasing force to the primary support arm so as to move it from its first position to its second position. The system includes a dancer arm which is pivotally mounted to the primary support arm so as to be displaceable from a first position to a second position relative primary support arm. The web support assembly further includes a second biasing member in mechanical communication with the dancer arm. The second biasing member operates to impart a second biasing force to the dancer arm so as to move it from its first position to its second position. A roller is rotatably supported on the dancer arm. The roller is configured to engage a portion of the web. The web support assembly operates to maintain continuous contact between the roller and the moving web of substrate material as it passes through a multi-station processing system. | 10-07-2010 |
| 20100252606 | ROLL-TO-ROLL DEPOSITION APPARATUS WITH IMPROVED WEB TRANSPORT SYSTEM - A system for the continuous deposition of a semiconductor material onto one or more webs of substrate material which are advanced therethrough includes a web transport system having a plurality of web support assemblies. Each web support assembly includes a base having a primary support arm pivotally mounted thereto so as to be displaceable from a first position to a second position. The support includes a first biasing member in mechanical communication with the primary support arm. The first biasing member operates to impart a first biasing force to the primary support arm so as to move it from its first position to its second position. The support includes a dancer arm which is pivotally mounted to the primary support arm so as to be displaceable from a first position to a second position relative to the primary support arm. The system further includes a second biasing member in mechanical communication with the dancer arm. The second biasing member operates to impart a second biasing force to the dancer arm so as to move it from its first position to its second position. A roller is rotatably supported on the dancer arm. The roller is configured to engage a portion of the web. The web support assembly operates to maintain continuous contact between the roller and the moving web of substrate material as it passes through the deposition system. | 10-07-2010 |
| 20110281378 | ULTRASONIC SYSTEM FOR MEASURING GAS VELOCITY - A system and method for measuring the velocity of gas flow between multiple plasma deposition chambers is provided. A passage atmospherically linking two plasma processing chambers conducts a gas flow therebetween due to differential pressures within the respective chambers. The gas flow velocity is measured by a linear or non-linear ultrasonic energy acoustic path between two transducers located exteriorly to the chambers using the difference in transit time in a forward and reverse direction due to the velocity of gas in the passage. The pressure of process gas in one or more chambers is adjustable based on the measured velocity of gas flow in the passage. | 11-17-2011 |