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Dijkstra, Eindhoven
Eelco Dijkstra, Eindhoven NL
| Patent application number | Description | Published |
|---|---|---|
| 20110065463 | APPARATUS AND METHOD OF COMPOSING A MESSAGE - An apparatus ( | 03-17-2011 |
Hendrik Dijkstra, Eindhoven NL
| Patent application number | Description | Published |
|---|---|---|
| 20100262969 | DATA PROCESSING SYSTEM AND METHOD FOR SCHEDULING THE USE OF AT LEAST ONE EXCLUSIVE RESOURCE - It is an object of the invention to improve the performance of a multitasking data processing system in which at least one exclusive resource is used for executing at least two task flows. The method according to the invention achieves this by using a so-called master schedule, which is used as a template to construct the schedules for individual task flows. The term master schedule refers to a set of reservations of the exclusive resources for task flows. | 10-14-2010 |
Jacob Dijkstra, Eindhoven NL
| Patent application number | Description | Published |
|---|---|---|
| 20100000317 | DEVICE FOR INDICATING A LEVEL OF FLUID COMPRISING A MOVABLE ARRANGED LIGHTING MEMBER WHICH IS PRESENT INSIDE A CONTAINER OF THE DEVICE - An electric hot water kettle comprises a container ( | 01-07-2010 |
| 20100270936 | DIMMABLE LIGHT GENERATING DEVICE - A wake-up lighting device is described, comprising a gas discharge lamp ( | 10-28-2010 |
Paul Dijkstra, Eindhoven NL
| Patent application number | Description | Published |
|---|---|---|
| 20080230926 | Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments - An inorganic solder mask ( | 09-25-2008 |
| 20080272475 | Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package - A die package ( | 11-06-2008 |
| 20080277772 | Methods of Packaging a Semiconductor Die and Package Formed by the Methods - A method of packaging a semiconductor die ( | 11-13-2008 |
| 20090079050 | AIR CAVITY PACKAGE FOR FLIP-CHIP - According to an example embodiment, there is method ( | 03-26-2009 |
| 20090162791 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF - The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer. | 06-25-2009 |
| 20100006996 | CARRIER FOR BONDING A SEMICONDUCTOR SHIP ONTO AND A METHOD OF CONTRACTING A SEMICONDUCTOR CHIP TO A CARRIER - A carrier ( | 01-14-2010 |