| Patent application number | Description | Published |
|---|
| 20100297941 | REMOTE CONTROL SYSTEM AND METHOD EMPLOYING CELLULAR TELEPHONES WHICH INCLUDE SHORT RANGE RADIO TRANSCEIVERS - A novel remote control system and method is disclosed which includes a user control and a control module. The system employs one or more cellular telephones as the user control which reduces the cost of the system. Further, by employing the inherent functionality of the cellular telephone, novel modes of interacting with the control module and the target devices it is connected to can be achieved. In the case of the cellular telephone being a smartphone, more advanced modes of interacting with the control module and the target devices can be achieved. Examples of target devices controlled by the system and method include, without limitation, electric garage door openers, lighting systems, thermostats, alarm systems, etc. | 11-25-2010 |
| 20110081947 | INTERACTIVE EVENT GUIDE WITH ENHANCED FEATURES - A novel interactive event guide system and method which allows users to select events from a set of event listings and to obtain additional information and/or services relevant to the selected events. The additional information and/or services can include access to E-commerce sites offering products related to an event selected from the event listings, access to sites offering additional information relating to products advertised during a selected event and/or products advertised by product placements within a selected event and/or access to social networking services. Demographic information about the user can be provided to an advertiser of a selected event to allow the advertiser to provide appropriate additional information to the user and/or to allow the advertiser to better analyze the success of their advertisement. | 04-07-2011 |
| 20110287757 | REMOTE CONTROL SYSTEM AND METHOD - A remote control system and method for controlling and interacting with a variety of devices and systems is disclosed. The system comprises at least one command server which is operable to receive control commands from a handheld communications device and to generate and transmit command signals in response to the received control commands, the transmitted command signals interacting with one or more devices controlled by the system. In one embodiment, the handheld communications device is operable to exchange data with an account server that maintains data and configuration information for the system and the devices to be controlled by it over a first communications modality. The handheld communications device transfers control commands and other data with the command server via a second communications modality and the handheld communications device can transfer data between the account server and the command server as needed. The system can support multiple devices to be controlled, multiple command servers, which can each be associated with one or more devices to be controlled, and multiple handheld communications devices. | 11-24-2011 |
| Patent application number | Description | Published |
|---|
| 20100264432 | LIGHT EMITTING DEVICE WITH HIGH COLOR RENDERING INDEX AND HIGH LUMINESCENCE EFFICIENCY - A light emitting device comprises two light-emitting diode (LED) groups, a group of luminophor layers, and an input terminal. The first LED group includes at least one blue LED emitting light having a dominant wavelength in a range between 400 nm and 480 nm, and the second LED group includes at least one red-orange LED emitting light having a dominant wavelength in a range between 610 nm and 630 nm. The group of luminophor layers, which are selected from one of silicates, nitrides, and nitrogen oxides, are positioned above the first LED group and partially converts the light emitted by the first LED group into light having a dominant wavelength in a range between 500 nm and 555 nm. The input terminal is connected to the two LED groups for providing desired electric energy thereto. | 10-21-2010 |
| 20110037082 | Smart Integrated Semiconductor Light Emitting System Including Light Emitting Diodes And Application Specific Integrated Circuits (ASIC) - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions. | 02-17-2011 |
| Patent application number | Description | Published |
|---|
| 20090093075 | METHOD OF SEPARATING SEMICONDUCTOR DIES - A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies. | 04-09-2009 |
| 20110217799 | METHOD OF SEPARATING SEMICONDUCTOR DIES - A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies. | 09-08-2011 |
