Dimov

Dmitry Dimov, San Francisco, CA US

Patent application number	Description	Published
20120031470	SOLAR PANEL CONFIGURATIONS - The invention provides solar panel systems, which may be applied to surfaces such as residential rooftops. The invention also provides methods of installing solar panel systems. A solar panel system may comprise one or more module, which may comprise one or more solar panels and a rack. A solar panel may comprise a polymer, and may not comprise glass or a metal frame. The rack may include three footings and a plurality of adjustable fasteners that may enable the module to reside on an uneven surface. The rack may also include integrated electronic components and a microinverter. A module may yield a desired power output, and may generate performance monitoring data.	02-09-2012

Patent application number	Description	Published
20110262906	MICROFLUIDIC MULTIPLEXED CELLULAR AND MOLECULAR ANALYSIS DEVICE AND METHOD - A sequential flow analysis tool comprising a microti iridic device having a fluid path defined within a substrate between an input and an output is described. The device includes a capture chamber provided within but offset from the fluid path, the capture chamber extending into the substrate in a direction substantially perpendicular to the fluid path such that operably particles provided within a fluid flowing within the fluid path will preferentially collect within the capture chamber.	10-27-2011

Patent application number	Description	Published
20080199805	PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES - A photosensitve composition exhibiting high resolution and enhanced, tunable O	08-21-2008
20080206676	THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION - An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of:	08-28-2008
20100304299	CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION - A photoresist composition. The composition has the following: (a) one or more resin binders that include one or more acid sensitive groups and that are substantially free of phenolic groups protected by acetal or ketal groups; (b) one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups; (c) one or more ionic non-photosensitive additives including an iminium salt; and (d) one or more solvents. There is also a process for patterning relief structures on a substrate employing the photoresist composition.	12-02-2010