Patent application number | Description | Published |
20090123759 | Amphiphilic Block Copolymer-Toughened Epoxy Resins and Adhesives Made Therefrom - A curable adhesive epoxy resin composition including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms; in an amount such that when the epoxy resin composition is cured, the bond strength of the resulting cured epoxy adhesive resin composition increases compared to an epoxy resin composition without said amphiphilic polyether block copolymer; and (c) at least one curing agent. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer. | 05-14-2009 |
20090143544 | INTEGRATED CHEMICAL PROCESSES FOR INDUSTRIAL UTILIZATION OF SEED OILS - Integrated processes of preparing industrial chemicals starting from seed oil feedstock compositions containing one or more unsaturated fatty acids or unsaturated fatty acid esters, which are essentially free of metathesis catalyst poisons, particularly hydroperoxides; metathesis of the feedstock composition with a lower olefin, such as ethylene, to form a reduced chain olefin, preferably, a reduced chain α-olefin, and a reduced chain unsaturated acid or ester, preferably, a reduced chain α,ω-unsaturated acid or ester. The reduced chain unsaturated acid or ester may be (trans)esterified to form a polyester polyolefin, which may be epoxidized to form a polyester polyepoxide. The reduced chain unsaturated acid or ester may be hydroformylated with reduction to produce an α,ω-hydroxy acid or α,ω-hydroxy ester, which may be (trans)esterified with a polyol to form an α,ωpolyester polyol. Alternatively, the reduced chain unsaturated acid or ester may be hydroformylated with reductive amination to produce an α,ω-amino acid or α,ω-amino ester, which may be (trans)esterified to form an α,ω-polyester polyamine. | 06-04-2009 |
20100197848 | AMPHIPHILIC BLOCK COPOLYMERS AND INORGANIC NANOFILLERS TO ENHANCE PERFORMANCE OF THERMOSETTING POLYMERS - Curable compositions, cured compositions, and methods of forming the same, including an epoxy resin, a curing agent, an amphiphilic toughening agent, and an inorganic nanofiller, wherein the toughening agent forms a second phase having at least one dimension being on the nanometer scale. | 08-05-2010 |
20110058948 | WINDMILL PROPELLER BLADE AND METHOD OF MAKING SAME - A windmill blade which comprises reinforcing fibers in a toughened resin matrix. The resin matrix is made from a composition which comprises (a) one or more epoxy resins and/or one or more epoxy vinyl ester resins, (b) one or more reactive diluents, and (c) at least one amphiphilic block copolymer. The amphiphilic block copolymer comprises at least two different polyether blocks and is present in the composition in an amount of from about 0.5% to about 10% by volume, based on the total volume of the matrix composition. | 03-10-2011 |
20110098380 | POLYPHENOLIC COMPOUNDS AND EPOXY RESINS COMPRISING CYCLOALIPHATIC MOIETIES AND PROCESS FOR THE PRODUCTION THEREOF - Epoxy resins and mixtures of polyphenolic compounds which comprise cycloaliphatic moieties, processes for the production thereof and mixtures and cured products which comprise these resins and/or mixtures. | 04-28-2011 |
20120010330 | CURABLE COMPOSITIONS CONTAINING CYCLIC DIAMINE AND CURED PRODUCTS THEREFROM - A curable composition including (a) at least one cyclic diamine, (b) at least one non-heterocyclic amine that has a pKa value of approximately 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the cyclic diamine compared to the total amine hydrogens from both the cyclic diamine and the non-heterocyclic amine in the composition are greater than about 5%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition. | 01-12-2012 |
20120095133 | CORE/SHELL RUBBERS FOR USE IN ELECTRICAL LAMINATE COMPOSITIONS - Compositions, thermoset compositions, and methods of forming the same, including an epoxy resin, a curing agent, and a silicone-acrylate core/shell rubber are disclosed. | 04-19-2012 |
20120172493 | CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM - A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition. | 07-05-2012 |
20130115440 | COMPOSITES - Embodiments include methods of forming a composite. The methods can include providing a foam core, wherein the foam core includes a foam having a softening point of 90° C. to 110° C., covering a portion of the foam core with a prepreg, contacting the prepreg that covers the portion of the foam core with a curable composition, and curing the prepreg and the curable composition to form the composite, wherein the prepreg insulates the foam core during the curing so that the foam maintains a temperature that is below the softening point. Embodiments include a composite obtained by curing the prepreg and the curable composition. Embodiments include B-stageable formulation having a resin component and a hardener component. | 05-09-2013 |
20130210961 | Epoxy Composition with Crystallization Inhibition - An epoxy resin composition formed, at least in part, as the reaction product of a mixture comprising 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines, wherein each aromatic amine contains no more than two amine hydrogen atoms is provided. Also provided is a method of using the epoxy resin composition including incorporating the epoxy resin composition into a coating, an adhesive, a sealant, a casting, a laminate, or a composite. | 08-15-2013 |
