| Patent application number | Description | Published |
|---|
| 20080251932 | Method of forming through-silicon vias with stress buffer collars and resulting devices - A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed. | 10-16-2008 |
| 20080265391 | ETCHED INTERPOSER FOR INTEGRATED CIRCUIT DEVICES - In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer | 10-30-2008 |
| 20080303159 | Thin Silicon based substrate - Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die. | 12-11-2008 |
| 20090072013 | NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING - Nano-scale particle paste may be used for on-die routing and other applications using deposition and inkjet printing. A metal paste is applied to a surface of a die to electrically couple two spaced apart connection points of the die. Alternatively, or in addition, the paste may contain carbon nanotubes. The paste may be used on other surfaces as well. | 03-19-2009 |
| 20100193952 | Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion - A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix. | 08-05-2010 |
| 20110103438 | FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE - An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered. | 05-05-2011 |
| Patent application number | Description | Published |
|---|
| 20090028078 | Method and apparatus for providing security in a radio frequency identification system - A part can receive a communication that originates externally of the part, that conforms to a predetermined communications protocol, and that contains payload information consistent with the protocol but subject to a security provision supplemental to the protocol. The part extracts the payload information from the security provision. | 01-29-2009 |
| 20090028329 | Method and Apparatus for Providing Security in a Radio Frequency Identification System - A response to an event involves transmitting a communication for propagation away from a part externally thereof, the communication containing first and second segments that are respectively subject to first and second security provisions that are different. | 01-29-2009 |
| 20090028333 | Method and Apparatus for Providing Security in a Radio Frequency Identification System - One aspect involves receiving by a tag of wireless communications that utilize a first security provision, and wireless communications that utilize a second security provision different from the first security provision. A different aspect involves receiving by an entity of an authentication request that is based on a first digital certificate unknown to the entity, and determining by the entity, without external authentication of the first digital certificate, whether the first digital certificate is in a trust relationship with a second digital certificate that is different from the first digital certificate and that is known to the entity. | 01-29-2009 |
| 20090028334 | Method and Apparatus for Providing Security in a Radio Frequency Identification System - One aspect involves a communication that contains a portion encrypted with a selected key can be wirelessly transmitted by a part for reception and decryption by plural tags. A different aspect involves a tag receiving a first sequence of wireless communications that each contain sequencing information regarding the first sequence, while receiving a second sequence of wireless communications that each include sequencing information regarding the second sequence, and further involves monitoring the sequencing information from received communications of the first sequence while separately monitoring the sequencing information from received communications of the second sequence. | 01-29-2009 |
| 20090028337 | Method and Apparatus for Providing Security in a Radio Frequency Identification System - A method and apparatus involve storing in a tag a selected digital certificate that permits secure access to said tag from externally thereof. | 01-29-2009 |
