| Patent application number | Description | Published |
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| 20100289613 | VANADIUM OXIDE THERMAL MICROPROBES - A temperature probe includes a substrate, a cantilever body portion formed on the substrate, having an anchor portion held in contact to the substrate and a free end portion extending out of the surface of the substrate, and a sputter-deposited thermistor sensor portion located at the free end portion of the cantilever body portion. | 11-18-2010 |
| 20100290501 | NANOCALORIMETER BASED ON THERMAL PROBES - A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable. | 11-18-2010 |
| 20100295164 | AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL - A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold. | 11-25-2010 |
| 20100295165 | STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS - A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive. | 11-25-2010 |
| Patent application number | Description | Published |
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| 20080303900 | Miniature Low Cost Pan/Tilt Magnetic Actuation For Portable And Stationary Video Cameras - A pan/tilt apparatus for a camera includes a base, a stage mounted on the base to rotate around a vertical pan axis, an optical apparatus mounted on the stage, a pan actuating mechanism, and a tilt actuating mechanism. The optical apparatus includes a frame that supports a magnetic structure and a mirror such that they are pivotable around a horizontal tilt axis. The mirror receives an image directed along an incident axis, and redirects the image along the pan axis, e.g., to a camera that is disposed on or below the base. The pan actuating mechanism engages and rotates the stage into a desired pan direction. The tilt actuating mechanism modulates (alters) a magnetic field applied to the mirror/magnetic structure by, for example, moving a permanent magnet that is mounted on the base. | 12-11-2008 |
| 20100213161 | Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal - Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved. | 08-26-2010 |
| 20100216669 | Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal - Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved. | 08-26-2010 |
| 20110107928 | DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES - A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state. | 05-12-2011 |