20140114022 | CURABLE COMPOSITIONS - Embodiments of the present disclosure provide a curable composition having an epoxy resin component having an epoxide equivalent weight of 75 grams/equivalent to 210 grams/equivalent, an amine component having a hydrogen equivalent weight of 18 grams/equivalent to 70 grants/equivalent, and an acrylate component having an acrylate equivalent weight of 85 grams/equivalent to 160 grams/equivalent, wherein the acrylate component is 1 part per hundred parts epoxy resin to less than 5 parts per hundred parts epoxy resin. | 04-24-2014 |
20140357802 | TOUGHENING AGENT FOR EPOXY THERMOSET - An epoxy thermoset that includes a reaction product of a toughening agent prepared from a reaction of a first epoxy resin and a polyether polyamine, a second epoxy resin and a liquid amine hardener for the toughening agent and the second epoxy resin. The toughening agent is an adduct of the second epoxy resin and the polyether polyamine. The polyether polyamine phase of the toughening agent separates to form particles in the epoxy thermoset, where the particles have a volume average diameter in a range from 20 nanometers to 200 nanometers. | 12-04-2014 |
Patent application number | Description | Published |
20110293041 | Receiver Resistor Network for Common-Mode Signaling - A receiver circuit to receive signals from first and second pairs of transmission lines includes first and second interfaces, each with first and second input nodes to receive respective signals. The receiver circuit also includes a resistor network with first, second, third, and fourth resistive elements. The first and second resistive elements are each connected between the input nodes of a respective interface. The third and fourth resistive elements each include a pair of resistors connected in series between the input nodes of a respective interface, and an intermediate node between the resistors. The intermediate nodes are connected to an AC ground. The receiver circuit further includes a differential amplifier with first and second inputs coupled respectively to the first and second interfaces and an output to provide a signal derived from common mode components of the signals received at the input nodes. | 12-01-2011 |
20120025800 | VOLTAGE MODE TRANSMITTER EQUALIZER - A voltage mode transmitter equalizer has high efficiencies, yet consumes substantially constant supply current from the power supply and provides constant back-match impedance. The voltage mode transmitter equalizer is configured such that the output voltage of the signal to be output on a pair of transmission lines can be controlled according to the input data, but its return impedance is substantially matched to the differential impedance of the transmission lines and it draws substantially constant supply current from the power supply regardless of the output voltage of the signal. Further, an equalizer for a voltage-mode transmitter provides fine-granularity equalization settings by employing a variable pull-up conductance and a variable pull-down conductance. Conductance is varied by selectively enabling a plurality of conductance channels, at least some of which have resistance values that are distinct from one another. | 02-02-2012 |
20130249612 | METHOD AND APPARATUS FOR SOURCE-SYNCHRONOUS SIGNALING - A low-power, high-performance source-synchronous chip interface which provides rapid turn-on and facilitates high signaling rates between a transmitter and a receiver located on different chips is described in various embodiments. Some embodiments of the chip interface include, among others: a segmented “fast turn-on” bias circuit to reduce power supply ringing during the rapid power-on process; current mode logic clock buffers in a clock path of the chip interface to further reduce the effect of power supply ringing; a multiplying injection-locked oscillator (MILO) clock generator to generate higher frequency clock signals from a reference clock; a digitally controlled delay line which can be inserted in the clock path to mitigate deterministic jitter caused by the MILO clock generator; and circuits for periodically re-evaluating whether it is safe to retime transmit data signals in the reference clock domain directly with the faster clock signals. | 09-26-2013 |
20140347108 | METHOD AND APPARATUS FOR SOURCE-SYNCHRONOUS SIGNALING - A low-power, high-performance source-synchronous chip interface which provides rapid turn-on and facilitates high signaling rates between a transmitter and a receiver located on different chips is described in various embodiments. Some embodiments of the chip interface include, among others: a segmented “fast turn-on” bias circuit to reduce power supply ringing during the rapid power-on process; current mode logic clock buffers in a clock path of the chip interface to further reduce the effect of power supply ringing; a multiplying injection-locked oscillator (MILO) clock generator to generate higher frequency clock signals from a reference clock; a digitally controlled delay line which can be inserted in the clock path to mitigate deterministic jitter caused by the MILO clock generator; and circuits for periodically re-evaluating whether it is safe to retime transmit data signals in the reference clock domain directly with the faster clock signals. | 11-27-2014 |