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Diana
Frederic Diana, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090230409 | UNDERFILL PROCESS FOR FLIP-CHIP LEDS - An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable. | 09-17-2009 |
| 20110223696 | UNDERFILL PROCESS FOR FLIP-CHIP LEDS - An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable. | 09-15-2011 |
Frederic S. Diana, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090001399 | OPTICAL DESIGNS FOR HIGH-EFFICACY WHITE-LIGHT EMITTING DIODES - A method for increasing the luminous efficacy of a white light emitting diode (WLED), comprising introducing optically functional interfaces between an LED die and a phosphor, and between the phosphor and an outer medium, wherein at least one of the interfaces between the phosphor and the LED die provides a reflectance for light emitted by the phosphor away from the outer medium and a transmittance for light emitted by the LED die. Thus, a WLED may comprise a first material which surrounds an LED die, a phosphor layer, and at least one additional layer or material which is transparent for direct LED emission and reflective for the phosphor emission, placed between the phosphor layer and the first material which surrounds the LED die. | 01-01-2009 |
| 20100327305 | PHOTONIC STRUCTURES FOR EFFICIENT LIGHT EXTRACTION AND CONVERSION IN MULTI-COLOR LIGHT EMITTING DEVICES - A high efficiency light emitting diode (LED) comprised of a substrate, a buffer layer grown on the substrate (if such a layer is needed), a first active region comprising primary emitting species (PES) that are electrically-injected, a second active region comprising secondary emitting species (SES) that are optically-pumped by the light emitted from the PES, and photonic crystals, wherein the photonic crystals act as diffraction gratings to provide high light extraction efficiency, to provide efficient excitation of the SES, and/or to modulate the far-field emission pattern. | 12-30-2010 |
| 20110089455 | OPTICAL DESIGNS FOR HIGH-EFFICACY WHITE-LIGHT EMITTING DIODES - A method for increasing the luminous efficacy of a white light emitting diode (WLED), comprising introducing optically functional interfaces between an LED die and a phosphor, and between the phosphor and an outer medium, wherein at least one of the interfaces between the phosphor and the LED die provides a reflectance for light emitted by the phosphor away from the outer medium and a transmittance for light emitted by the LED die. Thus, a WLED may comprise a first material which surrounds an LED die, a phosphor layer, and at least one additional layer or material which is transparent for direct LED emission and reflective for the phosphor emission, placed between the phosphor layer and the first material which surrounds the LED die. | 04-21-2011 |
Frédéric S. Diana, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100327305 | PHOTONIC STRUCTURES FOR EFFICIENT LIGHT EXTRACTION AND CONVERSION IN MULTI-COLOR LIGHT EMITTING DEVICES - A high efficiency light emitting diode (LED) comprised of a substrate, a buffer layer grown on the substrate (if such a layer is needed), a first active region comprising primary emitting species (PES) that are electrically-injected, a second active region comprising secondary emitting species (SES) that are optically-pumped by the light emitted from the PES, and photonic crystals, wherein the photonic crystals act as diffraction gratings to provide high light extraction efficiency, to provide efficient excitation of the SES, and/or to modulate the far-field emission pattern. | 12-30-2010 |
Giorgio Diana, Rodano IT
| Patent application number | Description | Published |
|---|---|---|
| 20090125251 | METHOD FOR DETERMINING A FORCE AT THE HUB OF A WHEEL OF A VEHICLE WHILE TRAVELING AND WHEEL SUITABLE FOR ALLOWING SAID METHOD TO BE CARRIED OUT - A method for determining the force at the hub of a wheel of a vehicle while traveling. The wheel includes a rim and at least one deformation sensor directly associated with the rim in at least one predetermined position and arranged according to at least one predetermined orientation. The method includes the steps of detecting at least one deformation component of the rim during travel through the at least one deformation sensor; applying to the at least one deformation component, during travel, a correlation parameter characteristic of the rim, between the force at the hub and the relative deformation of the rim to determine at least one force component at the hub correlated with the at least one deformation component of the rim. The determining of the correlation parameter preferably takes place through experimental tests that include the steps of providing a sample wheel having a rim substantially the same as that of the wheel and determining at least one correlation coefficient between at least one force component acting upon the sample wheel at the hub along at least one predetermined direction and at least one respective deformation component of the rim of the wheel. | 05-14-2009 |
Giovanni Diana, Rome IT
| Patent application number | Description | Published |
|---|---|---|
| 20110212895 | Treatment of Cognitive and Learning Impairment - Constitutive activators of Rho GTPases are useful in treating learning an cognitive disorders. | 09-01-2011 |
Marc Diana, Santa Monica, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110225082 | SYSTEM FOR IMPLEMENTING AUTOMATED OPEN MARKED AUCTIONING OF LEADS - In an automated leads-and-bids exchange system, bid profiles are defined to describe desires of lead buyers. Received leads are matched to active ones of the bid profiles whose specifications the leads substantially match. An auctioning subsystem finds the highest one or group of bids for each given lead. A quality rating database rates the quality of leads provided by different sellers. A price discounting engine discounts the amount paid to sellers who are rated as inferior sources of leads. | 09-15-2011 |
Morales Diana, Veradala, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20080274369 | Novel Ruthenium-Based Materials and Ruthenium Alloys, Their Use in Vapor Deposition or Atomic Layer Deposition and Films Produced Therefrom - An alloy for use in vapor deposition or atomic layer deposition is described herein that includes ruthenium and at least one element from group IV, V or VI of the Periodic Chart of the Elements or a combination thereof. In addition, a layered material is described herein that comprises at least one layer that includes a ruthenium-based material or ruthenium-based alloy and at least one layer that includes at least one element from group IV, V or VI of the Periodic Chart of the Elements or a combination thereof. | 11-06-2008 |